Thursday, 28 March,
15:00
–
16:00
Theater I
Session Description:
Artificial Intelligence and High-Performance Computing are accelerating the demand for next-generation optical interconnects, with photonic integrated circuits (PICs) as one of the key enablers of this (r)evolution. These wafer-based technologies are ideal for high channel count and high density optical interconnects such as In-Package Optical I/O and Co-Packaged Optics but have unique challenges. This panel will present the challenges and solutions of scaling PIC technology to the desired volumes as seen by different players across the ecosystem. It starts with the foundry, OSAT, and contract manufacturer to actually fabricate the photonic ICs. Wafer probing, and assembly/alignment equipment, in combination with scalable test & measurement solutions is next and play a critical role in the realization of these powerful interconnect technologies. And last but not least, the photonics developer and system integrator will also present their unique perspectives. One key aspect of this panel discussion is partner cooperation across the ecosystem, and how can companies in the industry effectively cooperate and standardize approaches to be able to cost-effectively scale PIC technology to high volumes.
Presented By
Moderator
Jose Pozo, CTO, Optica, Netherlands
Speakers
Dhiraj Bora, CEO at Silitronics, United States
Noam Ophir, Sr. Technical Director OSAT and Silicon Photonics at Jabil, United States
Torsten Vahrenkamp, CEO, FiconTEC, Germany
Vikas Gupta, Director of Product Management at Global Foundries, United States
Jeffrey Maki, Advanced Photonics Coalition and Juniper Networks, United States
Manish Mehta, VP of Marketing and Operations for the Optical Systems Division at Broadcom, United States
Iannick Monfils, CTO at Quantifi Photonics, New Zealand
Ashkan Seyedi, Principal, Silicon Photonics Products at NVIDIA, United States