Tu3G.2
Intel 300mm Heterogeneously Integrated Silicon Photonics Technology: a Review of Recent Progress
Presenter: Kejia Li,
Intel Corporation,
United States
We summarize the recent advancements on Intel’s heterogeneously integrated silicon photonics platform designed to enable wide-ranging applications addressing the continued expansion of datacenter connectivity.Authors: Kejia Li, Intel Corporation / Richard Jones, Intel Corporation / Pegah Seddighian, Intel Corporation / Cesar Bartolo Perez, Intel Corporation / Leimeng Zhuang, Intel Corporation / Kadhair Al-hemyari, Intel Corporation / Naim Ahmed, Intel Corporation / Zhi Li, Intel Corporation / Hamed Shams-mousavi, Intel Corporation / Giovanni Gilardi, Intel Corporation / Jeffrey Driscoll, Intel Corporation / Pierre Doussiere, Intel Corporation / Mahbub Satter, Intel Corporation / Jin Huang, Intel Corporation / Ahmadreza Farsaei, Intel Corporation / Aravind Krishnan, Intel Corporation / Karthik Narayanan, Intel Corporation / Felipe Vallini, Intel Corporation / Faraz Monifi, Intel Corporation / Tiehui Su, Intel Corporation / Hari Mahalingam, Intel Corporation / Boris Vulovic, Intel Corporation / David Mathine, Intel Corporation / Yuchun Zhou, Intel Corporation / Daniel Zhu, Intel Corporation / Saeed Fathololoumi, Intel Corporation / Wenhua Lin, Intel Corporation / Raghuram Narayan, Intel Corporation / Reece Defrees, Intel Corporation / Adam Bowles, Intel Corporation / Kelly Magruder, Intel Corporation / Harel Frish, Intel Corporation / Razi Dehghannasiri, Intel Corporation / Kiyoung Lee, Intel Corporation / Josh Keener, Intel Corporation / Shane Yerkes, Intel Corporation / Md Golam Faruk, Intel Corporation / Wenrui Wang, Intel Corporation / Himanshu Jasuja, Intel Corporation / George Ghiurcan, Intel Corporation / Mark Eaton, Intel Corporation / Paul Martin, Intel Corporation / Andrew Devine, Intel Corporation / Randal Appleton, Intel Corporation