This panel revisits optical and electrical co-design for transceivers exceeding 400 Gb/s, focusing on the implications of integration strategies such as hybrid, heterogeneous, and monolithic approaches. It will compare trade-offs in performance, thermal management, signal integrity, manufacturability, and cost across these integration paradigms.
Organizers
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Tatsurou Hiraki
NTT, Japan
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Yating Wan
King Abdullah University of Science & Technology (KAUST), Saudi Arabia
Panelists
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Steven Alleston
OpenLight, United States
Talk: Heterogeneous III-V/Si integration and electrical-optical co-design
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Prashanth Bhasker
Broadcom, United States
Talk: Differential EML driven by DSP
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Radha Nagarajan
Marvell, United States
Talk: DSP / optical platform / high-volume transceiver
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Katsumi Uesaka
Sumitomo Electric, Japan
Talk: Hi-speed EML and hetergeneous III-V/Si integration for 400G/lane