Technical Conference: 07 - 11 March 2027
Exhibition: 09 - 11 March 2027
Los Angeles Convention Center | Los Angeles, California, United States

Technical Conference: 07 - 11 March 2027
Exhibition: 09 - 11 March 2027
Los Angeles Convention Center | Los Angeles, California, United States

OneTouch Technology showcases HISP Technology Platform at OFC 2026

19 March 2026

OneTouch Technology showcases HISP Technology Platform at OFC 2026

Foundry-agnostic heterogeneous silicon photonics platform combines TFLN/TFLT performance with commercial SiPh scalability

Los Angeles — 19th March, 2026: OneTouch Technology is showcasing HISP™ (Heterogeneously Integrated Silicon Photonics) platform at OFC 2026, demonstrating a platform that combines the class-leading electro-optic performance of Thin-Film Lithium Niobate (TFLN) aiming towards manufacturing scale of commercial silicon photonics.

HISP™ is a foundry-agnostic integration platform that implementing a TFLN high-speed modulator together with silicon photonics technology, enabling electro-optic performance beyond 110 GHz bandwidth together with ultra-low insertion loss on established 8-inch and 12-inch wafer infrastructure.

The platform is designed for applications where performance headroom is critical, including next-generation pluggables, high-speed coherent transceivers, and co-packaged optics for datacenter and telecom networks.

At the core of HISP™ is OneTouch Technology’s proprietary collective die-to-wafer bonding approach, which interfaces unpatterned LNOI or LTOI material onto silicon photonics wafers before structuring. This process supports a clean bond interface, improved manufacturability, and a more scalable path to production than conventional approaches based on individually transferred processed dies.

“OneTouch Technology’s HISP process eliminates the historic trade-off between photonic performance and CMOS-compatible scalable manufacturing,” said Dr. Lee Crudgington, Director of Business Development at OneTouch Technology. “We will be delighted to discuss how the platform supports next-generation datacenter and telecom optical infrastructure.”

Alongside its class-leading optical modulator technology, OneTouch Technology provides fully customisable optical fibre arrays and supplies unprocessed Thin-Film Lithium Niobate (TFLN) and Thin-Film Lithium Tantalate (TFLT) wafer materials to customers across Europe.

OFC 2026 attendees can learn more about HISP™ and OneTouch Technology’s heterogeneous integration approach at OFC booth 5133, in the West Hall. Additional information is available at https://onetouch-technology.com/