19 Mar 2026
13:45 - 14:15
Expo Theater III
LightSpeed Photonics is developing solderable Near-Package Optics (NPO) solutions that bring compact, high-bandwidth optical connectivity closer to compute without embedding optics inside the ASIC. As interconnect channel rates scale to 112G and 224G, this approach provides a practical alternative to the challenges of co-packaged optics—managing thermal density, improving serviceability, reducing silicon risk and time-to-market —while enabling stable, modular, and upgrade.
Technology showcase sponsored by LightSpeed Photonics. Visit booth 4775.
Speaker
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Robin Yeluripati
CEO, Founder, Lightspeed Photonics, Singapore
Presented By
