19 Mar 2026
13:30 - 14:30
Expo Theater II
Optical interconnects have failed to meet the cost, power, reliability and bandwidth needs of the growing AI applications space. This panel will provide updates on OIF projects that are targeted at meeting AI application requirements.
Learn about the OIF Energy Efficient Interface-Compute Optics Interface (EEI COI) project, which aims to address the growing demands of AI and ML. The project focuses on energy-efficient, low-latency photonic interfaces to support AI scale-up links. Building on the existing EEI work, this project addresses the industry’s demand for scalable, high-performance compute optical interfaces that ensure interoperability across diverse AI platforms.
Hear about our various projects, including OIF EEI-224G- Retimed Tx Linear Rx (RTLR) and CEI-224G-Linear, that focus on enhancing electrical interfaces to enable lower power 224G optical signaling, a critical component in the evolution of high-speed data transmission and the expansion of broadband infrastructure.
Presented By:
Moderator
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Jeff Hutchins
OIF PLL WG EEI Vice Chair, Ranovus, United States
Panelists
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Cathy Liu
OIF Board Member, Broadcom Inc., United States
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Jeff Hutchins
OIF PLL WG EEI Vice Chair, Ranovus, United States
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Mike Klempa
OIF Board Member, Qualcomm Incorporated, United States
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Nathan Tracy
OIF President, TE Connectivity, United States