17 Mar 2026
16:00 - 17:00
Expo Theater III
Power-efficient, low-latency, high-speed electrical interfaces are required to enable next-generation equipment and applications, such as high-performance computing and networking that support AI training and inference. Learn how OIF aligns the industry on developing specifications that optimize electrical interfaces to meet these challenging and conflicting requirements, in far less time than the typical 3- to 5-year technology generational gap.
A panel of OIF experts will present an update on Common Electrical I/O (CEI) – 448Gbps Framework projects that address next-generation architectures and applications, and discuss key challenges, including modulation format, target loss budgets, and packaging options. Hear how OIF strives to maintain interoperable interfaces for application spaces to enable cost-effective component, subsystem, and system development and deployment. This will ensure interoperable fiber, connectors, electrical interfaces, etc. Understand how OIF helped build consensus across the industry on the application spaces and initiated collaborative discussions to generate a broad set of 448Gbps signaling project developments and objectives.
Presented By:
Moderator
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Nathan Tracy
OIF President, TE Connectivity, United States
Panelists
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Cathy Liu
OIF Board Member, Broadcom, United States
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John Calvin
Keysight Technologies, United States
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Mike Klempa
OIF Secretary/Treasurer, Qualcomm Incorporated, United States
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Yi Tang
OIF Board Member, Cisco, United States