Workshop: The Known-Good-Die Disconnect: Can We Test What Matters Before We Package It?

Driven by growing demand for optical interconnects in AI systems and data centers, integrated photonics is moving toward high-volume production. Yet the industry has no shared definition of a known good die: which measurements must be completed before committing to expensive packaging, which only become meaningful after assembly, and how results should correlate across wafer, die, package, and module test.

Foundries, fabless vendors, test-equipment suppliers, and customers use different metrics, probe architectures, and acceptance criteria, making results incomparable across the supply chain. This disconnect limits yield learning, inflates development and manufacturing costs, and leaves the industry poorly equipped for the next decade of photonics scaling.

This workshop convenes the full supply chain, including foundries, test-equipment suppliers, fabless designers, system vendors, and end customers, to:

• Define what must be tested and when
• Identify where standardization is achievable versus platform-specific
• Debate who owns the resulting data and who should drive shared testing frameworks