• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

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OTTAWA, March 13, 2013 – OneChip Photonics today announced that it is working with IQE, the world’s leading independent provider of III-V semiconductor epitaxy services, to grow the epitaxial (epi) structures, which OneChip uses to produce its Photonic Integrated Circuits (PIC...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/onechip-photonics-announces-new-family-of-phot-(1)/ 6/6/2013 2:30:17 AM (UTC - 05:00)
OFC 2023, Booth 3229, San Diego, California, February 24, 2023 - Furukawa Electric Co., Ltd. (FEC) announces the extension of the bandwidth of the ultra-small, narrow linewidth tunable light source, Nana-ITLA, product lineup with the development of a new ultra-small, narrow...
/en-us/home/news-and-press/exhibitor-press-releases/2023/furukawa-electric-announces-the-extension-of-the-n/ 3/6/2023 11:48:31 AM (UTC - 05:00)
By Chuck Joyner Believe it or not, some of the programming at OFC/NFOEC this year is an experiment. As a program committee, we are focused on developing technical programming that is dynamic and responsive to the emerging topics in the industry. One of this year's exp...
/en-us/home/news-and-press/ofc-blog/2011/february-2011/experimenting-at-ofc-nfoec/ 2/24/2011 4:30:44 PM (UTC - 05:00)
Leading automated test equipment manufacture Yelo (booth 2359 at OFC) has won $2.5million in orders for its Y1000L laser diode burn-in system.  The large orders have come as a result of the growth of the 100G Data Center market. The system tests laser diode packages such a...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/2017/yelo-wins-$2-5-million-in-orders-for-100g-laser-di/ 1/11/2017 3:59:53 PM (UTC - 05:00)
Würenlos, Switzerland, March 7, 2024 - Eulitha’s Displacement Talbot Lithography (DTL) technology is the perfect solution for photonic applications requiring periodic patterning such as Vertical Cavity Surface-Emitting Lasers (VCSEL), Photonic Crystal Surface-Emitting Laser...
/en-us/home/news-and-press/exhibitor-press-releases/2024/eulitha’s-dtl-patterning-offers-low-cost,-high-pre/ 3/11/2024 10:31:25 AM (UTC - 05:00)
Glass fiber optic cables ensure transmission of very high data rates over very long distances. In telecommunication networks, this technology currently has no peer. In order to exploit the potential of the optical fiber, optical switches and modulators are employed to bundle, ...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/liquid-crystals-enable-light-guiding/ 6/6/2013 2:30:20 AM (UTC - 05:00)
Fraunhofer Institute for Photonic Microsystems IPMS located in Dresden has developed an optical switch / variable optical power splitter device (OS/VOPS), which can enable fast and almost wear-free distribution of light signals in fiber optic networks. The technology is based ...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/light-path-controller-in-fiber-optic-networks/ 3/5/2014 1:55:30 PM (UTC - 05:00)
Singapore - C ompoundTek, a Singapore based company that specializes in Silicon Photonics Technologies, together with SilTerra, a world-class 200mm Si-CMOS Foundry based in Kulim-Penang, Malaysia, announce their strategic partnership in the area of Silicon Photonics (SiPh), w...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/2018/exclusive-strategic-partnership-in-next-generation/ 3/13/2018 11:33:38 AM (UTC - 05:00)
Welcome back to my daily blog about OFC 2014. Today we’ll be taking a look at the wide world of photonics represented at OFC, from service providers and cloud computing to optoelectronic packaging and software for dynamic network provisioning.   Today provided an opport...
/en-us/home/news-and-press/ofc-blog/2014/march-2014/ofc-day-4-–-wednesday,-march-12-–-what-a-world-(of/ 3/13/2014 2:54:35 PM (UTC - 05:00)
IPDiA (a Murata company) has developed a new series of Ultra-Broadband Wire Bonded Silicon Capacitor (UBEC) with 0201 (0.6x0.3mm) form factor. Compared with surface mounted solution (figure 1), these new capacitors enable a direct interconnection between the ICs without usi...
/en-us/home/news-and-press/exhibitor-press-releases/exhibitor-press-releases-archive/2017/ipdia-launches-a-wire-bonded-0201-(0-6x0-3mm)-ultr/ 3/14/2017 10:43:13 AM (UTC - 05:00)