• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

Ethernet Interconnect Solutions: Will The Advancement in Coherent Signaling Leverage DataCom Connect

Wednesday, 27 March, 10:15 – 11:15

Theater II

Session Description:

The completion of Ethernet’s milestone 100Gb/lane specification supports the use cases for higher throughput and port density. The rapid market penetration of 50Gb/ln, and now 100Gb/ln electrical signaling, supports the growing demand for 400GbE and 800GbE communications solutions. Coherent based communications have long been deployed in the Telecom space as means to optimize long-haul transmission and increase bit per baud efficiencies. 

To achieve reliable connections and data transit, the datacenter has embraced coherent signaling technology for deployment in datacenter modules.  Ethernet datacenters have adopted coherent signaling in full effect for 400G, 800G, and soon 1.6T Ethernet, in OSFP, QSFP-DD, and CFP packages.

The panel will cover the considerations when designing and deploying coherent optical solutions, the increasing power and cooling demands, and advances in PIC and other technologies needed to create interoperable products and leverage economies of scale for simultaneous datacom and telecom applications.

Organized by:



David Rodgers, Ethernet Alliance Events Chair, EXFO, United States


Brad Booth, Hyper Photonix Technical Advisor, United States

Dr. Tony Chan Carusone, Chief Technology Officer, Alphawave Semi, Canada

Leo Lin, Director, NEMs Manufacturing Design & Research, EXFO, Canada