12 March 2026
FIBERSTAMP to Showcase 1.6T DR16 NPO SiPh, 800G HYBRID & O-Band 400G DWDM4 Solutions at OFC 2026
Singapore, March 12, 2026 — FIBERSTAMP, a provider of optical networking solutions, will showcase its latest innovations at OFC 2026, featuring live demonstrations of its 1.6T DR16 NPO Silicon Photonics Engine, a portfolio of 800G HYBRID interconnect solutions, and the newly developed O‑Band 400G DWDM4 optical modules and subsystems. These technologies address the growing demand for high-bandwidth, energy-efficient, and cost-effective interconnects in AI clusters, hyperscale data centers, and next-generation networks.
FIBERSTAMP Booth: #2416
1.6T DR16 NPO Silicon Photonics Engine — Live Demonstration
The 1600G NPO DR16 Silicon Photonics Engine integrates a linear direct-drive architecture that removes the need for digital signal processors (DSPs), reducing system-level power consumption and cost. The engine delivers robust optical performance, with a typical TDECQ of 2.2 dB and full compliance with IEEE 802.3bs DR4 standards, while maintaining strong receiver sensitivity across all channels.
Key Features:
- 16 × 100G PAM4 architecture
- Supports up to 500 m transmission
- Power consumption < 16 W
- EL-OSFP external laser source module
- Front-panel optical interface
- Supports 8-channel CWL high-power lasers
800G HYBRID Interconnect Solutions — Product Showcase
FIBERSTAMP’s 800G HYBRID Interconnect Solutions balance power consumption, latency, cost, and signal quality. By using DSPs on only half of the channels, HYBRID modules achieve improved energy efficiency and reduced latency without sacrificing performance.
HYBRID Architecture Advantages:
Power reduction of ~20–30% compared to full-DSP solutions
Ultra-low latency (50% fewer DSPs)
Controllable signal quality: Multimode 50 m PRE-FEC BER E-7/E-8; Single-mode 500 m PRE-FEC BER E-10
Optimized cost: ~20% system cost reduction
Supports higher density pluggable modules (16CH / 3.2T)
O-Band 400G DWDM4 Modules — Cost-Efficient DCI Solutions
FIBERSTAMP’s O-Band 400G DWDM4 optical modules and subsystems leverage the 1310 nm zero-dispersion window for direct-detect DCI applications over 10–30 km. Eliminating the need for dispersion compensation modules (DCMs), these solutions reduce power consumption, simplify system design, and minimize latency.
The demonstration features a complete system including a 400G DCI chassis, 400G QSFP-DD OEO line cards, and 200 GHz O-Band DWDM MUX/DEMUX modules, illustrating how the O-Band architecture can cut network deployment costs by up to 50%.
Visit FIBERSTAMP at OFC 2026
Visit FIBERSTAMP at OFC 2026 (Booth #2416) for live demonstrations and to learn how its optical interconnect technologies deliver next-generation performance and efficiency. For more information or to schedule a meeting, contact sales@fiberstamp.com.
About FIBERSTAMP
As an open optical network mail carrier, FIBERSTAMP provides global users with economic, professional, and efficient open optical network solutions. Its product portfolio includes 25G/50G/100G/200G/400G/800G optical transceiver modules, Active Optical Cables (AOCs), Direct Attached Cables (DACs), 100G/200G/400G coherent optical modules, and UHD video transmission solutions. Through sustained investment in new technologies, FIBERSTAMP is advancing into the era of 1600G and CPO solutions based on Silicon Photonics, positioning itself at the forefront of next-generation optical networking.