• Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

Enabling Next Generation Co-Packaging Solutions

Thursday, 09 March, 12:15 – 13:15

Theater II

Session Description
Co-packaging is one of the hot buttons of the technology sector. OIF is addressing the need for standardized co-packaged optics solutions to address the power constraints and increased bandwidth density needs of data centers, enable new architectures and applications, and support multivendor interoperability. In this session, a panel of OIF experts will review co-packaged optics standards that are emerging across a range of applications and use cases. The presentations will highlight the technical challenges and OIFs™ standardization solutions to help accelerate market adoption of this critical technology.

Organized by: 


Jeff Hutchins, OIF Physical & Link Layer Working Group Co-Packaging Vice Chair and Board Member, CTO Office, Ranovus, USA


Jeff Hutchins, CTO Office, Vice Chair, OIF Physical & Link Layer Working Group Co-Packaging, USA

Kenneth Jackson, Product Marketing Director, Sumitomo Electric Device Innovations, USA

Yi Tang, Principal Hardware Engineer, Cisco, USA

Nathan Tracy, System Architecture Team & Manager of Industry Standards, TE Connectivity, OIF MA&E Committee Chair, PLL, USA

Richard Ward, Chief Technologist Data Connectivity, Astera Labs, USA