• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

Cutting-Edge Technologies for Interconnecting AI/ML Clusters

Tuesday, 26 March, 16:30 – 18:30

Room 6E

The rapid evolution of artificial intelligence (AI) and machine learning (ML) has led to the development of increasingly complex and sophisticated AI/ML clusters. These clusters are composed of interconnected nodes working collaboratively to process vast amounts of data and perform intricate computations. This panel will explore the strategies and technologies that enable seamless communication and cooperation within these clusters, with an emphasis on low latency and power efficiency. Bringing together experts from academia and industry, the panel will delve into the challenges and solutions associated with creating robust, high-performance interconnections that optimize performance and efficiency of AI/ML systems.


Brandon Buscaino, Ciena, United States

Norman Swenson, Infinera, United States

Qiong Zhang, Amazon, United States


Keren Bergman, Columbia University, United States

Larry Dennison, NVIDIA, United States

Jeff Hutchins, Ranovus, United States

Bardia Pezeshki, Avecina Tech, United States

Rajiv Pancholy, Broadcom, United States

Sean Park, Point2 Technology, United States