Wednesday, 02 April,
15:15
–
16:15
Theater II
As high-performance computing (HPC) and artificial intelligence (AI) applications push the boundaries of system performance, platform architects look for any advantage to further optimize the network. Interconnects serve as the backbone for data transfer between processors, memory, and other components, influencing the overall system performance. From the confidence of copper solutions to the promise of optical opportunities, Amphenol is one of the world’s largest suppliers of high-technology connectors, cabling, sensor, and antenna products. This presentation will explore the evolving landscape of interconnect technologies, discussing the advantages and challenges of both copper and optical interconnects in the context of HPC and AI applications
Presented By
Speaker
Samuel Kocsis, Director of Standards and Technology at Amphenol, United States
About Samuel Kocsis:
Sam Kocsis currently holds the role of Director of Standards and Technology at Amphenol, focusing on the proliferation of innovative interconnect solutions. Sam coordinates Amphenol’s engagement strategies in various industry standards and consortiums across networking, server/storage, optics, and commercial markets. He is active in IEEE 802.3, OIF, and OCP projects, and is currently a co-chair of the OSFP MSA and chairman of the PCI SIG Cabling Workgroup. Sam holds BSEE and MSEE degrees from the University of Rochester, in Rochester, New York.