Thursday, 09 March,
Co-packaging is one of the hot buttons of the technology sector. OIF is addressing the need for standardized co-packaged optics solutions to address the power constraints and increased bandwidth density needs of data centers, enable new architectures and applications, and support multivendor interoperability. In this session, a panel of OIF experts will review co-packaged optics standards that are emerging across a range of applications and use cases. The presentations will highlight the technical challenges and OIFs™ standardization solutions to help accelerate market adoption of this critical technology.
Jeff Hutchins, OIF Physical & Link Layer Working Group Co-Packaging Vice Chair and Board Member, CTO Office, Ranovus, USA
Jeff Hutchins, CTO Office, Vice Chair, OIF Physical & Link Layer Working Group Co-Packaging, USA
Kenneth Jackson, Product Marketing Director, Sumitomo Electric Device Innovations, USA
Yi Tang, Principal Hardware Engineer, Cisco, USA
Nathan Tracy, System Architecture Team & Manager of Industry Standards, TE Connectivity, OIF MA&E Committee Chair, PLL, USA
Richard Ward, Chief Technologist Data Connectivity, Astera Labs, USA