Experimental Demonstration of 51.2 Tb/s Self-Homodyne Coherent Interconnects on a 3D Photonic Chip Inspiring Coherent Technology Transfer to Centimeter-Scale Ultra-Short-Reach Applications (W2B.15)
Presenter: Jian Wang, Huazhong University of Science and Techn
We demonstrated a record net 51.2 Tb/s (800Gb/s PDM-64QAM x 64 Channels) ultrafast laser inscribed 3D photonic chip interconnects based on self-homodyne coherent detection, showing the feasibility of coherent technology transfer to ultra-short-reach applications.
Authors:Min Yang, Huazhong University of Science and Techn / Chengkun Cai, Huazhong University of Science and Techn / Kangrui Wang, Huazhong University of Science and Techn / Guofeng Yan, Huazhong University of Science and Techn / Shuo Zheng, Huazhong University of Science and Techn / Zhenyu Wan, Huazhong University of Science and Techn / Yanjun Zhu, Hisense Broadband Inc / Hua Zhang, Hisense Broadband Multimedia Technologies Co., Ltd, / Chaonan Yao, Hisense Broadband Multimedia Technologies Co., Ltd, / Yuchen Shao, Hisense Broadband Multimedia Technologies Co., Ltd, / Jian Wang, Huazhong University of Science and Techn