Panel: CPO Manufacturing: What Keeps You Awake at Night?

With Co-Packaged Optics (CPO) advancing beyond prototypes, industry focus has shifted to the challenges of high-volume manufacturing and reliability across optics, electronics, packaging, and testing.

Drawing insights from across the entire manufacturer-to-end-customer value chain, this panel addresses the critical bottlenecks standing in the way of making CPO a scalable, mass-manufacturable technology.

Discussions will evaluate component and packaging maturity alongside volume testing strategies, yield optimization, and standardization gaps. Panelists will examine key questions such as:

• What are the primary manufacturing and reliability risk vectors currently holding back large-scale CPO adoption?
• How mature is the supply chain of today’s laser sources, packaging flows, connector solutions, and test strategies for high-volume, high-yield manufacturing?
• How can field operational data guide realistic testing standards and deployment roadmaps?
• Which specific areas of CPO testing, qualification, and component packaging require urgent standardization?

Organizers (Moderators)

• Sabarni Palit

  Mixx Technologies, United States

• Hari Potluri

  Broadcom, United States

• Anna Tatarczak

  Coherent, United States

• Takako Hirokawa

  Global Foundries, United States

Panelists

• Siamak

  Meta, United States

  Talk: (Title to be Announced)

• Dave Armstrong

  ASE / Ise Labs, United States

• Jennifer Luo

  Nvidia, United States

  Talk: (Title to be Announced)

• Tom Mitcheltree

  USConec, United States

  Talk: (Title to be Announced)

• Farnwood Rezaie

  JEDEC SiPh/Cisco, United States

  Talk: (Title to be Announced)

• Jean Trewhella

  GlobalFoundries (GF), United States

  Talk: (Title to be Announced)

• Pete Winzer

  Ciena, United States

  Talk: (Title to be Announced)