Thursday, 03 April,
10:15
–
10:45
Theater III
We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, thickness uniformity, and exceptional stability, NGK’s wafers contribute to launching new markets for optical communication applications.
Presented By
Speaker
Tomoyoshi Tai, Manager, NGK Insulators, Japan