Technology Showcases

As AI workloads drive Ethernet speeds to 224G SerDes and 1.6T links, data center reliability challenges are no longer dominated by silicon logic or protocol design, but by interconnect behavior under compounded stress. Nearly 80% of failures occur at interconnects, where a single weak link can...

Discover how DataSens™ Enhanced Optical Fiber, integrated into the versatile Fortex® cable platform, is transforming distributed fiber optic sensing (DFOS) applications.

Technology showcase sponsored by Lightera. Visit booth 829.

This presentation introduces SUNA’s silicon-based micro-lens technology for CPO and OCS. Designed to address the growing demand for high-density, low-loss optical coupling in AI-driven data centers, the lens arrays achieve low coupling losses with high alignment tolerance. Utilizing...

As transceivers evolve toward higher integration and data rates, traditional passive components face challenges in performance, miniaturization, integration, and reliability. Silicon-based passive components, leveraging stable physical properties and advanced semiconductor processes, offer...

PICs and CPO will deliver higher bandwidths and power efficiencies across AI networks, but ramping manufacturing of these critically important technologies requires new test capabilities. Hear practical strategies for scalable opto-electrical testing from wafer to module and how designing...

Thin-Film Lithium Niobate (TFLN) enables high-performance integrated photonics solutions, dramatically reducing system-level power consumption and supporting 100 GHz+ optics in datacom and telecom. With commercial adoption accelerating, focus shifts to scaling manufacturing, module integration...

The rapid acceleration of AI workloads is fundamentally reshaping data center architectures and driving unprecedented demand for high-bandwidth, power-efficient, and low-latency connectivity. To support this demand, data center connectivity is evolving rapidly across the key connectivity...

Discover Hitachi High‑Tech’s innovative Gold Box Kit—an open‑tooled,  supplier‑co‑designed platform that dramatically streamlines the integration of high‑power laser chips (up to 3mm × 0.5mm). Engineered to simplify development and reduce upfront engineering costs. This...

AI-driven workloads are straining traditional data center architectures, demanding unprecedented bandwidth, lower latency, and far better energy efficiency. Optical interconnects are redefining how these systems scale, with advances in pluggable modules and emerging stability in co-packaged...

The era of AI networking is here, bringing unprecedented demands on speed, scale, and efficiency. As AI workloads grow exponentially, understanding how to architect networking infrastructure at scale is critical to delivering reliability, performance, and efficiency. The challenges require...

As optical interconnect speeds climb, advanced optics and DSPs are pushing air cooling beyond its limits. This session examines a shift to direct-to-plug liquid cooling for pluggable optics, enabling scalable interconnects with blind-mate, dripless connections and cooling beyond 100 watts...

SMART Photonics, an independent InP foundry, enables fabless, wafer-scale integration of lasers, SOAs, modulators, detectors, and mux/demux on a single photonic chip. With 120 GHz+ modulator building blocks enabling 3.2T DR/FR/CPO and 1.6T+ coherent photonics, SMART’s monolithic InP PICs...

LightSpeed Photonics is developing solderable Near-Package Optics (NPO) solutions that bring compact, high-bandwidth optical connectivity closer to compute without embedding optics inside the ASIC. As interconnect channel rates scale to 112G and 224G, this approach provides a practical...