Panel VI: Evolving Photonics Integration and Packaging

Thursday, 10 June 12:30 – 14:00

Moderator: Takashi Saida, NTT, Japan

Panel Description:

Continuous growth of data traffic requires wider bandwidth optical interconnects. Considering the signal loss on the PCB, the wider bandwidth optical interfaces need to get closer to the processors using innovative approaches such as on-board optics or in-package optics. This will require the evolution of silicon photonics integration and packaging, and will impact the photonics devices ecosystem. The panel will debate the current reality and the future promise of packaging technology, photonic integration and the associated eco systems.

Speakers:

Thomas Liljeberg, Intel, USA
Presentation Title: Co-packaged Silicon Photonics for Power Efficient, High-density Connectivity

Rebecca K. Schaevitz, Broadcom, USA
Presentation Title: Driving Connectivity in an Era of Uncertainty

Sylvie Menezo, SCINTIL Photonics, France
Presentation Title: Photonic Fully Integrated Circuits Made from InP Bonding at the Back Side of a Silicon Base Wafer

Patrick Lo, Advanced Micro-Foundry, Singapore
Presentation Title: Silicon Photonics Platform in Context of Foundry and Packaging Needs

Anthony J. Yu, Globalfoundries, USA
Presentation Title: GLOBALFOUNDRIES Silicon Photonics:  Enabling the Optical Packaging Roadmap

Biographies:

Thomas Liljeberg, Intel, USA
Presentation Title: Co-packaged Silicon Photonics for Power Efficient, High-density Connectivity

Abstract: Increasing requirements to bandwidth, density, and performance in compute and network applications challenge the current I/O technologies, and drive the need for closer integration of photonics and silicon.  We will review requirements and advances in photonics and packaging technology, and discuss how co-packaged Silicon Photonics addresses these requirements and enables future scalability of network bandwidth and performance.

Thomas Liljeberg is the General Manager, Photonic Integration in the Silicon Photonics Products Division at Intel Corporation, where he is responsible for the technology and product development for integrated and co-packaged photonics.  From 2004 to 2015, he was at Source Photonics serving in various roles in Product Management and R&D management, most recently as Executive VP of Product Line Management.  Prior to Source Photonics, he was with Agility Communications.  Thomas Liljeberg holds a Ph.D. degree in Electrical Engineering from University of California, Santa Barbara, and a MSEE from Technical University of Denmark.
 

Patrick Lo, Advanced Micro-Foundry, Singapore
Presentation Title: Silicon Photonics Platform in Context of Foundry and Packaging Needs

Abstract: Over the last 10 years or so on silicon photonics, we have experienced rapid progress in aspects of its technologies, application exploration and market development. Unlike conventional electronic integrated circuit which has established and standard foundry services, silicon photonics requires high customization due to the complexity of the photonic devices, so is the packaging needs in each unique application and product. This talk will discuss the current status of silicon photonics in terms of integration in density and in functionalities and how future platforms developments are needed to manage the hybrid-material requirement along with opto-electronic packaging to continuously address the advancement of their applications beyond the communication domain.

Patrick Lo Received PhD/ECE from UT/Austin/USA. He was with IDT/USA from 1992 to 2004. He was involved in RD in CMOS manufacturing and integration. From 2004 to 2017, he was with IME in Singapore, where he was the Deputy Executive Director (RD) and Program Director of Nanoelectronics/Photonics, TSV, and Emerging memory. Since 2017, he, as co-founder, has been with Advanced Micro-Foundry/Singapore focusing on Silicon Photonics’ industrialization. He has (co-) authored > 300 journal and conferences, and holds > 50 granted patents. He was a recipient of IEEE GES award (2008), Singapore’s National Technology Award (2008) and President Technology Award (2010).
 

Sylvie Menezo, SCINTIL Photonics, France
Presentation Title: Photonic Fully Integrated Circuits Made from InP Bonding at the Back Side of a Silicon Base Wafer

Abstract: We will present our platform integrating heterogeneous III-V/silicon gain devices at the backside of silicon-on-insulator wafers. The fabrication relies on commercial silicon photonic processes.

Sylvie Menezo is CEO of SCINTIL Photonics, which she cofounded in November 2018, with the objective to exploit Heterogeneous III-V on Silicon Photonics technology developed at CEA-Leti over the past 15 years. Besides CEA-Leti, where she was head of the Silicon Photonics Lab and in charge of Business Development, Sylvie has previously worked at NZAT (Boston), ‘Centre National d’Etude des Télécommunications (Bagneux), Alcatel (Marcoussis) as a development Engineer (design, fab and test of III-V and polymer devices / integrated circuits for optical communications), and at Sercel/CGG (Nantes and Houston), leading multidisciplinary teams for fiber optics sensing developments. She holds an Engineering diploma from INSA Lyon, a Ph.D from CNET Bagneux and an executive MBA from Audencia Nantes.
 

Takashi Saida, NTT, Japan

Takashi Saida is a director at NTT Network Innovation Laboratories, NTT, leading R&D on optical transport technologies. Prior to the current position, he led &D on photonic integration technologies including silicon photonics at NTT Device Innovation Center. He received his B.E. and M.S. and Ph. D. degrees from Tokyo University, Tokyo, Japan. He is a fellow of OSA and a member of IEEE Photonics Society
 

Rebecca K. Schaevitz, Broadcom, USA
Presentation Title: Driving Connectivity in an Era of Uncertainty

Abstract: As businesses shift to a more distributed workforce, connectivity will increasingly play a critical role in success. Current solutions for connectivity rely on artisanal assembly processes that cannot scale efficiently to volume. Migrating to modular, interchangeable silicon-based solutions is the only viable path to scale. However, to do so, other areas also require innovation - specifically the packaging of optics. At Broadcom, we are using silicon photonics and innovative packaging to enable our customers to meet this growing connectivity demand.

Rebecca K. Schaevitz received her doctorate in 2011 at Stanford University focusing on SiGe modulators as part of the UNIC DARPA program. Starting as a principal engineer at Corning, she brought to market active optical cables for Thunderbolt. She then transitioned to product management, focusing on the strategic technology development for hyperscale data centers ranging from the large scale cabling and hardware deployments down to the small scale connectivity for co-packaged optics. At Broadcom, she helps lead the product vision for the silicon photonics technology development as well as contributes as a principal engineer in the connectivity solution.
 

Anthony J. Yu, Globalfoundries, USA
Presentation Title: GLOBALFOUNDRIES Silicon Photonics: Enabling the Optical Packaging Roadmap

Abstract: The growth in data traffic continues to proliferate, with IP traffic within Data Centers projected to triple over the next five years.  Silicon photonics technology is used to process and manage the data traffic growth but also to define new data center architectures. This, in turn, will require advanced packaging techniques that integrate both electronic and photonic features.  The presentation will highlight how the adoption of the microelectronics industry high volume packaging manufacturing processes and best practices has led to the establishment of assembly competencies in areas such as low loss fiber attach and 2.5D integration.

Dr. Anthony J. Yu is Vice President of the Computing and Wired Infrastructure (CWI) Segment Business Unit at Globalfoundries (GF), where he is responsible for providing differentiated photonic manufacturing services and solutions to clients across multiple industries. Prior to being named VP of CWI, Dr. Yu was Vice President of GF’s Aerospace and Defense Business Unit. Before joining GF, he held multiple executive positions at IBM, including Vice President of Semiconductor Technology for Engineering and Technology Services. Yu earned his BS in Physical Chemistry from the University of California-Berkeley and his PhD in Physical Chemistry / Materials Science from Cornell University.