Get insights from industry leaders as they present and explain their cutting-edge technologies. All attendees can attend the Technology Showcases. During the Exhibition, meet with these exhibitors one-on-one to learn more about their new products.
Tuesday, 01 April, 12:15 – 12:45 PT (UTC-7:00)
Theater III
Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.
Broadcom
Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.
Speaker
- Anand Ramaswamy, Solutions Architect, Broadcom, USA
Presented By
Presented By
[top]
Tuesday, 01 April, 13:00 – 13:30 PT (UTC-7:00)
Theater III
AI and its insatiable demand for power are driving a modular, distributed data center construction boom. In parallel, data center interconnect traffic exceeds 50% annual growth. Join us as we discuss the evolution of open optical networking to support hyperscale connectivity at the intersection of AI and photonics.
Infinera
AI and its insatiable demand for power are driving a modular, distributed data center construction boom. In parallel, data center interconnect traffic exceeds 50% annual growth. Join us as we discuss the evolution of open optical networking to support hyperscale connectivity at the intersection of AI and photonics.
Speakers
- Tim Doiron, VP Solution Marketing, Infinera, USA
- Harshad Sardesai, VP Product Management, Infinera, USA
Presented By
Presented By
[top]
Wednesday, 02 April, 10:15 – 10:45 PT (UTC-7:00)
Theater III
Vital provides comprehensive solutions across applications and industries spanning Thin Films, Infrared Lasers & Photodetectors, Compound Semiconductors, Functional materials, and Recycling. The presentation showcases essential developments for semiconductor devices and fiber lasers for welding applications. We will present data on high-p...
Vital Materials Co., Limited
Vital provides comprehensive solutions across applications and industries spanning Thin Films, Infrared Lasers & Photodetectors, Compound Semiconductors, Functional materials, and Recycling. The presentation showcases essential developments for semiconductor devices and fiber lasers for welding applications. We will present data on high-power fiber Lasers.
Speaker
- Prasanta Modak, VP - Laser Technology Development, Vital Materials Co., Limited, USA
Presented By
Presented By
[top]
Wednesday, 02 April, 11:00 – 11:30 PT (UTC-7:00)
Theater III
AI is booming and demands increasing data bandwidth, thus leading to extreme signal loss control, powerful DSP and complex system design. AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc.
AI is booming and demands increasing data bandwidth, thus leading to extreme signal loss control, powerful DSP and complex system design. AT&S's advanced circuit board empowers such high-speed solutions in all types of optical interconnects, e.g., pluggable, OBO, Co-Packaged, non-standard form factor, etc.
Speaker
- Mily Hu, Director, Business Development & Application Strategy BU ES, China
Presented By
Presented By
[top]
Wednesday, 02 April, 15:00 – 15:30 PT (UTC-7:00)
Theater III
Arrayed Fiberoptics has introduced a new range of fiber optic connector products, including non-contact fiber connectors and initially loose MPO, to address the new pain points in AI data centers.
Arrayed Fiberoptics has introduced a new range of fiber optic connector products, including non-contact fiber connectors and initially loose MPO, to address the new pain points in AI data centers.
Speaker
- Benjamin Jian, President, Arrayed Fiberoptics, USA
Presented By
Presented By
[top]
Thursday, 03 April, 10:15 – 10:45 PT (UTC-7:00)
Theater III
We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, thickness uniformity, and exceptional stability, NGK’s wafers contribute to laun...
We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, thickness uniformity, and exceptional stability, NGK’s wafers contribute to launching new markets for optical communication applications.
Speaker
- Tomoyoshi Tai, Manager, NGK Insulators, Japan
Presented By
Presented By
[top]
Thursday, 03 April, 11:45 – 12:15 PT (UTC-7:00)
Theater III
SUNA specializes in Micro Lens Array（based on silicon and fused silica) and Silicon Capacitors, enabling breakthroughs in AI, optical communications, consumer electronics, automotive electronics, and high-performance computing.
SUNA specializes in Micro Lens Array（based on silicon and fused silica) and Silicon Capacitors, enabling breakthroughs in AI, optical communications, consumer electronics, automotive electronics, and high-performance computing.
Speaker
- Bing Shao, Senior Consultant for Overseas Market Expansion, SUNA, China
Presented By
Presented By
[top]
Thursday, 03 April, 13:15 – 13:45 PT (UTC-7:00)
Theater III
Explore the three key strengths of Sumitomo Electric's ribbon splicing solutions – scalability, field performance, and ease of maintenance – and how they work together to deliver unmatched results. With designs supporting 200 μm fibers and up to 16-fiber ribbons, these innovations are engineered to handle network evolution ...
Explore the three key strengths of Sumitomo Electric's ribbon splicing solutions – scalability, field performance, and ease of maintenance – and how they work together to deliver unmatched results. With designs supporting 200 μm fibers and up to 16-fiber ribbons, these innovations are engineered to handle network evolution with confidence.
Speaker
- Andrew Degidio, Sumitomo Electric Lightwave’s Sr Technical Manager, USA
Presented By
Presented By
[top]