18 Mar 2026
15:45 - 16:45
Expo Theater II
AI-driven workloads are straining traditional data center architectures, demanding unprecedented bandwidth, lower latency, and far better energy efficiency. Optical interconnects are redefining how these systems scale, with advances in pluggable modules and emerging stability in co-packaged optics (CPO) solutions. This session examines how next-generation electrical and optical interconnects together address modulation compatibility, performance, power, and scalability across rack-level and cluster-level fabrics. Attendees will gain a pragmatic view of how to balance CPO and pluggable form factors, optics, and copper to build AI-ready, energy-efficient data centers that can continue to scale.
Technology showcase sponsored by Amphenol. Visit booths 949 & 1676.
Speaker
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Samuel Kocsis
Director of Standards and Technology, Amphenol, United States
Presented By
