San Diego Convention Center
Eleni Diamanti, CNRS, France
Michael Kues, Univ. of Hannover, Germany
Cheryl Sorace-Agaskar, MIT Lincoln Laboratory, USA
Michael Vasilev, Univ. of Texas at Arlington, USA
Jianwei Wang, Peking Univ., China
Rui Wang, Univ. of Bristol, UK
Recent advancements in quantum technology have led to the transition from lab-scale demonstrations to practical applications. Quantum technologies, including quantum communication and cryptography, quantum random number generation, and quantum processing accessible on the cloud, have gradually matured to provide commercial services. Photonic Integrated Circuits (PICs) have emerged as a crucial technology for quantum communication and computing due to their compact size, robustness, and ability to accommodate multiple elements on a single chip. Various PIC platforms are being developed to enable different quantum modalities and architectures. However, significant progress is still needed regarding hybrid integration to expand and mature PIC platforms, as well as the development of supporting infrastructure (electronic control, packaging, etc.) for leveraging PICs in quantum communication and computing systems. This symposium will focus on the potential benefits of PICs in these applications, the field's current state, including desired system architectures, and the key challenges in PIC development that need to be overcome.
Key questions that this symposium aims to discuss include:
- How can PICs accelerate the development of photonic-based quantum technologies?
- Will PICs be the solution for complex quantum information processing and what are the critical challenges in realizing large-scale photonic chips?
- How can PIC chips and integrated systems contribute to developing a quantum internet? Will it play a central role?
- What would be the commercially available and sustainable business model for PIC development suitable for quantum systems and networks?
- Can a viable supply chain for quantum PICs at a global scale be envisioned?
- Can photonic-electronic co-packaging offer advantages for enabling hybrid quantum chips?
This symposium will delve into these questions, focusing specifically on the role of PICs in quantum technologies. The first session will discuss PICs for quantum communication, followed by a panel discussion. The second session will explore photonic integration technologies for quantum computing and quantum interconnect, concluding with a panel discussion.
Session I: Photonics Integration for Quantum Communications.
This session will provide a broad overview and in-depth discussions of key emerging research areas, including PIC for quantum communications and quantum memories. The scope is to leverage the advances of PICs to explore the capabilities enabled by this technology and identify the benefits and challenges in achieving quantum communication devices and systems compatible with existing telecom technologies. The panel will discuss the current state of the art, the key research challenges and the perspective from industry and foundries on developing applications and services with a quantum advantage.
Session II: Photonics Integration for Quantum Computing and Quantum Interconnects
This session will explore another set of research areas - PICs for quantum computing and quantum interconnects. The talks will cover PICs for photonics-based quantum computers, quantum transducer technologies for interfacing flying qubits and matter qubits, and novel PIC architectures for non-photonics-based quantum computing. The panel will discuss recent research advancements in these areas, development and vision from the relevant industry, and challenges ahead to realize useful quantum computing.