09 Mar 2027
16:00 - 17:00
Expo Theater I
OCP brings together leading experts on the practical realities of moving data with light: from photonic integrated circuits (PICs) to scale-up AI pods to scale-out and -across AI factories. The panel will examine advances in silicon photonics and the maturation of linear-drive and co-packaged optics (CPO) for next-generation AI accelerators and memory.
Two threads frame the discussion. First, can optics be trusted deep inside the compute fabric? With millions of links per AI factory, link flaps and transceiver failures become lost training time. OCP’s Optics Reliability Workstream is standardizing link-health telemetry, event logging, link-partner visibility and remote firmware updates for 400G to 1.6T transceivers. Panelists will also weigh design approaches such as contamination-tolerant expanded beam optics (EBO) connectivity.
Second, how does the industry converge on open, multi-source optics at the package? OCP Networking’s new Integrated Optics (CPO/xPO) subproject aims to bring three efforts together: operator requirements for short-reach scale-up optics, a foundry-neutral optical chiplet footprint and the Optical Compute Interconnect (OCI) v2.0 PHY. The panel will debate what it takes to make optical interconnect as open and dependable as the accelerators it connects.
Presented By:
