Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

OCP Presents Future Photonics for AI: From PICs to Pods to Factories

17 Mar 2026
16:00 - 17:00
Expo Theater I

This updated panel from last year’s OFC50 hit discussion on “Lighting the Path to Exascale AI” will delve into the optical technologies and market dynamics essential for next-generation AI data center infrastructure. The race to exascale AI and beyond drives a fundamental shift in how AI factory building blocks are designed and operated, with photonics as a critical enabler. The future of optical communication must address some of the most pressing hurdles and bottlenecks, moving beyond traditional electronic interconnects.


The Open Compute Project proudly brings together a panel of leading experts to discuss the practical realities and future direction of revolutionizing data movement—from photonic integrated circuits (PICs), to scale-up AI pods to scale-out AI factories. We will examine the most recent breakthroughs in silicon photonics, the rise of linear and co-packaged optics (CPO), and emphasizing the technical and market impact on solving complex data transfer challenges in AI training and inference. The discussion will also highlight the increasing importance of these technologies in enabling next-generation AI accelerators and memory hierarchies.

 

Presented By: 
Open Compute Project

Moderator

  • Vladimir Kozlov

    CEO, LightCounting LLC, United States

Panelist

  • Andy Bechtolsheim

    Arista Networks, Germany

  • Kannan Raj

    Technical Architect for AI Infrastructure, Oracle, United States

  • Karen Liu

    Senior Advisor, PLM, Ciena, United States

  • Thomas Liljeberg

    Vice President, Integrated Photonics Solutions, Intel, United States