• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

Cutting-Edge Technologies for Interconnecting AI/ML Clusters

Room: TBD

The rapid evolution of artificial intelligence (AI) and machine learning (ML) has led to the development of increasingly complex and sophisticated AI/ML clusters. These clusters are composed of interconnected nodes working collaboratively to process vast amounts of data and perform intricate computations. This panel will explore the strategies and technologies that enable seamless communication and cooperation within these clusters, with an emphasis on low latency and power efficiency. Bringing together experts from academia and industry, the panel will delve into the challenges and solutions associated with creating robust, high-performance interconnections that optimize performance and efficiency of AI/ML systems.


Brandon Buscaino, Ciena, United States

Norm Swenson, Norman Swenson Consulting, United States

Qiong Zhang, Amazon, United States


Keren Bergman, Columbia University, United States

Jeff Hutchins, Ranovus, United States

Rob Kalman, Avecina Tech, United States

Near Margalit, Broadcom Corporation, United States

Sean Park, Point2 Technology, United States