Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

GSA and IEEE Present Bridging Silicon and Light: Innovations at the Intersection of Semiconductors and Photonics

18 Mar 2026
12:45 - 13:45
Expo Theater III

Join us for a dynamic session that brings together two converging worlds — semiconductors and photonics — to explore how these technologies are shaping the future of optical communications. This collaborative event, co-hosted by OFC and the Global Semiconductor Alliance (GSA), will spotlight leaders driving innovation in areas such as silicon photonics, co-packaged optics, and advanced packaging.

Expect insightful discussions on emerging challenges, opportunities for cross-sector collaboration, and strategies to accelerate innovation in next-generation hardware. Whether you’re a technologist, researcher, or industry leader, this is your chance to connect, learn, and help shape the future at the intersection of light and silicon.

Presented By:
GSA

Organizers

  • Fotini Karinou

    Microsoft, IEEE Photonics Society Board of Governors, United Kingdom

  • Avery Lu

    Global Semiconductor Alliance, United States

Panelists

  • Julie Sheridan Eng

    Chief Technology Officer, Coherent, United States

  • Vikas Gupta

    Senior Director, Product Management & Marketing, Global Foundries, United States

  • Near Margalit

    Vice President, Optical Systems Division, Broadcom, United States

  • Oleg Martynov

    Director of Silicon Photonics Technology Development, TowerSemi., United States

  • Craig Thompson

    Vice President LinkX Products, Networking Group, Nvidia, United States