18 Mar 2026
14:15 - 15:45
Expo Theater I
Discover the latest breakthroughs in advanced packaging, co-packaged optics (CPO) and linear-drive pluggable optics (LPO). This session showcases how these technologies are driving more power-efficient, scalable optical systems to meet the growing demands of AI clusters and next-generation data centers.
Moderator
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Atul Srivastava
Chief Technology Officer, NTT Electronics America, United States
Panelists
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Ricardo Aroca
Distinguished Engineer, Acacia-Cisco, United States
Talk: Package Innovations to Meet AI Scaling Needs
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Shai Cohen
Principal Researcher, Nvidia, United States
Talk: What's Next in Co-Packaged Optics
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Deepak Kulkarni
Senior Fellow, AMD, United States
Talk: Advancing AI Through Innovations in Advanced Packaging
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Zuowei Shen
Senior Staff Hardware Engineer. Google, United States
Talk: Architecting the Light-Path: Radical Co-Design from Optical Chiplets to AI Fabrics
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Peter Winzer
Founder and Chief Technology Officer, Nubis, United States
Talk: CPX: Operationalizing CPO through a Mixed-Media Socket