17 March 2026
HYC Showcases Multi-Core Fiber and CPO Interconnect Solutions at OFC 2026
As Artificial Intelligence (AI) and High-Performance Computing (HPC) continue to drive rapid increases in computing density and bandwidth demand, optical interconnect technologies are evolving toward higher integration, higher channel counts, and greater reliability.
From March 17–19 at OFC 2026, HYC will present its multi-core fiber (MCF) product portfolio, optical interconnect solutions for Co-Packaged Optics (CPO), and ultra-high-fiber-count MMC patch cords, showcasing passive optical solutions designed to support next-generation AI infrastructure and high-speed optical interconnect architectures.
MCF Portfolio
Leveraging multiple proprietary technology platforms, HYC has developed a comprehensive range of MCF passive optical subassemblies, including MCF Fan-In/Fan-Out (FIFO), MCF patch cords, MCF Fiber Array Units (FAUs), and MCF hybrid assemblies, providing critical optical interconnect building blocks for emerging multi-core fiber transmission systems.
MCF FIFO components play a key role in enabling efficient coupling between multi-core fibers and single-core fibers. HYC provides three technical implementation platforms for MCF FIFO: 3D Waveguide (Femtosecond Laser Direct Writing), Bundle, and Space Optics. HYC provides MCF FIFO for transceivers and external applications, enabling flexible customization to meet different customer application needs. Live demonstrations will also be presented at the exhibition.
Optical Interconnect Solutions for CPO
HYC provides one-stop passive optical solutions for CPO applications, including high-precision-pitch FAUs, fiber shuffles, and other components.
The high-precision-pitch FAU is designed for CPO systems and features a hybrid Polarization-Maintaining Fiber (PMF) + Single-Mode Fiber (SMF) architecture, supporting high-density, multi-channel, and polarization-stable optical coupling. Leveraging proprietary manufacturing processes, the FAU maintains precise pitch accuracy even at high channel counts, also achieves a high Polarization Extinction Ratio (PER), and meets GR468 and GR1221 reliability standards.
High-Density Fiber Connectivity for Hyperscale AI Data Centers
HYC has mature large-scale manufacturing capabilities for high-fiber-count patch cords, offering solutions terminated with MMC, MTP, and other interfaces.
From MCF subassemblies, to CPO interconnect solutions, and ultra-high-density fiber connectivity, HYC continues to focus on the evolving requirements of next-generation AI and high-performance computing systems.
During OFC 2026, HYC looks forward to engaging with industry partners to explore the latest developments and application scenarios of multi-core fiber and CPO optical interconnect technologies.
OFC 2026
Booth: #1149 (South Hall)
Date: March 17–19, 2026
About HYC
HYC Co., Ltd (HYC), founded in 2000, specializes in providing customers with integrated R&D, manufacturing, sales, and service solutions for high-performance passive optical components. The company primarily manufactures and sells fiber connectivity (MMC/MTP/MPO assemblies), optical subassemblies for high-speed transceivers and CPO, multi-core fiber subassemblies, PLC splitters, and WDM. Its products are widely used in fields such as AI, Hyperscale Data Centers, Cloud Computing, and 5G/6G high-speed communications.