10 March 2014
LouVan Communications Inc.
NeoPhotonics Adds Integrated Coherent Transmitter (ICT) To Its Suite of Next Generation PIC-Based Optical Components for 100G Coherent Transport
Integrated Coherent Transmitter (ICT), Narrow Linewidth micro-ITLA and SFF Type 2 ICR Enable Higher Port Density On 100G and Above Coherent Line Cards and Transponders
San Francisco, CA – March 10, 2014 – NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth intensive high speed communications networks, today announced that it is adding an Integrated Coherent Transmitter (ICT) to its suite of next generation small form factor Photonic Integrated Circuit (PIC) based optical components for 100G Coherent Transport. These products utilize Photonic Integration to reduce the size and power requirements of 100G coherent optics to enable higher port densities on linecards and in transponders. NeoPhotonics’ products for 100G will be on exhibit at the Optical Fiber Communications (OFC) Exposition in San Francisco, California, March 11-13.
NeoPhotonics’ Integrated Coherent Transmitter (ICT) is designed to reduce the size of the transmitter optics for a 100G coherent transport link by a factor of four compared to current approaches. The device combines a narrow linewidth tunable laser with a dual polarization QPSK modulator in a single compact package. The modulator section utilizes PIC Integration to combine multiple elements onto a single chip and consists of four InP based Mach-Zehnder modulators including integrated phase and balance control along with VOA functionality and monitor photodiodes. The ICT also provides a second optical output port that can be used as the local oscillator for the coherent receiver, thereby reducing the number of lasers required in a coherent line card or transponder. NeoPhotonics expects to begin sampling the ICT to key customers in the middle of the year.
In addition to the ICT, NeoPhotonics offers both Narrow Linewidth Tunable Lasers (NLW-TL) and Intradyne Coherent Receivers (ICR) in standard form factors and has now added small form factor versions of each of these components to its portfolio. These new products build upon NeoPhotonics’ field-proven PIC technology and take advantage of established, reliable and high-volume manufacturing capability.
The narrow-linewidth, micro-Integrable Tunable Laser Assembly (micro-ITLA) utilizes NeoPhotonics PIC technology, which allows the integration of many active and passive photonic functions within single chip elements, and is designed to fully support the OIF implementation agreement (OIF-microITLA-01.0). This micro-ITLA is designed to support the high optical output power and the narrow linewidths required for next generation coherent network architectures, while at the same time lowering the electrical power consumption and reducing the laser footprint on a line card by more than a factor of three. The micro-ITLA supports off-grid tuning and incorporates a VOA function. NeoPhotonics is currently sampling multiple customers with the micro-ITLA and expects to enter General Availability in the second half of 2014.
NeoPhotonics is also currently sampling to multiple customers its Type 2 Small Form Factor Intradyne Coherent Receiver (Type 2 ICR), which is less than half of the size of currently shipping ICRs. Built on the same PIC integration platform as NeoPhotonics’ standard Type 1 ICR, the Type 2 ICR is designed to fully support the OIF Implementation Agreement (OIF-DPC-RX-01.2) and incorporates an integrated VOA on the signal path, a monitor photodiode (MPD), and automatic gain control operation (AGC). The RF pins are on 1 mm pitch and follow a GSSG format. This versatile device is well-suited for both single incoming channel and multiple incoming channel applications. NeoPhotonics expects the Type 2 ICR to enter General Availability in the second half of 2014 as well.
These small form factor products are also designed to scale to 200G and 400G applications using higher order modulation schemes.
“We are excited to expand our portfolio of PIC based products for 100G transport and beyond with the addition of the ICT, micro-ITLA and Type 2 ICR, which taken together allow us to provide our customers with all of the optical elements necessary for next generation systems” said Tim Jenks, Chairman and CEO of NeoPhotonics. “Photonic integration, such as NeoPhotonics possesses, is the key to providing customers with the high performance, small size and lower electrical power consumption that are necessary to achieve the line card densities that are now required” continued Mr. Jenks.
NeoPhotonics will exhibit its suite of standard and small form factor PIC-based components for 100G coherent line-side applications, along with its 100G client-side CFP and CFP2 transceivers and its next generation transceivers for access networks in Booth 1815 at the Optical Fiber Communications (OFC) Exposition at the Moscone Center in San Francisco, California, March 11-13.
NeoPhotonics is a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth-intensive, high-speed communications networks. The company’s products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley (USA), Japan and China. For additional information, visit www.neophotonics.com.
© 2014 NeoPhotonics Corporation. All rights reserved. NeoPhotonics and the red dot logo are trademarks of NeoPhotonics Corporation. All other marks are the property of their respective owners.
Forward Looking Statements
This press release contains forward-looking statements. Readers are cautioned that these forward-looking statements are only predictions and may differ materially from actual future events or results. These forward-looking statements involve risks and uncertainties, as well as assumptions and current expectations. The Company’s actual results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of these risks, uncertainties and assumptions. The risks and uncertainties that could cause the Company’s results to differ materially from those expressed or implied by such forward-looking statements include but are not limited to: the timing of or costs related to the small form factor products may not be as the Company expects; the demand for the Company’s small form factor products may be volatile or lower than the Company expects; demand for the Company’s small form factor products could decrease from the Company’s expectations due to general conditions in the telecommunications equipment industry, changes in network architectures, local economies, or the world economy generally, and other risks and uncertainties described more fully in the Company’s documents filed with or furnished to the Securities and Exchange Commission.