Devices, Optical Components, and Fiber
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D1: Advanced Prototyping, Packaging and Integration
Jon Aday, Amkor Technology, USA
Tradeoffs in the Paths Forward for Advanced Packaging in Photonics
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D2: Passive Components
Tomoyuki Akiyama, Fujitsu Limited, Japan
Tutorial on Silicon Photonics Applications
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Arnan Mitchell, Royal Melbourne Institute of Technology, Australia
Thin Film Lithium Niobate Integrated Circuits - A Tutorial Introduction and Overview
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D4: Fibers and Propagation Physics
Joel Villatoro, University of the Basque Country UPV/EHU, Spain
Optical Sensing with Specialty Fibers
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D5: Fiber Devices, Fiber Lasers and Amplifiers, and Nonlinear Waveguides
Toshihiko Baba, Yokohama National University, Japan
Solid State LIDAR
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