Recent Advancements in Photonic Test and Packaging Automation

Wednesday, 09 June 16:00 – 16:30

Pi: A rapid succession of radical new micro-robotic implementations has been brought to market to improve production economics for photonic devices.  As photonic devices enter the mainstream, it is imperative that costs follow a rapid downward curve.  The ultra-precision alignment requirements that recur in multiple test and assembly steps have been a roadblock to this and dominate production costs.  Passive alignment techniques show promise for specific situations, but active alignment is here to stay.  By reducing the cost of active alignment by typically 99% for today's devices, the new micro-robotic technology is driving improvement in production economics from wafer test to final package, and even onward to PCB and tray validation.