• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

Will Heterogeneous Integration Meet the Needs of Future Applications?

Room: TBD

Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption. It fosters the creation of new optical products that serve new applications with more demanding performance requirements. In this session, we explore how well (and when) the various approaches to heterogeneous integration will meet these challenging needs., and the status and challenges for the service providers (e.g., type of integration platforms, process/tools maturity, and how to handle non-traditional Si materials).


Lukas Chrostowski, University of British Columbia, Canada

Patrick Lo, Advanced Micro Foundry, Singapore

Dan Pitt, Palo Alto Innovation Advisors, United States

Mengjie Yu, University of Southern California, United States


Alex Chikhaoui, X-Celeprint, Ireland

Robert Kalman, Avicena, United States

Michael Lebby, Lightwave Logic, United States

Sylvie Menezo, Scintil, France

Edward Preisler, Tower Semiconductor, United States

Günther Roelkens, Ghent University, Belgium

Mian Zhang, Hyperlight, United States