SC450 - Design, Manufacturing, and Packaging of Opto-Electronic Modules
Monday, 20 March
09:00 - 12:00
Short Course Level: Advanced Beginner
Kevin Williams1, Arne Leinse2, Twan Korthorst3; 1Eindhoven University of Technology, Netherlands; 2LioniX BV, Netherlands, 3PhoeniX Software, Netherlands
Short Course Description:
Integrated optical modules combine advanced semiconductor technologies, optical and electronic chips, motherboards, micro-optics and heat-management to meet demanding sub-systems specifications. The assembly, packaging and testing of such modules requires increasingly sophisticated methods to ensure product meets specification. This short course will provide an insight into the packaging and testing specific to such integrated optical modules.
Integrated circuits will be considered for a range of platform technologies by using the building block approach for open access generic foundries. A particular focus will be placed on scalability, addressing optical, electrical, mechanical, and thermal module connections. In an optimized design, these aspects become intricately interdependent, impacting chip layout, assembly methods and test protocols.
Packaging methods include the attachment of fiber- and micro-optics, mechanical positioning, wire and die bonding, assembly to motherboards, the insertion into housings, encapsulation and sealing. Techniques from hand-crafted assembly through to increasingly automated process flows will be reviewed. The course will provide an insight into the methods and interdependencies.
Test methods are instrumental in both qualifying modules and centering processes to enhance yield and performance. Methods for both custom product development and also generic foundries methodologies will be compared and contrasted. A structured separation of wafer validation, assembly and product qualification will be presented, ensuring relevance to a broad range of application specific PIC-enabled products.
Short Course Benefits:
This course will enable you to:
Identify the distinctive features of packaging and testing for optical integrated modules when compared with discrete optical products and integrated electrical systems.
Identify the different stages of testing, including the building block methodology used in open-access foundry services.
Determine the origin of impairments using common measurement methods and describe how test methods can be used to push the yield-performance envelope
Recognize common assembly techniques and their impact on chip and multi-chip-module layout and test requirements.
Determine the motivations for using package and assembly techniques from gold box to glob-top, hermetic to non-hermetic, cooled to uncooled.
Short Course Audience:
Course participants will likely already be engaged in either optoelectronic product development, optical systems engineering or photonics research. The course should be of relevance to both systems integrators who are considering the deployment of integrated optical modules and technologists developing integrated optical circuits who are keen to improve their understanding of product specification and evaluation.
A Bachelor or Master level physics or engineering education would provide a solid basis for course participation and a background in semiconductor electronics, optoelectronics and optics will be advantageous. This is the first edition of this highly interdisciplinary course.
Prof Kevin Williams is leads the Photonic Integration group at the Institute for Photonic Integration (formerly known as COBRA) at the Eindhoven University of Technology. He has been performing leading edge research into large scale integrated circuits and has worked with both Silicon Photonic circuits and InP integrated photonics platforms. Most recently he has been focusing on InP integrated photonic technologies. Prior to moving to the Netherlands, Kevin was a Royal Society Research Fellow at the University of Bristol and a Fellow at Churchill College at the University of Cambridge.
Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer.
Twan Korthorst is since more than 20 years active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies. During the final stage of his studies in Electrical Engineering at the University of Twente in the Netherlands, he co-founded the Microflown Team, developing world's first particle velocity microphone. In 1996 he started as Product Engineer at Twente Microproducts (TMP). After the acquisition of TMP by Kymata, a Scottish-based communications solutions provider using integrated photonics in 2000, he occupied the post of Director Operations at Kymata Netherlands (later Alcatel Optronics Netherlands). Having been a Manager of Operations at DEMCON Advanced Mechatronics, Twan joined PhoeniX Software in August 2007. As CEO of the leading supplier of Photonic IC design solutions, he is instrumental in advocating about photonic integration technologies and bringing parties together to accelerate the development of design flows and manufacturing supply chains.