• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  05 – 09 March 2023
  • Exhibition: 07 – 09 March 2023
  • San Diego Convention Center, San Diego, California, USA

Enabling Next Generation Co-Packaging Solutions

Thursday, 09 March, 12:15 – 13:15

Theater II


Session Description:
Co-packaging is one of the hot buttons of the technology sector. OIF is addressing the need for standardized co-packaged optics solutions to address the power constraints and increased bandwidth density needs of data centers, enable new architectures and applications, and support multivendor interoperability. In this session, a panel of OIF experts will review co-packaged optics standards that are emerging across a range of applications and use cases. The presentations will highlight the technical challenges and OIFs™ standardization solutions to help accelerate market adoption of this critical technology.

 

Organized by: 

Panelists

Jeff Hutchins, CTO Office, Vice Chair, OIF Physical & Link Layer Working Group CO-Packaging, USA

Kenneth Jackson, Product Marketing Director, Sumitomo Electric Device Innovations, USA

Nathan Tracy, System Architecture Team and Manger of Industry Standards, TE Connectivity, USA

Richard Ward, VP/GM Data Connectivity, Astera Labs, USA