2022 Archives

8:00 - 10:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tu1A

Plenary Session

Presider: Shinji Matsuo, NTT Device Technology Labs, Japan
Ballroom 20BCD - San Diego Convention Center

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Tu1A.1
Plenary Talk: Present and Future Silicon Photonics

Presenter: John Bowers, University of California Santa Barbara

Presentation Details
Plenary

Integration of photonics with electronics is key to advanced photonics and advanced electronics. The low cost and scaling ability of silicon photonics is expanding the market beyond datacom and telecom to sensors, navigation and IoT.Authors: John Bowers, University of California Santa Barbara
Tu1A.2
5G and the Promise of Industry 4.0

Presenter: Elise Neel, Verizon New Business Incubation

Presentation Details
Plenary

Industry 4.0 is a new technology chapter promising fully autonomous, self-improving processes of matching work to the most appropriate set of resources; robot, human, drone or machine. This session will cover how 5G is foundational technology enabling connection, management & operation of the physical, digital & biological elements required for this autonomous world.Authors: Elise Neel, Verizon New Business Incubation
Tu1A.3
Exploration Technologies: Communicating With Spacecraft, Landers, Rovers, and Human Missions

Presenter: James Green, NASA

Presentation Details
Plenary

We are in a golden age of robotic and human exploration requiring new and exciting architectures and technologies. One top goal for NASA is to provide optical communications supporting humans on the Moon and Mars. This talk will discuss the evolution and architecture of advanced communication technologies for exploring the planets.Authors: James Green, NASA

10:00 - 10:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE16

Tech Talk: Software Defined Networking in the Cloud - Designs, Operations, and Management

Optica Booth 2939

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Special Event In Person Only

10:00 - 17:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Exhibition

Exhibit Hall - San Diego Convention Center

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OFC Career Zone Job Fair

Booth 5135 Job Fair - Exhibit Floor - San Diego Convention Center

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Exhibit Hall Event In Person Only

10:15 - 10:45 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE14

Conversation with the Plenary Speakers

Show Floor Theater III - San Diego Convention Center

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10:30 - 11:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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DCSK

Data Center Summit Keynote: Market Forces Driving Future Data Center Interconnect Technologies

Expo Theater II - San Diego Convention Center

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Exhibit Hall Event In Person Only

10:30 - 12:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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MW1

Market Watch I: State of the Industry

Expo Theater I - San Diego Convention Center

Event Details

Session Description:

The State of the Industry is one of the most highly anticipated Market Watch panels at OFC. Each year, a mix of industry and financial analysts present their unique view on the current state of the optical market, discussing areas that encompass components, subsystems, and system manufacturers as well as market influences and drivers. In doing so, the session will cover factors that influenced the past year and describe trends that are expected to define the future. By the conclusion of this panel presentation and Q&A, the audience will have gathered a deeper understanding of the industry with valuable market data points that will help them achieve a better appreciation for the state of the industry.

Moderator:

Tim Doiron, Sr. Director, Solution Marketing, Infinera, USA

Panelists:

Alex Derbes, Portfolio Manager, Investor, Gilder Gagnon Howe & Co., USA
How Changes in Video Licensing and Distribution Are Impacting Optical Networks

Mike Genovese, Equity Research Analyst, Rosenblatt Securities, USA
2022 Investment Opportunities: New Line Systems, Pluggables, XGS-PON & Metaverse

Lisa Huff, Sr. Principal Analyst, Optical Components, Omdia, USA
State of the Optical Components Market – Driven by ICP Data Centers

Martin Vallo, Market & Technology Analyst, Yole, France
The Global Technology and Market Trends Shaping the Future of Optics Industry

Scott Wilkinson, Lead Analyst, Networking Components, Cignal AI, USA
Coherent Optical Evolution and Its Impact on Traditional DWDM

Biographies:

Alex Derbes, Portfolio Manager, Investor, Gilder Gagnon Howe & Co., USA
Alex Derbes is a partner at Gilder Gagnon Howe & Co. in New York City, where he invests in public equities for individuals who want to take risk. Prior to joining Gilder Gagnon Howe & Co in 2003, he wrote software and worked on data center architecture for NetSuite. In addition to communications, his investing interests include but are not limited to digital advertising, streaming media, SaaS software, electric vehicles, and e-commerce. His engineering background informs his approach, and he is attracted to industries that are being transformed by changes in technology and society. He holds a BS in computer science from Case Western Reserve University.

Tim Doiron, Sr. Director, Solution Marketing, Infinera, USA
Tim Doiron is Sr. Director, Solution Marketing at Infinera, where he focuses on innovative networking solutions that include open optical networking, next-generation mobile transport, and intelligent software automation. In this role, Tim leads the global marketing team responsible for go-to-market strategies and communications programs. Built upon open, disaggregated, and programmable network innovation, Infinera’s solutions enable network operators to increase networking capacity and visibility while accelerating service velocity and simplifying operations.

Mike Genovese, Equity Research Analyst, Rosenblatt Securities, USA
Michael Genovese is Managing Director and Senior Research Analyst covering communications equipment stocks. Michael covers the optical systems, optical components, and broadband access industries. Michael prides himself for his extensive industry network and thorough, accurate channel checks that he has developed over his 20 years of experience. Michael previously worked in equity research and investment management at MKM Partners, Citigroup, and Alliance Bernstein. He also spent several years in the Strategy and Market Intelligence group of Ciena Corporation. Michael received an M.A. from The Fletcher School at Tufts University and a B.A. with High Honors from Swarthmore College, and he currently holds series 7, 63, 86, and 87 registrations.

Lisa Huff, Sr. Principal Analyst, Optical Components, Omdia, USA
Lisa Huff is a Senior Principal Analyst, Optical Components at Omdia. She joined Ovum as a Principal Analyst, Optical Components in March 2018. Prior to that, she had her own market research and consulting firm, Discerning Analytics, LLC (DA) for nine years. Lisa is a Certified Data Center Management Professional (CDCMP^®) and degreed electrical engineer with over 35 years experience. Her expertise is in data centers, optical components, data communications cabling and connectivity and networking equipment. Her Omdia focus areas include optical components used in data communications and data centers. Lisa has authored over 60 technical papers and market research reports and has chaired and presented at many industry conferences.

Martin Vallo, Market & Technology Analyst, Yole, France
Martin Vallo, PhD serves as a Technology & Market Analyst specialized in solid-state lighting technologies, within the Photonics, Sensing & Display division at Yole Développement (Yole). With 9 years’ experience within semiconductor technology, Martin is involved today in the development of technology & market reports as well as the production of custom consulting projects at Yole. Prior his mission at Yole, he worked at CEA (Grenoble, France), with a mission focused on the epitaxial growth of InGaN/GaN core-shell nanowire LEDs by MOCVD and their characterization for highly flexible photonic devices. Martin graduated from Academy of Sciences, Institute of Electrical Engineering (Slovakia) with an engineering degree in III-nitride semiconductors.

Scott Wilkinson, Lead Analyst, Networking Components, Cignal AI, USA

Scott Wilkinson has worked directly in the telecommunications industry for over 25 years, during which he accumulated extensive experience in optical networking, fiber to the home, long haul optical technology, carrier ethernet, MPLS, and SDN/NFV-enabled networks. As Lead Analyst at Cignal AI, he conducts quantitative and qualitative research on the optical components market. Dr. Wilkinson held senior positions in product management, technical marketing, and systems engineering for Hitachi, ECI Telecom, MRV, Fujitsu, and startup companies Kestrel Solutions, and Parama Networks. A noted speaker at telecom conferences and events such as NGON, OFC, and FTTH, Wilkinson is also a frequent contributor to trade publications and is the author of the book “Telecommedy”. Wilkinson has a Bachelor of Electrical Engineering degree and Ph.D. in Electrical Engineering from the Georgia Institute of Technology.

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SpE9

OFC Career Zone: How to (Re) Start Your Career in the Midst of a Pandemic (Part 1)

Booth 5135 Career Zone - Exhibit Hall - San Diego Convention Center

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Exhibit Hall Event In Person Only

11:00 - 11:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE17

Tech Talk: Optical Fiber Sensors

Optica Booth 2939

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Special Event In Person Only

11:30 - 12:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SF1

AIM Photonics and the Next PIC Generation

Expo Theater III - San Diego Convention Center

Event Details

Session Description:

The session will be divided amongst our three speakers and will provide insight into our technology offerings across the product development cycle, from design through assembly and test. The session topics are: AP-SUNY PDK and component design for high performance photonic integrated circuits; AIM Photonics MPW and test, assembly, and packaging options; and AIM Photonics PIC technology and perspective on the future of silicon photonics and electronics.

Moderator:

David Harame, Chief Operating Officer; Director of EPDA, Test, Assembly and Packaging and Process Development, AIM Photonics, USA

Panelists:

David Harame, Chief Operating Officer; Director of EPDA, Test, Assembly and Packaging and Process Development, AIM Photonics, USA
AIM Photonics MPW and Test, Assembly, and Packaging Options

John Bowers, Co-Director, AIM Photonics; Distinguished Professor and Director of the Institute for Energy Efficiency, Univ. of California, Santa Barbara, USA
AIM Photonics PIC Technology and Perspective on the Future of Silicon Photonics and Electronics

Chris Poulton, Vice President of Silicon Photonics, Analog Photonics, USA
AIM Photonics APSUNY PDK for High Performance Photonic Integrated Circuits

Biographies:

John Bowers, Co-Director, AIM Photonics; Distinguished Professor and Director of the Institute for Energy Efficiency, Univ. of California, Santa Barbara, USA
Dr. John Bowers serves as an executive on AIM Photonics’ Strategic Advisory Board, which provides strategic guidance and direction to the institute’s executive management team. Bowers is also the director of the Institute for Energy Efficiency and a distinguished professor in the Departments of Electrical and Computer Engineering and Materials at University of California, Santa Barbara.

David Harame, Chief Operating Officer; Director of EPDA, Test, Assembly and Packaging and Process Development, AIM Photonics, USADr. David Harame is the Director of EPDA, Test & Packaging, and Process Development for SUNY Polytechnic Institute. Harame is also AIM Photonics’ COO, responsible for the organization’s photonic technologies, EPDA process design kits, and test, assembly and packaging operations. Harame is an IEEE Fellow and has held numerous industry leadership roles throughout his career.

Chris Poulton, Vice President of Silicon Photonics, Analog Photonics, USA
Christopher Poulton is the Vice President of Silicon Photonics at Analog Photonics where he leads the silicon photonics team developing PICs for optical communications and optical phased array LiDAR. He received a B.S. degree in Electrical Engineering from the University of Colorado Boulder, and a M.S. degree in Electrical Engineering from MIT where he was an NSF Fellow and an MIT Presidential Fellow.

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Exhibit Hall Event In Person Only

11:30 - 13:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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DCS1

Data Center Summit Panel I: Scaling Datacenter Interconnect

Expo Theater II - San Diego Convention Center

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Exhibit Hall Event In Person Only

12:00 - 12:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE18

Tech Talk: Standards for High-Speed Optical Networking

Optica Booth 2939

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Special Event In Person Only

12:00 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE4

OFC and Co-sponsors Awards Ceremony and Luncheon

Ballroom 20BCD - San Diego Convention Center

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Special Event In Person Only

12:15 - 13:45 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE10

OFC Career Zone: How to (Re) Start Your Career in the Midst of a Pandemic (Part 2)

Booth 5135 Career Zone - Exhibit Hall - San Diego Convention Center

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Exhibit Hall Event In Person Only

12:30 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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MW2

Market Watch II: The Path to Co-Packaged Optics for Switching Applications

Expo Theater I - San Diego Convention Center

Event Details

Session Description:

The industry continues to debate the merits of co-packaged optics and is now reaching the point where deployments of Ethernet switches with co-packaged optics are viable. But viability doesn’t always translate into commercial reality. This panel will review the benefits and challenges around the deployment of co-packaged Ethernet switches from both a technical and commercial perspective. How is CPO affecting investments by the optical and Ethernet component supplier landscape and when will we see deployments in commercially meaningful volumes?

Moderator:

Robert Blum, Senior Director of Marketing and New Business, Intel, USA

Panelists:

Andreas Bechtolsheim, Chairman and Chief Development Officer, Arista Networks, USA
Challenges with Co-Packaged Optics

James W. Stewart, Director, Optical Technologies, Meta (formerly Facebook), USA
51Tbps Fabric Switch Design Concept Using 3.2 Tbps Near Package Optics Modules for Market

Near Margalit, Vice President and General Manager, Optical Systems Division, Broadcom, USA
The Benefit of Using Soldered Silicon Photonics Chiplets in Package (SCIP) for Co-Packaged Systems

Greg Young, Vice President & General Manager, Cisco, USA

Ed Doe, Vice President and General Manager, Switch & Fabric Group, Intel, USA
The Path Forward to Co-Packaging

Puneet Agarwal, Vice President and CTO for Data Center, Marvell, USA

Biographies:

Puneet Agarwal, Vice President and CTO for Data Center, Marvell, USA
Puneet Agarwal is VP and CTO for Data Center at Marvell. Previously Puneet was the Founder and CTO of Innovium and he joined Marvell through the Innovium acquisition. At Innovium, Puneet led the creation and development of the Teralynx family of scalable, high bandwidth, low latency switching products now deployed in volume at the largest Data Centers in the world. Puneet has over 25 years of experience in defining and architecting groundbreaking products. Previously Puneet was Senior Director and Distinguished Engineer at Broadcom. During his 10-year tenure, Puneet led the architecture definition and execution of Broadcom’s Tomahawk and Trident Product lines (among many other product lines). He has over 100+ patents granted. Puneet is active in the IEEE and IETF standard bodies and was part of the Open Network Foundation (ONF’s) technical advisory group. He holds a BS in Computer Science & Engineering from IIT Delhi.

Andreas Bechtolsheim, Chairman and Chief Development Officer, Arista Networks, USA
Andreas “Andy” Bechtolsheim is Chairman, Chief Development Officer and Co-Founder of　Arista Networks, a leading vendor of cloud networking solutions. Previously, Andy was a Co-Founder and Chief System Architect at Sun Microsystems, responsible for next generation server, storage, and network architectures. As a private venture investor, Andy has been involved in the funding of numerous companies including Google, VMware, Mellanox, and Brocade. He has served on the Board of Directors of over 25 companies, the majority of which went public or were acquired. Andy earned a M.S. in Computer Engineering from Carnegie Mellon University in 1976. He was a doctoral student in Computer Engineering at Stanford University from 1977 to 1982. He has been honored with a Fulbright scholarship, a Studienstiftung scholarship, the Stanford Entrepreneur Company of the year award, the Smithsonian Leadership Award for Innovation, and he is a member of the National Academy of Engineering.

Robert Blum, Senior Director of Marketing and New Business, Intel, USA
Robert Blum is General Manager of New Business and Sr. Director of Marketing for Intel’s Silicon Photonics Product Division. Prior to joining Intel, Robert was Director of Strategic Marketing at Oclaro Inc., and held various Director of Product Management and Marketing roles for Oclaro’s telecommunications products and consumer laser portfolio. Before joining Oclaro, Robert was Product Line Manager for optical transmission components at JDS Uniphase Corporation and held various engineering and marketing management roles at Gemfire Corporation, all in California. Robert worked at Deutsche Telekom’s research labs in Darmstadt, Germany, while completing his master’s thesis and holds a doctorate degree in Physics from the University of Technology in Hamburg. He has also studied and done research at Ecole Polytechnique Fédérale in Lausanne, Switzerland, and at Stanford University, California.

Ed Doe, Vice President and General Manager, Switch & Fabric Group, Intel, USA
Edward (Ed) V. Doe is vice president of the Connectivity Group and general manager of the Intel Switch & Fabric Group (XFG) at Intel Corporation. He leads the Barefoot Division (BXD), and is responsible for delivering hardware, software, and system products technology, including high-performance interconnects and Ethernet switches.

Prior to joining Intel during the Barefoot acquisition in 2019, Doe was chief business officer of Barefoot Networks where he was responsible for strategy, corporate development, product, marketing, business development, and field/customer engineering. Before joining Barefoot, Doe held the position of Director, Product Management at Broadcom, covering various product lines including StrataXGS switches, NetXtreme NICs and SmartNICs, StrataGX ARM SoCs, scalable fabrics, and network processors. Earlier in his career, Doe was product line manager at Nortel and was responsible for launching Layer 3 to the Stackable Ethernet Switch product line, introduction of Gigabit Ethernet to the Stackable switch product line (BayStack), coverage of the smart service modules for the Layer 3 modular switch.

Doe holds a bachelor’s degree in electrical engineering from the University of Western Ontario, London, Ontario, Canada and two years of graduate studies towards a master’s degree in electrical engineering at Stanford University.

Near Margalit, VP and General Manager, Optical Systems Division, Broadcom, USA
Bio not available.

James W. Stewart, Director, Optical Technologies, Meta (formerly Facebook)
James W. Stewart has over 30 years of experience developing photonic hardware for optical communications. Currently, he works at Meta supporting the development of optical networking hardware for their hyper-scale data centers. James has been granted over 25 US patents and has authored/co-authored numerous publications for conferences and journals on optical communication subsystems.

Greg Young, VP & General Manager, Cisco, USA
Bio not available.

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13:00 - 13:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE24

Nagel Lounge Talk: The New Resilience

Nagel Lounge Booth 2839 - Exhibit Hall - San Diego Convention Center

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13:00 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SF2

The Future of PON: 25G or 50G?

Expo Theater III - San Diego Convention Center

Event Details

Session Description:

This session will review the two potential candidates for the next generation of PON. It will have representation from operators and vendors on both sides of the issue.

Moderators:

Frank Effenberger, VP Fixed Access Network Lab, Futurewei Technologies, USA; Ed Harstead, Lead Technology Strategist, Nokia, USA

Panelists:

Ed Harstead, Lead Technology Strategist, Nokia, USA
Is This Town Big Enough for Both 25G and 50G PON?

Frank Effenberger, VP Fixed Access Network Lab, Futurewei Technologies, USA
The Evolution of the PON Market

Edward Walter, Area Manager Network Planning, AT&T, USA
Future of Broadband After XGS PON

Philippe Chanclou, Team Manager, Fixed Access Networks (FAN), Orange Labs, France
Optical Access Network Ready for the 50G PON

Ian Horsley, Senior Manager Access Network Research, British Telecom, United Kingdom
25G, 50G or Both?

Dezhi Zhang, Optical Access Senior Expert and Project Manager, China Telcom, China
50G PON, a Promising Evolutionary Path

Biographies:

Philippe Chanclou, Team Manager, Fixed Access Networks (FAN), Orange Labs, France
Philippe Chanclou received the Ph. D. and Habilitation degrees in 1999 and 2007. Since 2004, he joined Orange Labs where he was engaged in research on the next generation optical access networks. He is manager of Fixed Access Networks team which involves on FTTx topics for Home, Enterprise and Antenna.

Frank Effenberger, VP Fixed Access Network Lab, Futurewei Technologies, USA
Frank has researched fixed access systems for over 25 years at Bellcore, Quantum Bridge, and now at Futurewei, where he is the company Fellow responsible for this area. He has contributed to the design of many PON systems, the dominant access technology today, and to their standardization by holding leadership roles at ITU-T, IEEE 802.3 and ETSI.

Ed Harstead, Lead Technology Strategist, Nokia, USA
In the 1990s Ed Harstead led standardization and implementation of first gen TDM PON technologies and managed first gen WDM PON research.
Ed spent most of the 2000s in DWDM transport product management.
In the current decade he has been supporting the Nokia CTO for Fixed Networks, with a recent focus on the standardization of high speed PON.

Ian Horsley, Senior Manager Access Network Research, British Telecom, United Kingdom
Ian joined BT after a Masters in Engineering from Cambridge University. He has been involved in the design and standardisation of a wide range of DSL technologies and currently leads BT’s access research including optical access. He has (co-)authored 20 patents. He is vice-chair of the working party for transport aspects of access in the ITU-T SG15.

Ed Walter, Area Manager Network Planning, AT&T, USAEd Walter joined AT&T in 2000 and is currently a Director Member Technical Staff within the Converged Access Architecture organization. Ed has been engaged in Access ideation and development since 2006 when he joined the AT&T Lightspeed project to deploy Broadband/IPTV over xDSL and PON. He is currently leading test teams that develop and certify Broadband and Mobility Transport technologies at AT&T. He is an AT&T 2020 Science and Technology Medal Recipient awarded for his significant contributions to Broadband Access technologies, as well as a prolific inventor with over 100 Patents.

Dezhi Zhang, Optical Access Senior Expert and Project Manager, China Telcom, China
Dezhi Zhang currently works with China Telecom Research Institute, Optical access senior expert in China Telecom Group, mainly engaged in technical research, innovation and application in the field of optical access, actively participating in the standardization research of ITU-T. Mr. ZHANG is a co-editor of several ITU-T Recommendations for PON technologies.

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13:30 - 15:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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DCS2

Data Center Summit Panel II: Solving the Challenge of Moving Datacenters to the Network Edge

Expo Theater II - San Diego Convention Center

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Exhibit Hall Event In Person Only

14:00 - 14:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE19

Tech Talk: Link Design and Modeling for Intra Data Center Optical Interconnects

Optica Booth 2939

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Special Event In Person Only

SpE25

Nagel Lounge Talk: Expect the Unexpected

Nagel Lounge Booth 2839 - Exhibit Hall - San Diego Convention Center

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14:00 - 16:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tu2A

Symposia: Emerging Photonic Interconnects and Architectures for Femtojoule per Bit Intra Data Center Links Session I

Moderator: Madeleine Glick, Columbia University, United States
Room 1AB - San Diego Convention Center

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14:00 - 14:30

(UTC - 08:00)

Tu2A.1
Optical Communication for Data Center GPUs

Presenter: William Dally, NVIDIA and Stanford

Presentation Details Paper
Invited

Modern data center GPUs communicate on die, die-to-die on an interposer, on packages, on PCBs, and between PCBs. At each level, the metrics that matter are energy/bit, cost, and density. This talk will describe the communication needs of modern data center GPUs, the role optics plays in these systems, and NVIDIA's research efforts in building future optical communication systems for GPUs.Authors: William Dally, NVIDIA and Stanford
14:30 - 15:00

(UTC - 08:00)

Tu2A.2
(Integrated or not?) Laser Source for a few pJ/bit DWDM Links

Presenter: Sylvie Menezo, SCINTIL Photonics

Presentation Details
Invited

Abstract not available.Authors: Sylvie Menezo, SCINTIL Photonics
15:00 - 15:30

(UTC - 08:00)

Tu2A.3
Optical I/O for Multi-Tbps Applications: Status and Directions

Presenter: Mark Wade, Ayar Labs

Presentation Details Paper
Invited

We are on the cusp of a new generation of photonic technologies and products being integrated more deeply into compute ASICs than ever before. New demands will be placed on device performance, integration schemes, and cost structure. Roadmaps looking forward will need to optimize for energy efficiency, bandwidth density, and cost. I will review the current status, trends, and key open questions related to near-term activities as well as longer term R&D directions.Authors: Mark Wade, Ayar Labs
15:30 - 16:00

(UTC - 08:00)

Tu2A.4
Bringing 2-Phase Immersion Cooling to Hyperscale Cloud

Presenter: Ashish Raniwala, Microsoft

Presentation Details Paper
Invited

The advent of high-TDP chips is pushing cloud providers towards liquid cooling. Microsoft is advancing and deploying 2-phase immersion cooling in Azure. We discuss the trends, the challenges, and the opportunities in this space.Authors: Ashish Raniwala, Microsoft

Tu2B

Panel: What is the Role of Machine Learning in Optical Access Networks?

Room 2 - San Diego Convention Center

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Special Event

Tu2C

Panel: Technologies for Breaking the Metro/Access Barrier

Room 3 - San Diego Convention Center

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Special Event

Tu2D

Light Source for Datacom Applications

Presider: Reza Motaghian, Amazon Web Services, United States
Room 6C - San Diego Convention Center

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14:00 - 15:00

(UTC - 08:00)

Tu2D.1
Performance and Reliability of Advanced CW Lasers for Silicon Photonics Applications

Presenter: John Johnson, Broadcom Inc.

Presentation Details Paper
Tutorial

Co-Packaged Optics (CPO) using Silicon Photonics Chiplets in Package (SCIP) is an essential technology for flattening the power consumption curve for Networking and Compute applications in Hyperscale Datacenters. CW lasers are integral to the operation of these systems and are an important part of the power solution. This talk will review the impact of advanced CW lasers on the architecture, performance, efficiency and reliability of CPO systems. © 2022 BroadcomAuthors: John Johnson, Broadcom Inc. / Kenneth Bacher, Broadcom Inc. / Rebecca Schaevitz, Broadcom Inc. / Vivek Raghunathan, Broadcom Inc.
15:00 - 15:15

(UTC - 08:00)

Tu2D.2
Integrated Optical Transmitter With Micro-Transfer-Printed Widely Tunable III-v-on-Si Laser

Presenter: Jing Zhang, Ghent University-imec

Presentation Details Paper

We demonstrate a C-band optical transmitter with an integrated widely-tunable III-V-on-silicon laser on the imec iSiPP50G platform using micro-transfer printing. Back-to-back operation at 40 Gbit/s non-return-to-zero On-Off keying over the C-band is presented.Authors: Jing Zhang, Ghent University-imec / Emadreza Soltanian, Ghent University-imec / Bahawal Haq, Ghent University-imec / Stefan Ertl, EV Group / Johanna Rimbock, EV Group / Bozena Matuskova, EV Group / Emanuele Pelucchi, Tyndall National Institute / Agnieszka Gocalinska, Tyndall National Institute / Joris Van Campenhout, imec / Guy Lepage, imec / Peter Verheyen, imec / Wim Bogaerts, Ghent University-imec / Gunther Roelkens, Ghent University-imec
15:15 - 15:30

(UTC - 08:00)

Tu2D.3
Up to 600 Gbit/s Data Transmission Over 100 m of Single Multi-Mode Fiber Using 4×λ 850-940 nm VCSELs

Presenter: Lukasz Chorchos, VI Systems GmbH

Presentation Details Paper

We demonstrate parallel high speed data transmission over single multimode fiber using VCSELs operating in the SWDM wavelength range (850 nm – 940 nm). Total demonstrated throughput of such system reaches 500 Gbit/s with 4-PAM modulation and 600 Gbit/s with DMT modulation.Authors: Nikolay Ledentsov Jr., VI Systems GmbH / Christoph Kottke, Fraunhofer Heinrich Hertz Institute / Lukasz Chorchos, VI Systems GmbH / Vitaly Shchukin, VI Systems GmbH / Oleg Makarov, VI Systems GmbH / Marwan Bou Sanayeh, VI Systems GmbH / Vladimir Kalosha, VI Systems GmbH / Volker Jungnickel, Fraunhofer Heinrich Hertz Institute / Ronald Freund, Fraunhofer Heinrich Hertz Institute / Jaroslaw Turkiewicz, Warsaw University of Technology / Nikolay Ledentsov, VI Systems GmbH
15:30 - 15:45

(UTC - 08:00)

Tu2D.4
Behavioral PAM-4 VCSEL Model Using Stochastic Multimode Rate Equations for Link Design Optimization

Presenter: Alirio Melgar, Georgia Institute of Technology

Presentation Details Paper

A stochastic multimode laser model aimed at optimizing optical links is proposed. The model simulates experimental results from commercial VCSELs and depicts transverse mode effects that are increasingly important in high-speed PAM-4 links.Authors: Alirio Melgar, Georgia Institute of Technology / Varghese Thomas, Georgia Institute of Technology / Benjamin Klein, Kennesaw State University / Itshak Kalifa, Nvidia Networking / Paraskevas Bakopoulos, Nvidia Networking / Elad Mentovich, Nvidia Networking / Stephen Ralph, Georgia Institute of Technology
15:45 - 16:00

(UTC - 08:00)

Tu2D.5
Highly Reliable 106 Gb/s PAM-4 850 nm Multi-Mode VCSEL for 800G Ethernet Applications

Presenter: Mirko Hoser, II-VI Incorporated

Presentation Details Paper

This paper reviews II-VI’s 106 Gb/s PAM-4 multi-mode VCSELs for commercial 800G transceiver applications. The VCSEL provides 27 GHz bandwidth, RIN of -150 dB/Hz, 0.25 nm spectral width and shows an excellent reliability.Authors: Mirko Hoser, II-VI Incorporated / Wolfgang Kaiser, II-VI Incorporated / David Quandt, II-VI Incorporated / Julián Bueno, II-VI Incorporated / Stéphanie Saintenoy, II-VI Incorporated / Sven Eitel, II-VI Incorporated

Tu2E

Comb and Multi-wavelength Sources

Presider: Matthew Sysak, Ayar Labs, United States
Room 6D - San Diego Convention Center

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14:00 - 14:30

(UTC - 08:00)

Tu2E.1
Heterogeneous III-v-on Silicon Nitride Mode Locked Lasers

Presenter: Bart Kuyken, Ghent University - imec

Presentation Details Paper
Invited

We demonstrate heterogeneously integrated passively mode-locked lasers by microtransfer printing III-V semiconductor optical amplifiers on a silicon nitride photonic chip. Hereby, dense and low-noise optical laser comb sources can be made.Authors: Bart Kuyken, Ghent University - imec
14:30 - 14:45

(UTC - 08:00)

Tu2E.2
High-Temperature Error-Free Operation in a Heterogeneous Silicon Quantum Dot Comb Laser

Presenter: Geza Kurczveil, Hewlett Packard Laboratories

Presentation Details Paper

We show error-free operation in over 40 comb lines from a heterogeneous silicon comb laser operating continuous-wave at a substrate temperature of 50°C. Such devices are attractive sources for optical interconnects in next-generation HPC systems.Authors: Geza Kurczveil, Hewlett Packard Laboratories / Xian Xiao, Hewlett Packard Laboratories / Antoine Descos, Hewlett Packard Laboratories / Sudharsanan Srinivasan, Hewlett Packard Laboratories / Di Liang, Hewlett Packard Laboratories / Ray Beausoleil, Hewlett Packard Laboratories
14:45 - 15:00

(UTC - 08:00)

Tu2E.3
Dual Laser Indium Phosphide Photonic Integrated Circuits for Remote Active Carbon Dioxide Sensing

Presenter: Jonathan Klamkin, University of California, Santa Barbara

Presentation Details Paper

Two generations of indium phosphide photonic integrated circuits were fabricated, characterized, and their performance compared. Successful sampling of carbon dioxide was performed in a laboratory setting under continuous wave sampling.Authors: Fengqiao Sang, University of California, Santa Barbara / Victoria Rosborough, University of California, Santa Barbara / Joseph Fridlander, University of California, Santa Barbara / Fabrizio Gambini, NASA Goddard Space Flight Center / Simone Šuran Brunelli, University of California, Santa Barbara / Jeffrey Chen, NASA Goddard Space Flight Center / Stephan Kawa, NASA Goddard Space Flight Center / Kenji Numata, NASA Goddard Space Flight Center / Mark Stephen, NASA Goddard Space Flight Center / Larry Coldren, University of California, Santa Barbara / Jonathan Klamkin, University of California, Santa Barbara
15:00 - 15:15

(UTC - 08:00)

Tu2E.4
16 Wavelengths Comb Source Using Large-Scale Hybrid Photonic Integration

Presenter: Stefano Grillanda, Nokia Bell Labs

Presentation Details Paper

We demonstrate a 16 wavelengths comb source using hybrid integration of 16 gain chips, 32 balls lenses and an arrayed waveguide grating, with total output power >20 mW, SMSR > 56 dB, and kHz-scale linewidths.Authors: Stefano Grillanda, Nokia Bell Labs / Cristian Bolle, Nokia Bell Labs / Mark Cappuzzo, Nokia Bell Labs / Rick Papazian, Nokia Bell Labs / Bob Farah, Nokia Bell Labs / Nicolas Fontaine, Nokia Bell Labs / Mikael Mazur, Nokia Bell Labs / Rose Kopf, Nokia Bell Labs / Mark Earnshaw, Nokia Bell Labs
15:15 - 15:30

(UTC - 08:00)

Tu2E.5
Demonstration of a Hybrid III-v/Si Multi-Wavelength DFB Laser for High-Bandwidth Density I/O Applications

Presenter: Ranjeet Kumar, Intel Corporation

Presentation Details Paper

We demonstrate a 4-wavelength DFB laser with >8dBm output power per wavelength, <±0.5dB power variations, 140GHz wavelength spacing, and <-140dB/Hz RIN. For data transmission at 64 Gb/s, we obtained comparable performance to a benchtop laser.Authors: Ranjeet Kumar, Intel Corporation / Duanni Huang, Intel Corporation / Meer Sakib, Intel Corporation / Guan-Lin Su, Intel Corporation / Chaoxuan Ma, Intel Corporation / Xinru Wu, Intel Corporation / Haisheng Rong, Intel Corporation

Tu2F

High Capacity Networks

Presider: Dirk Van Den Borne, Juniper Networks Inc., Germany
Room 6E - San Diego Convention Center

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14:00 - 15:00

(UTC - 08:00)

Tu2F.1
Building a Global Content Provider Network at Scale

Presenter: Alexander Nikolaidis, Facebook Inc.

Presentation Details Paper
Tutorial

This tutorial covers scaling the backbone network of a global content provider. Key constraints on network growth are classified and scaling strategies discussed. Optimizations and architecture changes for higher scale are presented.Authors: Alexander Nikolaidis, Facebook Inc. / John Eason, Facebook Inc. / Jeff Rahn, Facebook Inc. / Elizabeth Rivera Hartling, Facebook Inc.
15:00 - 15:15

(UTC - 08:00)

Tu2F.2
High-Capacity 400Gb/s Real-Time Transmission Over SCUBA110 Fibers for DCI/Metro/Long-Haul Networks

Presenter: Benyuan Zhu, OFS Laboratories

Presentation Details Paper

We demonstrate real-time transmission 23.2 Tb/s (58x400Gb/s) DWDM signals over 1507km of G.654E SCUBA110 fiber using 400ZR+ pluggable coherent transceiver modules, additionally, 26Tb/s (65x400Gb/s) is transmitted over 200km SCUBA110 fiber link using 400ZR pluggable modules.Authors: Benyuan Zhu, OFS Laboratories / Tommy Geisler, OFS / Peter Borel, OFS / R Jensen, OFS / Matthias Stegmaier, OFS / Bera Palsdottir, OFS / David Peckham, OFS / Robert Lingle, OFS / Man Yan, OFS Laboratories / David DiGiovanni, OFS Laboratories

Tu2G

Optical Access Networks for Mobile, Industry and More

Presider: Marco Ruffini, University of Dublin Trinity College, Ireland
Room 6F - San Diego Convention Center

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14:00 - 14:30

(UTC - 08:00)

Tu2G.1
New Use-Cases for PONs Beyond Residential Services

Presenter: Rene Bonk, Nokia Bell Labs

Presentation Details Paper
Invited

New use cases for PON are highlighted in critical network infrastructures and industrial factories. Introduction of more flexibility and increased determinism including bounded latency, low jitter, highly secure and available connectivity over PON is addressed.Authors: Rene Bonk, Nokia Bell Labs / Thomas Pfeiffer, Nokia Bell Labs
14:30 - 14:45

(UTC - 08:00)

Tu2G.2
Radio-Over-Fiber Transmission Supporting 65536-QAM at 25GHz Band With High-Pass Delta-Sigma Modulation and RF Fading Mitigation

Presenter: Yixiao Zhu, Shanghai Jiao Tong University

Presentation Details Paper

We experimentally demonstrate radio-over-fiber transmission of 44.4Gb/s 65536-QAM at 25GHz employing 2-bit high-pass delta-sigma modulation. 0.19% EVM is achieved after 10km C-band SSMF transmission, and dispersion-induced RF fading is mitigated by differential skew-enabled spectral shaping.Authors: Yixiao Zhu, Shanghai Jiao Tong University / Xiansong Fang, Peking University / Longjie Yin, Shanghai Jiao Tong University / Fan Zhang, Peking University / Weisheng Hu, Shanghai Jiao Tong University
14:45 - 15:15

(UTC - 08:00)

Tu2G.3
Latency-Aware Network Architectures for 5G Backhaul and Fronthaul

Presenter: David Larrabeiti, Universidad Carlos III de Madrid

Presentation Details Paper
Invited

5G poses important challenges regarding latency management, specially in fronthaul and backhaul traffic transport. Operators are combining standards in search of a unified architecture that features virtualization, programmability and performance control.Authors: David Larrabeiti, Universidad Carlos III de Madrid / Gabriel Otero, Universidad Carlos III de Madrid / Juan Pedro Fernández-Palacios, Telefónica Global CTO / Luis M. Contreras, Telefónica Global CTO / Jose A. Hernández, Universidad Carlos III de Madrid
15:15 - 15:30

(UTC - 08:00)

Tu2G.4
Multipoint-to-Point Data Aggregation Using a Single Receiver and Frequency-Multiplexed Intensity-Modulated ONUs

Presenter: Zichuan Zhou, University College London

Presentation Details Paper

We demonstrate 2.5-GHz-spaced frequency multiplexing capable of aggregating 64 intensity-modulated end-users using low-speed electronic and optoelectronic components. All optical network units (ONUs) achieved high per-user capacity with dedicated optical bands, enabling future low latency applications.Authors: Zichuan Zhou, University College London / Jinlong Wei, Huawei Technologies Duesseldorf GmbH / Eric Sillekens, University College London / Callum Deakin, University College London / Ronit Sohanpal, University College London / Yuan Luo, The Chinese University of Hong Kong (Shenzhen) / Radan Slavik, University of Southampton / Zhixin Liu, University College London
15:30 - 15:45

(UTC - 08:00)

Tu2G.5
White Rabbit Protocol Enhanced TDM-PON With Nanoseconds Clock and Data Recovery and Picoseconds Time Synchronization Accuracy

Presenter: Yisong Zhao, Beijing University of Posts and Telecommunications

Presentation Details Paper

White Rabbit protocol enhanced TDM-PON is proposed first time for fast clock and data recovery (CDR) and accurate time synchronization. Experimental results validate 38ns CDR time without cost-high burst-mode receiver and 390ps average time skew.Authors: Yisong Zhao, Beijing University of Posts and Telecommunications / Xuwei Xue, Beijing University of Posts and Telecommunications / Bingli Guo, Beijing University of Posts and Telecommunications / Zuoqing Zhao, Beijing University of Posts and Telecommunications / Yuanzhi Guo, Beijing University of Posts and Telecommunications / Shanguo Huang, Beijing University of Posts and Telecommunications
15:45 - 16:00

(UTC - 08:00)

Tu2G.6
Demonstration of Industrial-Grade Passive Optical Network

Presenter: Konstantinos (Kostas) Christodoulopoulos, Nokia Bell Labs Germany

Presentation Details Paper

We demonstrate a TDM-PON operating according to industrial-grade standards. Using a suitably configured PON-MAC and jitter compensation we achieved constant low latency upstream transmission and successful interworking with a TSN network and time-critical flows.Authors: Konstantinos (Kostas) Christodoulopoulos, Nokia Bell Labs Germany / Sarvesh Bidkar, Nokia Bell Labs Germany / Wolfram Lautenschlaeger, Nokia Bell Labs Germany / Thomas Pfeiffer, Nokia Bell Labs Germany / Rene Bonk, Nokia Bell Labs Germany

Tu2H

Panel: What are the Parallelization Technologies for Cost and Energy Efficient 1.6Tb Links?

Room 7AB - San Diego Convention Center

Event Details

Organizers:

Tomoyuki Akiyama, Fujitsu Limited, Japan
Long Chen, Cisco Systems, USA
Gloria Hoefler, Pacific Biosciences, Inc., USA
Zuowei Shen, Google LLC, USA

Description:

The deployment of 400G optics is ramping up quickly. On the short reach side, the direct-detection 100G/lambda PAM4 in parallel (DR4) or CWDM (FR4) are implemented at low cost and high energy efficiency with either EMLs or silicon photonic transmitters. On the longer reach side, 400G ZR / ZR+ / Open ROADM coherent pluggables bring fast, streamlined network architectures to hyperscale data centers and carriers. The next generation 800G PAM4 optics with DR8 is expected to deploy next year, followed by 800G coherent solutions.

What would the generation of 1.6T optics look like? One frequently cited viewpoint is that as the data rate goes up, coherent becomes more advantageous because of its higher link margin. Would simplified coherent, or coherent light, become energy efficient to compete against direct-detection in short reach? For coherent, 1x 1.6Tb, 2x800G, 4x400G, which one is more cost and energy efficient? For direct-detect, would the 200G/lambda still be PAM4, or higher format such as PAM6 at lower baud rate? Would it be 8 parallel fibers, or a mixture of parallel fibers and CWDM (2xCWDM4 or 1xCWDM8)? Also, as the chip-to-chip interconnects gain more visibility, what would the optics look like for ultimate efficiency?

The panelists would share their viewpoints on these topics and open discussion with the audience.

Speakers:

Xiang Zhou, Google, USA
1.6Tb/s Data Center Optics: Is Coherent the Right Choice?

Arash Farhoodfar, Marvell, USA
Advanced DSPs Enable Next Generation Low Power Optical Connectivity

Oliver Sun, Innolight, China
1.6T optics for Next Generation DC

Vasudevan Parthasarathy, Broadcom, USA
1.6Tb/s Coherent Modules for Intra data center: Challenges and Directions for Low Power

Hongbin Zhang, Cisco, USA
1.6T SiPh Coherent Solution for Intra Data Center Interconnection

Sergey Shumarayev, Intel, USA
Going Back to Basics with Co-Packaged Optical Connectivity

Bardia Pezeshki, Avicena Tech, USA
Dense Spatially Multiplexed-Lanes for Short Reach Optics Using Incoherent Optical Sources

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Special Event

Tu2I

Integrated Photonic Subsystems

Presider: Mikael Mazur, Nokia Bell Labs,
Room 8 - San Diego Convention Center

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14:00 - 15:00

(UTC - 08:00)

Tu2I.1
Hybrid Nonlinear Integrated Photonics: From Chipscale Frequency Combs, Ultra Narrow Linewidth Frequency Agile Lasers to Traveling Wave Parametric Amplifiers on Chip

Presenter: Johann Riemensberger, Ecole Polytechnique Federale de Lausanne

Presentation Details Paper
Tutorial

Abstract not available.Authors: Tobias Kippenberg, Ecole Polytechnique Federale de Lausanne / Johann Riemensberger, Ecole Polytechnique Federale de Lausanne
15:00 - 15:15

(UTC - 08:00)

Tu2I.2
Photonic Interferometric Imager With Monolithic Silicon CMOS Photonic Integrated Circuits

Presenter: Humphry Chen, University of California, Davis

Presentation Details Paper

: We demonstrate, for the first time to our knowledge, a monolithically-integrated photonic interferometric imager circuit with on-chip detectors, CMOS trans-impedance-amplifiers, and associated photonic imager components. A proof-of-principle demonstration of interferogram fringe generation will be discussedAuthors: Humphry Chen, University of California, Davis / Mehmet Berkay On, University of California, Davis / Yun-Jhu Lee, University of California, Davis / Li Zhang, University of California, Davis / Roberto Proietti, University of California, Davis / S. J. Ben Yoo, University of California, Davis
15:15 - 15:45

(UTC - 08:00)

Tu2I.3
Narrow Linewidth Lasers for Low-Energy Coherent Communications

Presenter: Grant Brodnik, University of California Santa Barbara

Presentation Details Paper
Invited

We present chip-scale lasers with ~1Hz fundamental linewidths, ~30Hz integral linewidths, and stability better than 2x10-13 (50ms) enabling energy-efficient, ultra-low residual phase error carrier recovery for DSP-free high-capacity coherent communications in tomorrow’s data center interconnects.Authors: Grant Brodnik, University of California Santa Barbara / Mark Harrington, University of California Santa Barbara / John Dallyn, Northern Arizona University / Wei Zhang, National Institute of Standards and Technology / Liron Stern, National Institute of Standards and Technology / Paul Morton, Morton Photonics / Ryan Behunin, Northern Arizona University / Scott Papp, National Institute of Standards and Technology / Daniel Blumenthal, University of California Santa Barbara
15:45 - 16:00

(UTC - 08:00)

Tu2I.4
Photonics-Based 300 GHz Band Wireless Terahertz Link Using 10Gbps Directly-Modulated Monolithically-Integrated Novel Dual-Mode Laser as Beating Light Source

Presenter: Il-Min Lee, ETRI

Presentation Details Paper

We demonstrate a photonics-based 300GHz band wireless terahertz (THz) link using our directly modulated novel dual-mode laser (DML) as the beating light source. We have obtained 10Gbps transmission over a single channel.Authors: Younghoon Kim, ETRI / Dong Woo Park, ETRI / Jinchul Cho, ETRI / Eui Su Lee, ETRI / Da-Hye Choi, ETRI / Jun-Hwan Shin, ETRI / Mugeon Kim, ETRI / Seung-Hyun Cho, ETRI / Sang-Rok Moon, ETRI / Eon-Sang Kim, ETRI / Yongsoon Baek, ETRI / Donghoon Lee, ETRI / Sangho Park, ETRI / Young Ahn Leem, ETRI / Il-Min Lee, ETRI / Kyung Hyun Park, ETRI

14:30 - 15:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SF3

DARPA Photonics Programs

Expo Theater III - San Diego Convention Center

Event Details

Session Description:

This session will provide a broad overview of DARPA's photonics portfolio; specifically highlighting PIPES and several other programs. There will be a focus on the technical PIPES results and a higher-level update on the other DARPA programs.

Moderator:

Gordon Keeler, Program Manager, DARPA, USA

Panelists:

Gordon Keeler, Program Manager, DARPA, USA
DARPA PIPES and Related Photonics Programs

Keren Bergman, Charles Batchelor Professor of Electrical Engineering; Scientific Director, Center for Integrated Science and Engineering, Dept. of Electrical Engineering, Columbia Univ., USA
Energy Efficient Multi-terabit Photonic Connectivity for Disaggregated Computing

Firooz Aflatouni, Associate Professor, Electrical and Systems Engineering, University of Pennsylvania, USA
Monolithic Electronic-photonic Systems for Low-power Terabit Links

Yohan Frans, VP Wired Communication Engineering, Xilinx, USA
3D-Integrated 16-λ WDM Silicon Photonics Transceivers

Biographies:

Firooz Aflatouni, Associate Professor, Electrical and Systems Engineering, University of Pennsylvania, USA
Firooz Aflatouni received a Ph.D. degree from USC in 2011. He was a post-doctoral scholar at Caltech before joining UPenn in 2014, where he is an Associate Professor. His research interests include electronic-photonic co-design with applications in communication, computation, sensing, imaging, and bio-technology.

Keren Bergman, Charles Batchelor Professor of Electrical Engineering; Scientific Director, Center for Integrated Science and Engineering, Dept. of Electrical Engineering, Columbia Univ., USA
Keren Bergman received a Ph.D. at M.I.T. and currently is the Charles Batchelor Professor of Electrical Engineering at Columbia University where she leads research programs at the intersection of computing and photonics. She is the recipient of the IEEE Photonics Engineering Award and is a Fellow of Optica and IEEE.

Yohan Frans, VP Wired Communication Engineering, Xilinx, USA
Yohan Frans received electrical engineering B.S degree from Bandung Institute of Technology, Indonesia, in 1995 and M.S. degree from Stanford University, California, in 2001. From 2001 to 2012, he was with Rambus Inc. where he worked on high-performance serial links and memory interfaces. Since 2012 he has been with Xilinx Inc, San Jose, CA. He is currently leading high-speed electrical and optical transceiver developments as VP of Engineering in Wired and Wireless Communications Group.

Gordon Keeler, Program Manager, DARPA, USA
Gordon Keeler received a Ph.D. in Applied Physics from Stanford University before joining Sandia National Laboratories, where his research focused on compound semiconductor optoelectronics and optical microsystems. He is currently a program manager at DARPA, where he seeks to accelerate the development of emerging electronics, photonics, and integration technologies.

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Exhibit Hall Event In Person Only

14:30 - 16:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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MW3

Market Watch III: Building the Ecosystem for Converged IP/Optical Networks - Beyond 400G pluggables

Expo Theater I - San Diego Convention Center

Event Details

Session Description:

The availability of 400G coherent pluggables enables the integration of WAN optics in routers and brings cost, footprint and power reduction opportunities to IP networks. What are the next hurdles for the industry to overcome in enabling wide-scale deployment of IP/Optical architectures? What level of multi-vendor interoperability is required? This panel provides insights and unique perspectives resulting from early converged IP/Optical deployments or real network studies, including commentary around photonic line system compatibility, migration plans of existing networks and essential capabilities required from an operational perspective.

Moderator:

Helen Xenos, Sr. Director, Portfolio Marketing, Ciena Corp., USA

Panelists:

Glenn Wellbrock, Director, Optical Transport Network - Architecture, Design & Planning, Verizon, USA
Beyond 400G, Pluggable AND/OR Embedded?

Jeffrey Valley, VP, IP Consulting Engineering, Network Infrastructure, Nokia, Canada
IP/Optical Integration with Coherent Routing: Reducing OPEX with Planning & Automation

Robert Keys, Sr. Director of Optical Transmission R&D, Ciena, Canada
You CAN Have it All: Converging IP+Optical While Streamling Operational Workflows

Mattias Fridström, Vice President & Chief Evangelist, Arelion, USA

Biographies:

Robert Keys, Sr. Director of Optical Transmission R&D, Ciena, CanadaRobert Keys is a Senior Director of Optical Transmission R&D at Ciena. In this role, Robert oversees all aspects of optical systems transmission including link performance assurance, planning tools, and optical hardware development. In his 30+ years of experience, Robert has held several leadership positions including VP of Packet Optical R&D at Juniper Networks where he developed optical systems for switching and routing platforms, as well as CTO at BTI Systems.

Jeffrey Valley, VP, IP Consulting Engineering, Network Infrastructure, Nokia, Canada
Jeffrey Valley, MSc, leads IP Consulting Engineering for North America in Nokia’s Network Infrastructure group. Jeffrey is responsible for making sure our products align with industry and customer requirements in the region and works to assist our customers with design and architecture decisions for next-generation IP networks. His areas of interest include evolving architectures for residential and business services including 400G, segment routing, EVPNs, 5G mobile backhaul, IP network security including DDoS protections, network automation with NETCONF/YANG and other APIs, and the industry shift toward containerization of high-performance network elements.

Glenn Wellbrock, Director, Optical Transport Network - Architecture, Design & Planning, Verizon, USA
Glenn Wellbrock is the director of optical transport network architecture, design and planning at Verizon, where he is responsible for the development and deployment of new technologies for the access, metro and long haul transport infrastructure. Prior to this position, Wellbrock ran the advanced technology lab, established evaluation criteria and set engineering guidelines for all backbone transport equipment as well as various positions within network operations. In addition to his more than 30 years at Verizon, Wellbrock was responsible for product architecture within the U.S. optical networks group at Marconi and product planning at Qplus Networks with a specific focus on developing alternative modulation techniques.

Helen Xenos, Sr. Director, Portfolio Marketing, Ciena Corp., USA
Helen Xenos is Senior Director of Portfolio Marketing at Ciena. She is responsible for introducing Ciena’s converged packet optical solutions and technologies to market, including Ciena’s industry leading WaveLogic high-capacity coherent optical solutions. She is a frequent blogger and speaker, and enjoys rendering technical speak into the exciting implications it means for network providers. Across her 20+ yr career in the telecommunications industry, Ms. Xenos’ roles include product management, systems engineering and test engineering.

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Exhibit Hall Event In Person Only

15:00 - 15:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE26

Nagel lounge Talk: Volunteer, Give Back & Grow

Nagel Lounge Booth 2839 - Exhibit Hall - San Diego Convention Center

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Exhibit Hall Event In Person Only

15:30 - 16:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SF4

The Converged Mobile Xhaul and FTTH Fiber Access Opportunity

Expo Theater II - San Diego Convention Center

Event Details

Session Description:

A single converged fiber fixed and mobile access network has been an area of interest for FMC and wholesale providers ever since the first FTTH deployments. With new advancements in PON technologies and the roll out of 5G and the demands that puts on fronthaul, midhaul and backhaul, what is the reality today and in years to come to deploy a single cost effective fiber access network?

Moderator:

Bernd Hesse, BBF Marketing Chair, DZS, Germany

Panelists:

Andrew Bender, Chief Technology Officer and BD Leader, DZSi, USA
For Network and Service Convergence, Timing is Everything

Yuanqiu Luo, Director of Optical Access Standards, Futurewei, USA
Optical Access Technologies for xHaul

Ed Walter, Director Member of Technical Staff, AT&T, USA
The Future of Converged Networks

Julie Kunstler, Chief Analyst, OMDIA, USA
PON for Converged Access – Focus on xHaul

Rajash Yadav, Associate Fellow, Verizon, USA
Flavors of Wireline and Wireless Networks Convergence

Ron Heron, Director of Network and Portfolio Strategy, Nokia, USA
Presentation title to be determined.

Biographies:

Andrew Bender, Chief Technology Officer and BD Leader, DZSi, USA
Andrew Bender serves as Chief Technology Officer for DZS, where he is responsible for developing, coordinating, and promoting the technology strategy for the company. He joined DZS in October 2020 to help expand the solutions space for DZS to SDN, mobile broadband and 5G technologies. Mr. Bender has over 20 years of broad ranging experience in the carrier networking, infrastructure and software sectors spanning Kubernetes and cloud native, webscale applications, NFV, SDN, mobile access / edge / core, video and streaming media, IMS / RCS, DOCSIS, multiservice access and transport network technology areas.

Frank Effenberger, Fellow, Futurewei, USA
Dr. Effenberger has worked in the optical access field at Bellcore, Quantum Bridge Communications (Motorola), and Futurewei Technologies, where he is now the Fellow for fixed access network technology. His team works on forward-looking fiber, copper, and coax access technologies, with several “world’s first” prototypes and trials. Frank is the rapporteur for ITU-T Q2/15, and chair of IEEE 802.3cp, is a Fellow of the OSA and the IEEE, and holds 130 US patents.

Ron Heron, Director of Network and Portfolio Strategy, Nokia, USA
Ronald Heron is responsible for next generation access fiber strategies at Nokia. As an Electrical Engineer from Concordia University in Montreal, he has guided development and deployment of FTTH, DSL, radio and long-haul fiber networks, first at Bell Canada, then Alcatel and now Nokia. Based in Ottawa, Canada, he provides CTO guidance and is an active contributor to industry fora and optical access conferences around the world.

Bernd Hesse, BBF Marketing Chair, DZS, Germany
Bernd Hesse is an established expert in the international telecommunications market with over 30 years of experience in the optical carrier Ethernet and access markets. He is currently Vice President Global Business Development with DZS, focused on international business development/partnerships and thought leadership while representing the company in the Broadband Forum (BBF). Bernd serves on the BBF Board of Directors, which appointed him as Chief Marketing Officer and Marketing and BASe Chair. In addition to instituting the Marketing Councils, he successfully established the BASe (Broadband Acceleration Seminar events) Program.

Julie Kunstler, Chief Analyst, OMDIA, USA
Julie Kunstler is Chief Analyst within Omdia’s Broadband Access Intelligence Service. Julie has several decades of experience in the communications components, equipment, and software industry. She is responsible for market analysis of wireline and wireless broadband access technologies and networks, focusing on developing technologies such as next-gen PON. Julie has worked as an executive, investor, and board member for communications companies. Having served in these numerous roles, she understands what it takes for new communications technologies to be deployed in large numbers, across multiple geographies, and for different applications and customer types. Julie brings her knowledge of the pressure on operators to support bandwidth-hungry applications along with the margin requirements of the ecosystem. She is a regular participant at industry events around the globe.

Ed Walter, Director Member of Technical Staff, AT&T, USA
Ed Walter joined AT&T in 2000 and is currently a Director Member Technical Staff within the Converged Access Architecture organization. Ed has been engaged in Access ideation and development since 2006 when he joined the AT&T Lightspeed project to deploy Broadband/IPTV over xDSL and PON. He is currently leading test teams that develop and certify Broadband and Mobility Transport technologies at AT&T. He is an AT&T 2020 Science and Technology Medal Recipient awarded for his significant contributions to Broadband Access technologies, as well as a prolific inventor with over 100 Patents.

Rajash Yadav, Associate Fellow, Verizon, USA
Rajesh Yadav is an Associate Fellow at Verizon Communications with 26+ years’ experience in telecommunication network architecture and design. He is the chief network architect for Verizon’s access network with primary focus on Verizon’s FTTP deployment and its evolution. His current work is focused on deployment of next generation universal access networks for residential, business and wireless xHaul services using NG-PON2 technology and convergence of wireline and wireless networks towards a common 5G core infrastructure. He holds a Bachelor of Engineering degree in Computer Science and Engineering from Bangalore University, India and a Master’s degree in Computer Engineering from Syracuse University, Syracuse, NY

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Exhibit Hall Event In Person Only

16:00 - 17:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SF5

An OIF Update on Electrical Rates: 112G Technical Closure and the Latest Progress and Challenges for 224G to Create the Next Speed Node

Expo Theater III - San Diego Convention Center

Event Details

Session Description:

OIF industry experts will provide an update on the 112 Gbps technical work as it completes, and the tradeoffs to reach this point in maturity. The panel will then turn their attention to the next speed node under development and give insights on how our latest work on 244G is progressing and share the latest industry ideas to address these challenges. Join us for the latest technical updates and a live Q&A where the power/performance/reach specifications we create here will be critical for chip/backplane systems in the future as well as 800Gbps, 1.6Gbps and 3.2Gbps networking solutions.

Moderator:
Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA

Panelists:

Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA
System approaches using CEI-112G and a look beyond to using CEI-224G

Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA
CEI-112G Channel Updates and the Path Forward to CEI-224G Channels

Cathy Liu, Distinguished Engineer and Director, SerDes Architecture and Modeling Group, Broadcom Inc., USA
CEI-112G MR/LR Updates and CEI-224G Challenges

Mike Li, Fellow and Technologist for High-Speed I/O and Interconnects, Intel, USA
CEI-112G XSR/XSR+/VSR Updates, and CEI-224G Challenges and Paths

John Calvin, Sr. Strategic Planner, Keysight Technologies, USA
Measurement and Validation Principals in Advancing From CEI-112G to CEI-224G

Biographies:

John Calvin, Sr. Strategic Planner, Keysight Technologies, USA
John Calvin is a strategic planner and hyperscale network technology lead for Keysight Technologies. John has been bridging the physical layer measurement science gaps of emerging Telecom and DataCom development efforts for 20 years.He has chaired multiple physical layer interoperability working groups and is currently serving as a contributing member to IEEE 802.3, OIF-CEI, InfiniBand and PCIe development efforts. John holds a BSEE from Washington State University and his graduate level studies in signal processing from Stanford University.He works and lives from his Keysight field office in Clarkston Washington at the confluence of the Snake and Clearwater rivers.

Mike Li, Fellow and Technologist for High-Speed I/O and Interconnects, Intel, USA
Dr. Peng (Mike) Li is an Intel Fellow and the technologist for high-speed I/O and interconnects at Intel Corporation. He serves as Intel’s technical expert and adviser in high-speed I/O and link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity, from deign validation to high-volume manufacturing (HVM).

Cathy Liu, Distinguished Engineer and Director, SerDes Architecture and Modeling Group, Broadcom Inc., USA
Cathy Ye Liu, distinguished Engineer, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom in 2016. Since 2002, she has been working on high speed transceiver solutions. Previously she has developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents. Cathy has demonstrated her leadership roles in industry standard bodies and forums. Currently Cathy serves as the president of the board of directors of Optical Internetworking Forum (OIF). She also serves as a member of the board of advisors for the department of Electrical & Computer Engineering (ECE) of University of California at Davis, a member of Signal Integrity Journal editorial advisory board, and the co-chair of the DesignCon technical track of high speed signal processing, equalization and coding.

Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA
Dr. Jeffery Maki is a Distinguished Engineer II at Juniper Networks working on cloud optics. For OIF, he is a member of the board of directors, Physical Layer User Group working group chair and technical voter for Juniper Networks. He is a member of the board of directors of the Ethernet Alliance as Treasurer and an IEEE 802.3 Ethernet voter. For the Consortium for On-Board Optics (COBO), he is a member of the board of directors as Treasurer. He is co-chair of the 100G Lambda MSA and a founding member of the QSFP-DD, OSFP, SFP-DD, Open-Eye and OpenZR+ MSAs. He is an OSA and IEEE member. He has a Ph.D. in Optics from The Institute of Optics, University of Rochester, Rochester, New York.

Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA
Nathan Tracy currently serves as OIF’s VP of Marketing and member of the board of directors. During the past ten years he has also served OIF as president, technical committee chair and technical committee vice chair. As a technologist on the system architecture team and manager of industry standards for the Data and Devices business unit at TE Connectivity (TE), Nathan is responsible for driving standards activities and working with key customers to enable new system architectures. Nathan has more than 30 years of experience in technology development, marketing and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets.

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Exhibit Hall Event In Person Only

16:30 - 18:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tu3A

Symposia: Emerging Photonic Interconnects and Architectures for Femtojoule per Bit Intra Data Center Links Session II

Moderator: Hai-Feng Liu, HG Genuine Optics Tech Co Ltd, United States
Room 1AB - San Diego Convention Center

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16:30 - 17:00

(UTC - 08:00)

Tu3A.1
Photonics in the Package: DARPA PIPES and Related Programs

Presenter: Gordon Keeler, DARPA

Presentation Details Paper
Invited

DARPA is pursuing innovation in photonic materials, components, and electronic-photonic integration to realize efficient optical signaling technologies for microelectronics. This talk describes goals and accomplishments of the PIPES program and related DARPA optical microsystem investments.Authors: Gordon Keeler, DARPA
17:00 - 17:30

(UTC - 08:00)

Tu3A.2
Realizing Pb/s IO With Silicon Photonic Chiplets

Presenter: Keren Bergman, Columbia University

Presentation Details Paper
Invited

Computing performance is increasingly bottlenecked by the energy and communications costs of interconnection networks. We show how comb driven dense-WDM silicon photonics can realize Pb/s scale chip escape bandwidths with sub-pJ/bit energy consumption.Authors: Keren Bergman, Columbia University
17:30 - 18:00

(UTC - 08:00)

Tu3A.3
Glass Interposer for High-Density Photonic Packaging

Presenter: Lars Brusberg, Corning Research & Development Corporation

Presentation Details Paper
Invited

A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.Authors: Lars Brusberg, Corning Research & Development Corporation / Jason R. Grenier, Corning Research & Development Corporation / Sükrü Ekin Kocabas, Corning Research & Development Corporation / Aramais R. Zakharian, Corning Research & Development Corporation / Lucas W. Yeary, Corning Research & Development Corporation / Daniel W. Levesque, Corning Research & Development Corporation / Barry J. Paddock, Corning Research & Development Corporation / Robert A. Bellman, Corning Research & Development Corporation / Robin M. Force, Corning Research & Development Corporation / Chad C. Terwilliger, Corning Research & Development Corporation / Clifford G. Sutton, Corning Research & Development Corporation / Jeffrey Clark, Corning Research & Development Corporation / Katerina Rousseva, Corning Research & Development Corporation
18:00 - 18:30

(UTC - 08:00)

Tu3A.4
Review of Optical and Electrical Packaging Technologies for Energy Efficient Datacentre Transceivers

Presenter: Peter O'Brien, Tyndall National Institute

Presentation Details Paper
Invited

We present an analysis of optical and electrical packaging technologies under development to maximise the operating efficiencies of transceiver modules. This includes a review of packaging materials, new wafer-level assembly techniques and automated manufacturing processes.Authors: Peter O'Brien, Tyndall National Institute / Kamil Gradkowski, Tyndall National Institute / Padraic Morrissey, Tyndall National Institute / Kemal Aygun, Intel ATTD / Ravi Mahajan, Intel ATTD / Kaveh Hosseini, Intel PSG - USA / Finian Rogers, Intel PSG - Ireland

Tu3B

Optical Subsystem Implementations

Presider: Zhensheng Jia, CableLabs, United States
Room 2 - San Diego Convention Center

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16:30 - 17:00

(UTC - 08:00)

Tu3B.1
Coherent DSP and System Integration Technologies for 800G

Presenter: Tony Wang, Marvell Technology Inc.

Presentation Details Paper
Invited

This paper discusses challenges in achieving low-power coherent pluggables for 800G, and innovations required to overcome those challenges. Recent progress in the areas of system integration and low-power DSP design and implementation will be surveyed.Authors: Tony Wang, Marvell Technology Inc. / Hai Xu, Marvell Technology Inc. / Alejandro Castrillon, Marvell Technology Inc. / Marcos Macchi, Marvell Technology Inc. / Alfredo Taddei, Marvell Technology Inc. / Damian Morero, Marvell Technology Inc. / Hungchan Chien, Marvell Technology Inc. / Oscar Agazzi, Marvell Technology Inc.
17:00 - 17:15

(UTC - 08:00)

Tu3B.2
On the Performance of Digital Resolution Enhancement and Waterfilling in Digital Subcarrier Multiplexing Systems With Low-Resolution DACs

Presenter: Trung-Hien Nguyen, Huawei Technologies France, OCT lab.

Presentation Details Paper

Digital resolution enhancement is experimentally demonstrated for 800G 107 Gbaud 8-subcarrier PCS-256QAM employing waterfilling. 1.4 dB SNR and 1 dB Q2-factor gains are obtained using 4-bit DAC resolution at 1.125 samples/symbol.Authors: Trung-Hien Nguyen, Huawei Technologies France, OCT lab. / Youssef Nasser, Huawei Technologies France, OCT lab. / Yu Zhao, Huawei Technologies France, OCT lab. / Sami Mumtaz, Huawei Technologies France, OCT lab. / Abel Lorences-Riesgo, Huawei Technologies France, OCT lab. / Celestino Sanches Martins, Huawei Technologies France, OCT lab. / Gabriel Charlet, Huawei Technologies France, OCT lab. / Stefanos Dris, Huawei Technologies France, OCT lab.
17:15 - 17:30

(UTC - 08:00)

Tu3B.3
Complementary Polarization-Diversity Self-Coherent Homodyne Receiver With Rapid Polarization Tracking for Remote LO

Presenter: Honglin Ji, The University of Melbourne

Presentation Details Paper

We propose a complementary polarization-diversity coherent receiver (C-PDCR) based on complementary polarization detection. The proposed C-PDCR features rapid polarization tracking for remote LO using electronic DSP. The robustness is verified by a 1.08-Tb/s dual-polarization PCS-256QAM signal with up to 314-Krad/s polarization tracking speed.Authors: Honglin Ji, The University of Melbourne / Jingchi Li, Shanghai Jiao Tong University / Xingfeng Li, Shanghai Jiao Tong University / Shuangyu Dong, The University of Melbourne / Zhaopeng Xu, The University of Melbourne / Yikai Su, Shanghai Jiao Tong University / William Shieh, The University of Melbourne
17:30 - 17:45

(UTC - 08:00)

Tu3B.4
Capacity Region Bounds for K-User Optical WDM Channels With Peak Power Constraints

Presenter: Viswanathan Ramachandran, TU Eindhoven

Presentation Details Paper

We study an optical WDM channel from an interference channel viewpoint. An achievable rate region that strictly outperforms treating interference as noise is presented, along with a capacity region outer bound.Authors: Viswanathan Ramachandran, TU Eindhoven / Gabriele Liga, TU Eindhoven / Astrid Barreiro, TU Eindhoven / Alex Alvarado, TU Eindhoven
17:45 - 18:00

(UTC - 08:00)

Tu3B.5
SDM-TDM Reception Based on MIMO Carrier Phase Recovery Technique for Scalable SDM Transmission

Presenter: Kohki Shibahara, NTT Network Innovation Laboratories

Presentation Details Paper

We propose MIMO carrier phase recovery (CPR) scheme and its application into SDM-TDM reception. The use of MIMO-CPR with SDM-TDM reception simplifies local oscillator input architecture, hence enabling three-mode-multiplexed 4600-km transmission with single coherent receiver.Authors: Kohki Shibahara, NTT Network Innovation Laboratories / Megumi Hoshi, NTT Network Innovation Laboratories / Yutaka Miyamoto, NTT Network Innovation Laboratories
18:00 - 18:15

(UTC - 08:00)

Tu3B.6
Weak Carrier Assisted Phase Retrieval Receiver

Presenter: qi wu, Shanghai Jiao Tong University

Presentation Details Paper

We propose a weak carrier-assisted phase-retrieval receiver to obtain initial phase for modified Gerchberg-Saxton algorithm with fast convergence to realize hardware-efficient, computationally-efficient, and pilot-symbol-free optical field recovery, and compare it with other phase retrieval schemes.Authors: qi wu, Shanghai Jiao Tong University / Yixiao Zhu, Shanghai Jiao Tong University / Weisheng Hu, Shanghai Jiao Tong University
18:15 - 18:30

(UTC - 08:00)

Tu3B.7
Influence of SOA Parameters on the Nonlinear Impairments Experienced by QAM Modulated Signals

Presenter: Djalal Bendimerad, Huawei Technologies France

Presentation Details Paper

We propose an experimental method to tune SOA model parameters that yields good prediction abilities of nonlinear distortions induced on PCS-QAM signals. We show that reducing SOA nonlinearities is achieved by a trade-off between a high Psat and a low αH.Authors: Djalal Bendimerad, Huawei Technologies France / Romain Brenot, Huawei Technologies France / Dylan Le Gac, Huawei Technologies France / Abel Lorences-Riesgo, Huawei Technologies France / Marti Sales-Llopis, Huawei Technologies France / Yann Frignac, Huawei Technologies France / Gabriel Charlet, Huawei Technologies France

Tu3C

VLC for Indoor Applications

Presider: Dominic Schulz, Fraunhofer Heinrich Hertz Institute, Germany
Room 3 - San Diego Convention Center

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16:30 - 16:45

(UTC - 08:00)

Tu3C.1
High-Speed White Light Visible Light Communication (VLC) Based on Semipolar (20-21) Blue Micro-Light Emitting Diode (μ-LED)

Presenter: Yun-Han chang, National Yang Ming Chiao Tung University

Presentation Details Paper

We demonstrate a record 2.473-Gbit/s white-light visible-light-communication (VLC) using semipolar (20-21) blue InGaN/GaN μ-LED with yellow-phosphor. The measured 3-dB-bandwidth of blue and white lights are 1042.5 MHz and 772.4 MHz respectively.Authors: Yun-Han chang, National Yang Ming Chiao Tung University / Fang-Jyun Liou, National Yang Ming Chiao Tung University / Yu-Ming Huang, National Yang Ming Chiao Tung University / Wahyu Hendra Gunawan, National Yang Ming Chiao Tung University / Chi-Wai Chow, National Yang Ming Chiao Tung University / Hao-Chung Kuo, National Yang Ming Chiao Tung University / Yang Liu, Philips Electronics Ltd / Chien-Hung Yeh, Feng Chia University
16:45 - 17:00

(UTC - 08:00)

Tu3C.2
8.205-Gbit/s Visible Light Communication Utilizing 4×4 Si-Substrate μLED-Based Photodetector Array

Presenter: Wenqing Niu, Fudan University

Presentation Details Paper

We demonstrate an 8.205-Gbit/s VLC transmission over 0.5-m free-space link based on 4×4 Si-substrate InGaN/GaN MQW micro-LED-based photodetector array. Adaptive bit-power-loading scheme is applied to maximize the spectral efficiency for the OFDM VLC system.Authors: Wenqing Niu, Fudan University / Jianyang Shi, Fudan University / Zengyi Xu, Fudan University / Dong Li, Fudan University / Weihuang Xiao, Nanchang University / Guangxu Wang, Nanchang University / Jianli Zhang, Nanchang University / Zhixue He, Peng Cheng Laboratory / Chao Shen, Fudan University / Nan Chi, Fudan University
17:00 - 17:15

(UTC - 08:00)

Tu3C.3
Wide Field-of-View (FOV) Light-Diffusing Fiber Optical Transmitter for Rolling Shutter Based Optical Camera Communication (OCC)

Presenter: Chi-Wai Chow, National Yang Ming Chiao Tung University

Presentation Details Paper

We propose a wide field-of-view (FOV) light-diffusing-fiber (LDF) transmitter optical-camera-communication (OCC). Pixel-row-per-bit-neural-network (PRPB-NN) is employed for rolling-shutter-pattern decoding. PRPB-NN provides efficient decoding at 360o around LDF circumference and 160o Rx rotation-angle at 2100-bit/s.Authors: Deng-Cheng Tsai, National Yang Ming Chiao Tung University / Yun-Han chang, National Yang Ming Chiao Tung University / Yang Liu, Philips Electronics Ltd / Chi-Wai Chow, National Yang Ming Chiao Tung University / Yun-Shen Lin, National Yang Ming Chiao Tung University / Chien-Hung Yeh, Feng Chia University
17:15 - 18:15

(UTC - 08:00)

Tu3C.4
Evolution of Optical-Wireless Communications

Presenter: KE WANG, Royal Melbourne Institute of Technology

Presentation Details Paper
Tutorial

Optical wireless communications (OWC) explore the broad unregulated optical spectrum to provide high-speed wireless communications, which are promising in beyond-5G. We will review the recent developments of short-range OWC technologies and systems.Authors: KE WANG, Royal Melbourne Institute of Technology / Tingting Song, The University of Melbourne / Yitong Wang, Royal Melbourne Institute of Technology / Chengwei Fang, Royal Melbourne Institute of Technology / Ampalavanapillai Nirmalathas, The University of Melbourne / Christina Lim, The University of Melbourne / Elaine Wong, The University of Melbourne / Sithamparanathan Kandeepan, Royal Melbourne Institute of Technology

Tu3D

Narrow Linewidth and Tunable Lasers

Presider: Gloria Hofler, Pacific Biosciences Inc, United States
Room 6C - San Diego Convention Center

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16:30 - 17:00

(UTC - 08:00)

Tu3D.1
Integrated Ultra-Narrow Linewidth Stabilized SBS Lasers

Presenter: Daniel Blumenthal, University of California Santa Barbara

Presentation Details Paper
Invited

Frequency-stabilized, spectrally-pure lasers are key to precision scientific applications including quantum, atomic clocks, and metrology. We discuss progress towards integrating aspects of these systems to the chip-scale using Si3N4 Brillouin lasers and ultra-high Q resonators.Authors: Daniel Blumenthal, University of California Santa Barbara
17:00 - 17:15

(UTC - 08:00)

Tu3D.2
Semiconductor Laser Stabilized by a 4 Meter Coil-Waveguide Resonator

Presenter: KAIKAI LIU, University of California, Santa Barbara

Presentation Details Paper

We stabilize a semiconductor laser to a photonic-integrated, Si3N4, 4 meter coil resonator, achieving thermorefractive-noise-limited frequency noise. The laser exhibits a record low 87 Hz 1/p and 2.1 kHz -separation integral linewidth and 2.6×10-13 fractional frequency stability.Authors: KAIKAI LIU, University of California, Santa Barbara / Nitesh Chauhan, University of California, Santa Barbara / Jiawei Wang, University of California, Santa Barbara / Andrei Isichenko, University of California, Santa Barbara / Grant Brodnik, University of California, Santa Barbara / Paul Morton, Morton Photonics Inc / Ryan Behunin, Northern Arizona University / Scott Papp, University of Colorado Boulder / Daniel Blumenthal, University of California, Santa Barbara
17:15 - 17:30

(UTC - 08:00)

Tu3D.3
Hybrid InP-SiN Microring-Resonator Based Tunable Laser With High Output Power and Narrow Linewidth for High Capacity Coherent Systems

Presenter: cosimo calo, III-V Lab

Presentation Details Paper

A hybrid InP/SiN tunable laser based on microring resonators exhibiting 40mW fiber-coupled output power and 5kHz linewidth is demonstrated. The device shows performance comparable with commercial external cavity lasers in 90GBd 64QAM coherent system.Authors: cosimo calo, III-V Lab / Kaoutar Benyahya, Nokia Bell Labs - Paris-Saclay / Haik MARDOYAN, Nokia Bell Labs - Paris-Saclay / Philippe Charbonnier, III-V Lab / Davide Sacchetto, Ligentec SA / Michael Zervas, Ligentec SA / Karim Mekhazni, III-V Lab / Delphine Lanteri, III-V Lab / Harry Gariah, III-V Lab / Catherine Fortin, III-V Lab / Nicolas Vaissière, III-V Lab / Antoine Elias, III-V Lab / Olivier Parillaud, III-V Lab / Franck Mallecot, III-V Lab / Jean Decobert, III-V Lab / Frederic Pommereau, III-V Lab / Jérémie Renaudier, Nokia Bell Labs - Paris-Saclay
17:30 - 17:45

(UTC - 08:00)

Tu3D.4
A Hybrid-Integrated External Cavity Laser With Ultra-Wide Wavelength Tuning Range and High Side-Mode Suppression

Presenter: Yuyao Guo, Shanghai Jiao Tong University

Presentation Details Paper

We present a III-V/Si3N4 hybrid-integrated tunable laser. The laser shows a record of ~170-nm tuning range with a side mode suppression ratio above 64 dB and an intrinsic linewidth below 2.8 kHz.Authors: Yuyao Guo, Shanghai Jiao Tong University / Xinhang Li, Shanghai Jiao Tong University / Weihan Xu, Shanghai Jiao Tong University / Chuxin Liu, Shanghai Jiao Tong University / Minhui Jin, Shanghai Jiao Tong University / Liangjun Lu, Shanghai Jiao Tong University / Jingya Xie, University of Shanghai for Science and Technology / Anton Stroganov, LIGENTEC SA / Jianping Chen, Shanghai Jiao Tong University / Linjie Zhou, Shanghai Jiao Tong University
17:45 - 18:00

(UTC - 08:00)

Tu3D.5
Nanosecond-Scale Hitless λ-Switching of SOA-Integrated Electro-Optically Tunable RTF Laser With +/-2.5-GHz Dynamic Frequency Accuracy

Presenter: Yuta Ueda, Nippon Telegraph and Telephone Corporation

Presentation Details Paper

We developed an SOA-integrated electro-optically tunable RTF laser with suppressed spurious wavelengths during dynamic tuning. The laser exhibited hitless (no interference with other channels) nanosecond-scale λ-switching for 128-Gbps coherent signals.Authors: Yuta Ueda, Nippon Telegraph and Telephone Corporation / Yusuke Saito, Nippon Telegraph and Telephone Corporation / Takahiko Shindo, Nippon Telegraph and Telephone Corporation / Shigeru Kanazawa, Nippon Telegraph and Telephone Corporation / Wataru Kobayashi, Nippon Telegraph and Telephone Corporation / Hideaki Matsuzaki, Nippon Telegraph and Telephone Corporation / Mitsuteru Ishikawa, Nippon Telegraph and Telephone Corporation
18:00 - 18:15

(UTC - 08:00)

Tu3D.6
Nano-ITLA Based on Multi-Channel Interference Widely Tunable Laser

Presenter: Zifeng Chen, Huazhong University of Science and Technology

Presentation Details Paper

A nano-iTLA based on multi-channel interference widely tunable lasers was demonstrated for the first time. The module exhibits a tuning range > 48 nm, SMSR > 45 dB and Lorentzian linewidth < 100 kHz.Authors: Zifeng Chen, Huazhong University of Science and Technology / Kuankuan Wang, Huazhong University of Science and Technology / Quanan Chen, Ori-Chip Optoelectronics Technology Co. Ltd / Chun Jiang, Ori-Chip Optoelectronics Technology Co. Ltd / Qiaoyin Lu, Huazhong University of Science and Technology / Weihua Guo, Huazhong University of Science and Technology
18:15 - 18:30

(UTC - 08:00)

Tu3D.7
Sub-10 kHz Intrinsic Linewidth Extended Cavity DBR Laser on InP Generic Foundry Platform

Presenter: Rakesh Ranjan Kumar, Aarhus University

Presentation Details Paper

We report an extended-cavity DBR laser with an intrinsic linewidth of 10 kHz and an output power of ~18 mW at an injection current of < 100 mA, on an InP generic foundry platform.Authors: Rakesh Ranjan Kumar, Aarhus University / Andreas Hansel, Aarhus University / Monica Far Brusatori, Aarhus University / Lars Nielsen, Aarhus University / Niklas Hedegaard Arent, Aarhus University / Nicolas Volet, Aarhus University / Martijn J. R. Heck, Aarhus University

Tu3E

Raman Amplification and Frequency Comb Generation

Presider: Raja Ahmad, Molex, United States
Room 6D - San Diego Convention Center

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16:30 - 16:45

(UTC - 08:00)

Tu3E.1
Investigation of Wideband Distributed Raman Amplification in a Few-Mode Fiber Link

Presenter: Georg Rademacher, National Inst of Information & Comm Tech

Presentation Details Paper

We experimentally investigate distributed Raman amplification in a graded-index three-mode fiber over more than 80 nm signal bandwidth. We measured gain of up to 6 dB with 0.3 dB mode-dependence when pumping only the highest-order modes.Authors: Georg Rademacher, National Inst of Information & Comm Tech / Ruben Luis, National Inst of Information & Comm Tech / Benjamin Puttnam, National Inst of Information & Comm Tech / Juan Carlos Alvarado Zacarias, University of Central Florida / Rodrigo Amezcua Correa, University of Central Florida / Kazuhiko Aikawa, Fujikura Ltd. / Yoshinari Awaji, National Inst of Information & Comm Tech / Hideaki Furukawa, National Inst of Information & Comm Tech
16:45 - 17:00

(UTC - 08:00)

Tu3E.2
210 nm E, S, C and L Band Multistage Discrete Raman Amplifier

Presenter: Pratim Hazarika, Aston University

Presentation Details Paper

We demonstrate a multistage Raman amplifier for 210 nm signal amplification with 15 dB gain and 8.1 dB maximum noise figure enabling ESCL-band transmission with 10 Gb/s NRZ signals over 70 km SMF.Authors: Pratim Hazarika, Aston University / Mingming Tan, Aston University / Aleksandr Donodin, Aston University / Ian Phillips, Aston University / Paul Harper, Aston University / Ming-Jun Li, Corning Incorporated / Wladek Forysiak, Aston University
17:00 - 17:30

(UTC - 08:00)

Tu3E.3
Harnessing Multi-Octave Coherent Light Using Anti-Resonant Fibers

Presenter: David Novoa, University of the Basque Country

Presentation Details Paper
Invited

Gas-filled anti-resonant fibers enable an ultrafast source of phase-stable waveforms with tunable ultra-broadband spectrum spanning from the ultraviolet to the terahertz. The system features higher brightness than synchrotrons, opening horizons in spectroscopy and strong-field physics.Authors: David Novoa, University of the Basque Country
17:30 - 17:45

(UTC - 08:00)

Tu3E.4
Generation of Optical Frequency Comb via Cross-Phase Modulation in an SOI Waveguide

Presenter: Yuanfei Zhang, The Chinese University of Hong Kong

Presentation Details Paper

Using temporal Talbot processing followed by cross-phase modulation in a silicon-on-insulator waveguide, we experimentally multiply the repetition rate of a 10-GHz optical pulse train and generate widely spaced optical frequency combs up to 50 GHz.Authors: Yuanfei Zhang, The Chinese University of Hong Kong / Honghui Zhang, The Chinese University of Hong Kong / Chester C.T. Shu, The Chinese University of Hong Kong
17:45 - 18:00

(UTC - 08:00)

Tu3E.5
Generation of Coherent Multi-Wavelength Lights With Hundreds GHz Frequency Spacing From an Injected Fiber Laser With an Intracavity Tunable Micro-Ring Resonator

Presenter: Yi-Jang Hsu, National Yang Ming Chiao Tung University

Presentation Details Paper

Coherent multi-wavelength lights with 133 and 266 GHz frequency spacing are successfully generated from a new fiber laser scheme. The phase-locking characteristics are examined through the auto-correlation contrast as well as the down-converted beating linewidth.Authors: Yen-Chu Chen, National Yang Ming Chiao Tung University / Yi-Jang Hsu, National Yang Ming Chiao Tung University / Yinchieh Lai, National Yang Ming Chiao Tung University

Tu3F

Optical Transport for 5G Applications

Presider: Frank Effenberger, FutureWei Technologies Inc, United States
Room 6E - San Diego Convention Center

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16:30 - 17:00

(UTC - 08:00)

Tu3F.1
Timing and Synchronization in Optical Networks for 5G Transport

Presenter: Nir Laufer, Oscilloquartz SA

Presentation Details
Invited

In this session we will review the options for delivering accurate timing using PTP+Sync-E over OTN/WDM networks. We will focus on out of band optical timing channel which overcome many of the technical and economical challenges and provide a sub 100nsec accuracy.Authors: Nir Laufer, Oscilloquartz SA
17:00 - 17:15

(UTC - 08:00)

Tu3F.2
A Field Trial of 50G TDM-PON Based 5G Small Cell Backhaul

Presenter: Ning Wang, China Mobile Research Institute

Presentation Details Paper

We demonstrate a field trial of 50G TDM-PON based small cell backhaul. Multiple user equipment are connected to two 5G base stations simultaneously. The maximum download speed of each user equipment reaches nearly 1000 Mbps.Authors: Ning Wang, China Mobile Research Institute / Junwei Li, China Mobile Research Institute / Dekun Liu, Huawei Technologies Co., Ltd. / Yu Wu, China Mobile Communications Corporation Group Co., Ltd. / Jinglong Zhu, China Mobile Research Institute / Da Liu, China Mobile Communications Corporation Group Co., Ltd. / Lirong Bai, China Mobile Communications Corporation Group Co., Ltd. / Dechao Zhang, China Mobile Research Institute / Han Li, China Mobile Research Institute / Borui Li, Huawei Technologies Co., Ltd.
17:15 - 17:30

(UTC - 08:00)

Tu3F.3
Stimulated Raman Scattering and Power-Over-Fiber Property of Multi-Core Fiber

Presenter: Hiroyuki Iida, NTT Access Network Service Systems Laboratories

Presentation Details Paper

We show that 4-core multi-core fiber provides 2.6 times higher stimulated Raman scattering threshold than single-core fiber, and potentially enables over 5-km long signal transmission with self-power feeding of more than 600 mW.Authors: Kenji Kurokawa, Kitami Institute of Technology / Hiroyuki Iida, NTT Access Network Service Systems Laboratories / Nobutomo Hanzawa, NTT Access Network Service Systems Laboratories / Takaya Oguma, Kitami Institute of Technology / Yoko Yamashita, NTT Access Network Service Systems Laboratories / Takayoshi Mori, NTT Access Network Service Systems Laboratories / Takashi Matsui, NTT Access Network Service Systems Laboratories / Kazuhide Nakajima, NTT Access Network Service Systems Laboratories
17:30 - 18:00

(UTC - 08:00)

Tu3F.4
Demonstration and Trial of a New CWDM and Circulator Integrated Semi-Active System for 5G Fonthual

Presenter: DEZHI ZHANG, China Telecom

Presentation Details Paper
Invited

We demonstrate a new CWDM and Circulator integrated semi-active system for 5G fronthaul, and key test data. The system can support 6-channel 25 Gbit/s fronthaul channel capability, and support protection switching function, real-time signal power of multiple working wavelengths Online detection function, and reflected interference signal power detection function.Authors: DEZHI ZHANG, China Telecom / Zhe Du, China Telecom / Ming Cheng, China Telecom / Ming Jiang, China Telecom / XinFeng Liu, Fiberhome Telecommunication Technologies Co.,LTD / Xin Li, Jiangsu Etern Company Limited

Tu3G

Novel and Emerging Networks

Presider: Ying-Ju Wang, ColdQuanta, United States
Room 6F - San Diego Convention Center

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16:30 - 17:00

(UTC - 08:00)

Tu3G.1
Optical Neuromorphic Processor at 11 TeraOPs/s Based on Kerr Soliton Crystal Micro-Combs

Presenter: David Moss, Swinburne University of Technology

Presentation Details Paper
Invited

We demonstrate a universal optical vector convolutional accelerator operating at 11 Tera-OPS, generating convolutions of images of 250,000 pixels with 8-bit resolution for 10 kernels simultaneously. We use the same hardware to form a deep optical CNN with ten output neurons, achieving successful recognition of full 10 digits with 88% accuracy. Our approach is scalable and trainable for applications to unmanned vehicle and real-time video recognition.Authors: Mengxi Tan, Swinburne University of Technology / Xingyuan Xu, Monash University / Jiayang Wu, Swinburne University of Technology / Roberto Morandotti, INRS / Arnan Mitchell, RMIT University / Bill Corcoran, Monash University / Sai Chu, City University of Hong Kong / Brent Little, xi'an University / Andreas Boes, RMIT University / Thach Nguyen, RMIT University / Damien Hicks, Swinburne University of Technology / David Moss, Swinburne University of Technology
17:00 - 17:15

(UTC - 08:00)

Tu3G.2
Ultra-low Latency Short Packet Transmission Experiments With Optical Bus Platform Based on PCIe

Presenter: Toshiya Matsuda, NTT Network Service Systems Laboratories

Presentation Details Paper

We propose an optical bus platform architecture that provides an ultra-low latency path for small traffic on metro-scale networks. We experimentally demonstrate that remote memory can be accessed over 25 km in 244.2 μs.Authors: Toshiya Matsuda, NTT Network Service Systems Laboratories / Kota Nishiyama, NTT Network Service Systems Laboratories / Kana Masumoto, NTT Network Service Systems Laboratories / Masahiro Nakagawa, NTT Network Service Systems Laboratories / Takashi Miyamura, NTT Network Service Systems Laboratories
17:15 - 17:30

(UTC - 08:00)

Tu3G.3
High-Speed Time Series Prediction and Classification on an All-Optical Neural Network

Presenter: Aashu Jha, Princeton University

Presentation Details Paper

We experimentally demonstrate high-speed time series prediction and binary classification tasks using an all-optical integrated SiN-based nonlinear photonic node in a time-delay based reservoir architecture.Authors: Aashu Jha, Princeton University / Chaoran Huang, Chinese University of Hong Kong / Hsuan-Tung Peng, Princeton University / Weipeng Zhang, Princeton University / Bhavin Shastri, Queens University / Paul Prucnal, Princeton University
17:30 - 18:00

(UTC - 08:00)

Tu3G.4
What's the Fuss: the Excitement, Prospects and Software/Hardware Challenges of Distributing Entanglement Over a Quantum Network

Presenter: Neil Zimmerman, NIST

Presentation Details Paper
Invited

In this paper, I review the notion of a quantum network, which I define as one that can distribute entanglement between stationary qubits, and then discuss challenges relevant for the Optical Fiber Conference (OFC).Authors: Neil Zimmerman, NIST
18:00 - 18:30

(UTC - 08:00)

Tu3G.5
IOWN for Digital Twin Enabled Societies

Presenter: Masahisa Kawashima, NTT Corporation

Presentation Details Paper
Invited

Achieving the extreme data volume and velocity requirements of digital twin applications energy-efficiently is challenging. IOWN will address this challenge by making architectural shifts in computing and networking with the evolution of optical technologies.Authors: Masahisa Kawashima, NTT Corporation

Tu3H

Enablers and Disrupters in Data Center and HPC

Presider: Brian Taylor, Inphi, United States
Room 7AB - San Diego Convention Center

Add to Schedule

16:30 - 17:00

(UTC - 08:00)

Tu3H.1
Digital Subcarriers: a Universal Technology for Next Generation Optical Networks

Presenter: David Welch, Infinera Corporation

Presentation Details Paper
Invited

Coherent technology can be operated with independent digital subcarriers to realize point-to-point and point-to-multipoint optical networks. Enabled by configurable software management, it creates a simple, scalable, low-cost solution, compatible across network, vendors, and generations.Authors: David Welch, Infinera Corporation / Antonio Napoli, Infinera Corporation / Johan Bäck, Infinera Corporation / Norm Swenson, Infinera Corporation / Warren Sande, Infinera Corporation / João Pedro, Infinera Corporation / Fady Masoud, Infinera Corporation / Aaron Chase, Infinera Corporation / Chris Fludger, Infinera Corporation / Han Sun, Infinera Corporation / Ting-Kuang Chiang, Infinera Corporation / Atul Mathur, Infinera Corporation / Kuang-Tsan Wu, Infinera Corporation
17:00 - 17:30

(UTC - 08:00)

Tu3H.2
New Trend of Open and Disaggregated Optical Networks

Presenter: Dou Liang, Alibaba Group

Presentation Details Paper
Invited

Open and disaggregated systems supporting flexgrid operation and ROADM are being introduced to data center interconnect networks. System integration and network automation are effective to further increase the network efficiency in the future.Authors: Dou Liang, Alibaba Group / Sai Chen, Alibaba Group / Huan Zhang, Alibaba Group / Jingchi Cheng, Alibaba Group / Fan Gao, Alibaba Group / Boyuan Yan, Alibaba Group / Shuai Zhang, Alibaba Group / Zhao Sun, Alibaba Group / Lei Wang, Alibaba Group / Chongjin Xie, Alibaba Group
17:30 - 18:00

(UTC - 08:00)

Tu3H.3
Monolithically Integrable Optical Single Sideband Transmitters for Inter-Datacenter Applications

Presenter: Tianwai Bo, Beijing Institute of Technology

Presentation Details Paper
Invited

We review the monolithically integrable optical single sideband transmitter schemes for inter-datacenter applications. The schemes based on monolithic integration of laser with Mach-Zehnder modulator, optical injection-lock laser, and electro-absorption modulation laser are discussed.Authors: Tianwai Bo, Beijing Institute of Technology / Zhongwei Tan, Beijing Institute of Technology / Hoon Kim, KAIST / Yi Dong, Beijing Institute of Technology
18:00 - 18:15

(UTC - 08:00)

Tu3H.4
DSP-Free IM/DD MDM Optical Interconnection Based on Side-Polished Degenerate-Mode-Selective Fiber Couplers

Presenter: Juhao Li, Peking University

Presentation Details Paper

Low-insertion-loss degenerate-mode-selective fiber couplers for mode demultiplexing are designed and fabricated with side-polishing and mating process, based on which stable 5-LP-mode DSP-free IM/DD MDM optical interconnection over 10 km weakly-coupled FMF are experimentally demonstrated.Authors: Jian Cui, Peking University / Yuyang Gao, Peking University / Jinyi Yu, Peking University / Jiaixn Liu, Peking University / Junchi Jia, Peking University / Yongqi He, Peking University / Zhangyuan Chen, Peking University / Juhao Li, Peking University

Tu3I

Quantum Communications

Presider: Helmut Griesser, ADVA Optical Networking AG, Germany
Room 8 - San Diego Convention Center

Add to Schedule

16:30 - 17:30

(UTC - 08:00)

Tu3I.1
Introduction to Continuous Variable Quantum Key Distribution

Presenter: Takuya Hirano, Gakushuin University

Presentation Details Paper
Tutorial

In this talk, we will review the present status of continuous-variable quantum key distribution, including optical configuration and security analysis, and would like to discuss future prospects for integration with coherent optical communications.Authors: Takuya Hirano, Gakushuin University
17:30 - 18:00

(UTC - 08:00)

Tu3I.2
Quantum Key Distribution in the Service Provider Network

Presenter: Catherine White, BT

Presentation Details Paper
Invited

We review and discuss the practicalities of integrating Quantum Key Distribution within the service provider fiber network.Authors: Catherine White, BT / Adrian Wonfor, University of Cambridge / Paul Wright, BT / Emilio Hugues Salas, BT / Andrew Lord, BT
18:00 - 18:15

(UTC - 08:00)

Tu3I.3
Entanglement Distribution in Installed Fiber With Coexisting Classical Light for Quantum Network Applications

Presenter: Jordan Thomas, Northwestern University

Presentation Details Paper

We show polarization entangled photons coexisting with milliwatt power classical light over 45.6 km of installed optical fiber. The entanglement source has a built-in alignment signal for quantum transmitter-receiver polarization basis alignment.Authors: Jordan Thomas, Northwestern University / Gregory Kanter, Northwestern University / Ely Eastman, Northwestern University / Kim Lee, Northwestern University / Prem Kumar, Northwestern University
18:15 - 18:30

(UTC - 08:00)

Tu3I.4
254.6 Mb/s Secret Key Rate Transmission Over 13.5 km SMF Using PCS-256QAM Super-Channel Continuous Variable Quantum Key Distribution

Presenter: Amirhossein Ghazisaeidi, Nokia Bell Labs France

Presentation Details Paper

We experimentally validate the feasibility of wavelength-division multiplexing for continuous-variable quantum-key-distribution, transmitting four 600 MBaud probabilistically-shaped 256-QAM signals with 4 GHz spacing, achieving total 254.6 Mb/s average secret key rate.Authors: François Roumestan, Nokia Bell Labs France / Amirhossein Ghazisaeidi, Nokia Bell Labs France / Haik MARDOYAN, Nokia Bell Labs France / Jérémie Renaudier, Nokia Bell Labs France / Eleni Diamanti, LIP6 / Philippe Grangier, LCF

18:30 - 20:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE15

Conference Reception – Celebrating International Year of Glass

Ballroom 20BCD - San Diego Convention Center

Event Details Add to Schedule

Special Event In Person Only

19:30 - 21:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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SpE5

Rump Session: Will Quantum Always Remain Basic Research or is it Ready to Power Great Products?

Room 6F - San Diego Convention Center

Event Details Add to Schedule

Special Event

Vaccine and Mask Requirements

2022 Archives

Tuesday, 08 March

8:00 - 10:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Plenary Session

Plenary Talk: Present and Future Silicon Photonics

5G and the Promise of Industry 4.0

Exploration Technologies: Communicating With Spacecraft, Landers, Rovers, and Human Missions

10:00 - 10:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tech Talk: Software Defined Networking in the Cloud - Designs, Operations, and Management

10:00 - 17:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Exhibition

OFC Career Zone Job Fair

10:15 - 10:45 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Conversation with the Plenary Speakers

10:30 - 11:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Data Center Summit Keynote: Market Forces Driving Future Data Center Interconnect Technologies

Ashish Vengsarkar

10:30 - 12:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Market Watch I: State of the Industry

Session Description:

Panelists:

OFC Career Zone: How to (Re) Start Your Career in the Midst of a Pandemic (Part 1)

11:00 - 11:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tech Talk: Optical Fiber Sensors

11:30 - 12:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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AIM Photonics and the Next PIC Generation

11:30 - 13:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Data Center Summit Panel I: Scaling Datacenter Interconnect

12:00 - 12:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tech Talk: Standards for High-Speed Optical Networking

12:00 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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OFC and Co-sponsors Awards Ceremony and Luncheon

12:15 - 13:45 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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OFC Career Zone: How to (Re) Start Your Career in the Midst of a Pandemic (Part 2)

12:30 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Market Watch II: The Path to Co-Packaged Optics for Switching Applications

Session Description:

Panelists:

13:00 - 13:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Nagel Lounge Talk: The New Resilience

13:00 - 14:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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The Future of PON: 25G or 50G?

Session Description:

Panelists:

13:30 - 15:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Data Center Summit Panel II: Solving the Challenge of Moving Datacenters to the Network Edge

14:00 - 14:30 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Tech Talk: Link Design and Modeling for Intra Data Center Optical Interconnects

Nagel Lounge Talk: Expect the Unexpected

14:00 - 16:00 Pacific Time (US & Canada) (Pacific Time (US & Canada), UTC - 08:00)

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Symposia: Emerging Photonic Interconnects and Architectures for Femtojoule per Bit Intra Data Center Links Session I

Optical Communication for Data Center GPUs

(Integrated or not?) Laser Source for a few pJ/bit DWDM Links

Optical I/O for Multi-Tbps Applications: Status and Directions

Bringing 2-Phase Immersion Cooling to Hyperscale Cloud

Panel: What is the Role of Machine Learning in Optical Access Networks?

Panel: Technologies for Breaking the Metro/Access Barrier

Description:

Speakers:

Light Source for Datacom Applications

Performance and Reliability of Advanced CW Lasers for Silicon Photonics Applications