This panel addresses the critical challenges to make co-packaged optics (CPO) a truly mass-manufacturable technology. With significant progress at prototype and early deployment levels, the focus has shifted to interdependent scaling issues across optics, electronics, packaging, testing, and reliability. Discussions cover manufacturing readiness of key building blocks — fibers, fiber-and-die packaging, high-power external lasers, reflowable and detachable connectors, socketable vs. solderable electrical connections — as well as testing, qualification, and standardization gaps at volume scale. The panel will leverage network-level reliability data from hyperscalers to inform realistic CPO qualification and deployment strategies, with speakers from laser houses, design houses, connector companies, CPO foundries, OSATs, test equipment vendors, box assemblers, and hyperscaler customers.
Organizers (Moderators)
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Sabarni Palit
Mixx Technologies, United States
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Hari Potluri
Broadcom, United States
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Anna Tatarczak
Coherent, United States
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Takako Hirokawa
Global Foundries, United States