• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

Technology Showcases

Registration Area (2018)  

A Showcase for New Products

Get insights from industry leaders as they present and explain their cutting-edge technologies. All attendees can attend the Technology Showcases. During the Exhibition, meet with these exhibitors one-on-one to learn more about their new products. 

 

Tuesday, 01 April, 12:15 – 12:45 PST (UTC-8:00)

Theater III

Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.

Presented By

Broadcom

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Tuesday, 01 April, 13:00 – 13:30 PST (UTC-8:00)

Theater III

AI and its insatiable demand for power are driving a modular, distributed data center construction boom. In parallel, data center interconnect traffic exceeds 50% annual growth. Join us as we discuss the evolution of open optical networking to support hyperscale connectivity at the intersection of AI and photonics.

Presented By

Infinera

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Wednesday, 02 April, 10:15 – 10:45 PST (UTC-8:00)

Theater III

Vital provides comprehensive solutions across applications and industries spanning Thin Films, Infrared Lasers & Photodetectors, Compound Semiconductors, Functional materials, and Recycling. The presentation showcases essential developments for semiconductor devices and fiber lasers for welding applications. We will present data on high-p...

Presented By

Vital Materials Co., Limited

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Wednesday, 02 April, 11:00 – 11:30 PST (UTC-8:00)

Theater III

AI is booming and demands increasing data bandwidth, thus leading to extreme signal loss control, powerful DSP, and complex system design. AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc.

Presented By

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Wednesday, 02 April, 15:00 – 15:30 PST (UTC-8:00)

Theater III

Arrayed Fiberoptics has introduced a new range of fiber optic connector products, including non-contact fiber connectors and initially loose MPO, to address the new pain points in AI data centers.

Presented By

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Thursday, 03 April, 10:15 – 10:45 PST (UTC-8:00)

Theater III

We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, uniform thickness, and exceptional stability, NGK’s wafers contribute to launching ne...

Presented By

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