Technology Showcases

As AI workloads drive Ethernet speeds to 224G SerDes and 1.6T links, data center reliability challenges are no longer dominated by silicon logic or protocol design, but by interconnect behavior under compounded stress. Nearly 80% of failures occur at interconnects, where a single weak link can...

Discover how DataSens™ Enhanced Optical Fiber, integrated into the versatile Fortex® cable platform, is transforming distributed fiber optic sensing (DFOS) applications.

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This presentation introduces SUNA’s silicon-based micro-lens technology for CPO and OCS. Designed to address the growing demand for high-density, low-loss optical coupling in AI-driven data centers, the lens arrays achieve low coupling losses with high alignment tolerance. Utilizing...

As transceivers evolve toward higher integration and data rates, traditional passive components face challenges in performance, miniaturization, integration, and reliability. Silicon-based passive components, leveraging stable physical properties and advanced semiconductor processes, offer...

PICs and CPO will deliver higher bandwidths and power efficiencies across AI networks, but ramping manufacturing of these critically important technologies requires new test capabilities. Hear practical strategies for scalable opto-electrical testing from wafer to module and how designing...

Discover Hitachi High‑Tech’s innovative Gold Box Kit—an open‑tooled,  supplier‑co‑designed platform that dramatically streamlines the integration of high‑power laser chips (up to 3mm × 0.5mm). Engineered to simplify development and reduce upfront engineering costs.
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As optical interconnect speeds climb, advanced optics and DSPs are pushing air cooling beyond its limits. This session examines a shift to direct-to-plug liquid cooling for pluggable optics, enabling scalable interconnects with blind-mate, dripless connections and cooling beyond 100 watts...

LightSpeed Photonics is developing solderable Near-Package Optics (NPO) solutions that bring compact, high-bandwidth optical connectivity closer to compute without embedding optics inside the ASIC. As interconnect channel rates scale to 112G and 224G, this approach provides a practical...