05 March 2026
LightSpeed Photonics launches Industry’s First “Solderable” Near Packaged Optical Interconnect Technology
- Lightspeed Photonics has the world’s first solderable VCSEL-based optical interconnects that are compact, low power, and can be kept near the ASICs.
- The new “NPO” is positioned as the “Goldilocks” solution between CPO and LPO with less power, featuring tiny footprint, soldered near-chip enable faster data processing
- LightSpeed Photonics CEO, Rohin Y, to speak on the topic of near-packaged optics on March 19 at OFC Conference
In addition, Rohin Y, founder and CEO of LightSpeed Photonics, will present in a session on Thursday, March 19, 2026, at 1:45 pm in Expo Theatre III, on the topic of Near Packaged Optics: The Practical Path Beyond CPO. The presentation is open to all attendees of the conference.
Driven to enable data centers with at least 10 times the data-processing capability of current market solutions, LightSpeed Photonics has developed a solderable optical interconnect that combines lower power, a smaller footprint and faster data processing.
Data centers must provide scalable, high bandwidth connectivity to ensure low-latency, high-throughput data transfers to support immense data traffic and large networking infrastructures. LPO-based current market solutions rely on pluggable transceivers that lack scalability, sit far from the motherboard chip affecting signal integrity and require bulky connectors. CPO value-proposition is marred by manufacturing and scalability issues that require expensive major infrastructure revamp. Addressing this market gap, LightSpeed Photonics has developed its LightKonnect™ , the next-generation optical interconnects that are compact, solderable, low-power with high-bandwidth, resulting in reliable, off-the-shelf components with faster time to market. Their flagship offering provides 400Gbps (4 ch x 100G) in a mere 9mm x 9mm QFN footprint for simplest possible integration at the board-level.
“The interconnect integration at the board-level remains a major pain point in system architects design to support next generation computing,” said Rohin Y. “By rethinking interconnect architecture and working closely with partners such as chipmakers, ODMs, OEMs and design houses, we’re accelerating data processing and delivering a new level of efficiency in data center hardware performance.”
Beyond data centers, the company’s LightKonnect technology extends to applications in telecommunication and 5G hardware, industry 4.0, near-edge computing and optical interconnect solutions.
For more information visit www.lightspeedphotonics.com.
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About LightSpeed Photonics
Headquartered in Singapore, LightSpeed Photonics was founded in 2021 with a singular focus: to address the "data movement bottleneck" that was becoming the critical limiting factor in AI and high-performance computing. The company began with a bold vision — integrating processors with high-speed optics to build modular "compute + interconnect" heterogeneous systems-in-package. This approach would allow data to move as light, dramatically reducing latency and power consumption.
CONTACT:
Frank Buscemi
MBE Group on behalf of Lightspeed Photonics
fbuscemi@mbe.group
248.856.8636