Technical Conference: 07 - 11 March 2027
Exhibition: 09 - 11 March 2027
Los Angeles Convention Center | Los Angeles, California, United States

Technical Conference: 07 - 11 March 2027
Exhibition: 09 - 11 March 2027
Los Angeles Convention Center | Los Angeles, California, United States

Hitachi Presents Open-Tooled Gold Box Kit for ELSFP applications: Unlocking High Power External Laser Solutions for Scalable Co-Packaged Optics

18 Mar 2026
15:15 - 15:45
Expo Theater III

Discover Hitachi High‑Tech’s innovative Gold Box Kit—an open‑tooled,  supplier‑co‑designed platform that dramatically streamlines the integration of high‑power laser chips (up to 3mm × 0.5mm). Engineered to simplify development and reduce upfront engineering costs. This solution empowers customers to accelerate time‑to‑market and scale optical performance with confidence.

Technology showcase sponsored by Hitachi. Visit booths 1210 & 1475.

Speaker

  • Shigenori Furuta

    Assistant Manager, Innovative Photonics Solutions, Hitachi, Japan

Presented By

Hitachi