Get insights from industry leaders as they present and explain their cutting-edge technologies. All attendees can attend the Technology Showcases. During the Exhibition, meet with these exhibitors one-on-one to learn more about their new products.
Tuesday, 01 April, 12:15 – 12:45 PST (UTC-8:00)
Theater III
Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.
Broadcom
Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.
Speaker
- Karl Muth, Systems Architect, USA
Presented By
Presented By
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Tuesday, 01 April, 13:00 – 13:30 PST (UTC-8:00)
Theater III
AI and its insatiable demand for power are driving a modular, distributed data center construction boom. In parallel, data center interconnect traffic exceeds 50% annual growth. Join us as we discuss the evolution of open optical networking to support hyperscale connectivity at the intersection of AI and photonics.
Infinera
AI and its insatiable demand for power are driving a modular, distributed data center construction boom. In parallel, data center interconnect traffic exceeds 50% annual growth. Join us as we discuss the evolution of open optical networking to support hyperscale connectivity at the intersection of AI and photonics.
Speakers
- Tim Doiron, VP Solution Marketing, Infinera, USA
- Harshad Sardesai, VP Product Management, Infinera, USA
Presented By
Presented By
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Wednesday, 02 April, 10:15 – 10:45 PST (UTC-8:00)
Theater III
Vital provides comprehensive solutions across applications and industries spanning Thin Films, Infrared Lasers & Photodetectors, Compound Semiconductors, Functional materials, and Recycling. The presentation showcases essential developments for semiconductor devices and fiber lasers for welding applications. We will present data on high-p...
Vital Materials Co., Limited
Vital provides comprehensive solutions across applications and industries spanning Thin Films, Infrared Lasers & Photodetectors, Compound Semiconductors, Functional materials, and Recycling. The presentation showcases essential developments for semiconductor devices and fiber lasers for welding applications. We will present data on high-power fiber Lasers.
Speaker
- Prasanta Modak, VP - Laser Technology Development, Vital Materials Co., Limited, USA
Presented By
Presented By
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Wednesday, 02 April, 11:00 – 11:30 PST (UTC-8:00)
Theater III
AI is booming and demands increasing data bandwidth, thus leading to extreme signal loss control, powerful DSP, and complex system design. AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc.
AI is booming and demands increasing data bandwidth, thus leading to extreme signal loss control, powerful DSP, and complex system design. AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc.
Speaker
- Mily Hu, Director, Business Development & Application Strategy BU ES, China
Presented By
Presented By
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Wednesday, 02 April, 15:00 – 15:30 PST (UTC-8:00)
Theater III
Arrayed Fiberoptics has introduced a new range of fiber optic connector products, including non-contact fiber connectors and initially loose MPO, to address the new pain points in AI data centers.
Arrayed Fiberoptics has introduced a new range of fiber optic connector products, including non-contact fiber connectors and initially loose MPO, to address the new pain points in AI data centers.
Speaker
- Benjamin Jian, President, Arrayed Fiberoptics, USA
Presented By
Presented By
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Thursday, 03 April, 10:15 – 10:45 PST (UTC-8:00)
Theater III
We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, uniform thickness, and exceptional stability, NGK’s wafers contribute to launching ne...
We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, uniform thickness, and exceptional stability, NGK’s wafers contribute to launching new markets for optical communication applications.
Speaker
- Tomoyoshi Tai, Manager, NGK Insulators, Japan
Presented By
Presented By
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