18 Mar 2026
14:30 - 15:30
Expo Theater II
The rapid acceleration of AI workloads is fundamentally reshaping data center architectures and driving unprecedented demand for high-bandwidth, ultra-low-latency connectivity. As a result, data center interconnection (DCI) is evolving to support two distinct but complementary models: scale-up and scale-across. Both models represent significant growth opportunities, with industry analysts projecting the data center switch market alone to approach $6 billion by 2030 as operators re-architect networks to meet AI-driven performance requirements.
This panel will examine the optical technologies enabling this transformation, from advanced IPoDWDM solutions to emerging architectures such as co-packaged optics (CPO). We will explore the broader migration from copper to fiber-based technologies and the implications for performance, power, and scalability. Attendees will gain practical insight into the trends, challenges, and technology choices shaping the next generation of data center interconnection.
Technology showcase sponsored by Lightwave + BTR. Visit booth 5361
Moderator
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Sean Buckley
Lightwave, Editor In Chief, United States
Presented By
