Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

Technical Conference: 15 - 19 March 2026
Exhibition: 17 - 19 March 2026
Los Angeles Convention Center | Los Angeles, California, United States

Advanced Packaging and Co-Packaging for Efficient Optical Systems

18 Mar 2026
14:15 - 15:45
Expo Theater I

Discover the latest breakthroughs in advanced packaging, co-packaged optics (CPO) and linear-drive pluggable optics (LPO). This session showcases how these technologies are driving more power-efficient, scalable optical systems to meet the growing demands of AI clusters and next-generation data centers.

Moderator

  • Atul Srivastava

    Chief Technology Officer, NTT Electronics America, United States

Panelists

  • Ricardo Aroca

    Distinguished Engineer, Acacia-Cisco, United States

  • Shai Cohen

    Principal Researcher, Nvidia, United States

  • Deepak Kulkarni

    Senior Fellow, AMD, United States

  • Zuowei Shen

    Senior Staff Hardware Engineer. Google, United States

  • Peter Winzer

    Founder and Chief Technology Officer, Nubis, United States