Embedded Optics for High Speed Switching

Thursday, 10 June 14:00 – 15:30

Session Description:

As switch fabric capacities grow, the cost in power and real-estate to connect high-speed interfaces from the chip to the optical interface is rising. The next generation of high speed switches need new a new architecture. On this panel, we will discuss options for embedded optics on switching chips. Perspectives will be delivered from end-users, fabric manufacturers, and innovators in embedded optics.

Moderator:

Scott T. Wilkinson, Cignal AI, USA

Scott Wilkinson has worked in the telecommunications industry for over 25 years, during which he accumulated extensive experience in a variety of technologies working for a series of large and small equipment vendors. As Lead Analyst at Cignal AI, he conducts quantitative and qualitative research on the optical and packet transport hardware market with a focus on carriers and equipment manufacturers.

Panelists:

Brad Booth, Microsoft, USA
Presentation Title: Moving Optics Inside

Mark Nowell, Fellow, CISCO, Canada
Presentation Title: Embedded Optics – Strategic Imperative or Tactical Advantage?

Rebecca Schaevitz, Broadcom, USA
Presentation Title: Integrated Photonics for High Speed Switching Applications

Josef Berger, Marvell Semiconductor, Inc.​, USA
Presentation Title: Technology Enabler for Next Generation Optical and Electrical I/Os

Thomas Liljeberg, Intel, USA
Presentation Title: Path to Silicon Photonics-based Co-packaged Optical I/O for Large Ethernet Switches

Biographies:

Josef Berger, Marvell Semiconductor, Inc.​, USA
Presentation Title: Technology Enabler for Next Generation Optical and Electrical I/Os

Abstract: The next generation of highly integrated switches and AI chips will be processing data at rates of 10s to 100s of Tb/s. The electrical I/O power share of such ASIC’s could be anywhere between 40% to 60% of the overall solution. In this presentation, we will explore the details of the electrical interface to reduce power density and enable integration of a variety of different co-packaged optical and electrical devices. The presentation will also take a deeper look into the end-to-end, power optimized, highly integrated interconnect system solutions.

Josef Berger has more than 20 years of experience in high-speed optics. Mr. Berger is the Associate Vice President Marketing, Optical Interconnect at Marvell, focused on next generation data center interconnect solutions. Prior to joining Marvell,  he was the Chief Commercial Officer at Optical Zonu, an analog fiberoptic systems company, developing wireless solutions for US carriers and government agencies. Prior to that, Mr. Berger was at Source Photonics serving as its Vice President of Global Sales, Marketing and Business Development. Subsequently he was Director of Product Marketing at Opnext, which later merged with Oclaro. He holds a B.S. degree in Engineering Physics from the University of Applied Sciences Munich and a M.S. degree in Physics from San Diego State University. Josef is an alumnus of the Harvard Business School.
 

Brad Booth, Microsoft, USA
Presentation Title: Moving Optics Inside

Abstract: The industry has started to change its focus from optical modules on the faceplate to embedded optics, either through on-board optics or co-packaged optics. This presentation will highlight some of the key benefits that can be gained from this trend and some of the challenges that need to be addressed.

Brad Booth is a distinguished leader in technology development and standardization. He is a Principal Hardware Engineer in Microsoft’s Next Cloud System Architecture Group where he leads the development of next generation optical connectivity solutions for Microsoft’s Cloud and AI datacenters. Previously, Brad has held technology strategist and engineering positions at Dell, Intel and Bell-Northern Research. The holder of over 20 patents related to networking technologies, he has also received awards for his contributions to industry consortia and IEEE 802.3 Ethernet standards.


Thomas Liljeberg, Intel, USA
Presentation Title: Path to Silicon Photonics-based Co-packaged Optical I/O for Large Ethernet Switches
Abstract: Silicon Photonics in the form of co-packaged optical I/O has the promise to address the bandwidth scalability challenges posed the constraints and inefficiencies of copper I/O technology as switch bandwidth increases. In this presentation we will describe the photonics and packaging technologies required to realize the potential of optical I/O, and we will discuss key design and architecture choices to deliver the required performance in volume deployments. 

Thomas Liljeberg is Senior Director in the Silicon Photonics Products Division at Intel Corporation, where he is responsible for the photonic integration and co-packaging programs and products.   From 2004 to 2015, he was at Source Photonics serving in various roles of increasing scope and responsibility in Product Management and R&D, most recently as Executive VP of Product Line Management.  Prior to Source Photonics, Thomas Liljeberg was with Agility Communications from 2000 to 2004.  He holds a Ph.D. degree in Electrical Engineering from University of California, Santa Barbara, and a M.S. from Technical University of Denmark.


Mark Nowell, Fellow, CISCO, Canada
Presentation Title: Embedded Optics – Strategic Imperative or Tactical Advantage?

Abstract: Are embedded optics a way station on the way to co-packaged optics, or will they be a lasting market of their own? Can they approach the power and cost savings that MCM scale integration is expected to deliver? Can they be multi-sourced like faceplate pluggable optics? Are they even necessary in the evolution toward high density optics integration?

Mark Nowell is a Cisco Fellow. His focus is on next generation interconnect technology innovation to meet Cisco's needs. Mark is also active within the industry standards and forums and has chaired multiple IEEE 802.3 Ethernet projects. He represents Cisco on various industry alliances and Consortium.  Mark also chairs a number of industry MSA (Multi-source Agreement) groups focusing on next generation optical module form factors (QSFP-DD, QSFP-DD800) and optical interface signaling technology (100G Lambda MSA).
 

Rebecca Schaevitz, Broadcom, USA
Presentation Title: Integrated Photonics for High Speed Switching Applications
Abstract: The race to build viable, cost and power efficient systems to move, store, and process data in hyperscale cloud architectures requires a step change in design methodology that focuses on tight integration of ASICs, photonics, process and assembly techniques. Additionally, mass deployment of integrated optical networking systems requires a broader understanding of data center requirements such as availability, reliability, serviceability, vendor management and enhanced manufacturing processes. At Broadcom, we are driving that innovation to scale with key core technology that spans every component required to co-package optics with switches thus meeting the next generation of data center requirements.

Rebecca K. Schaevitz received her doctorate in 2011 at Stanford University focusing on SiGe modulators as part of the UNIC DARPA program. Starting as a principal engineer at Corning, she brought to market active optical cables for Thunderbolt. She then transitioned to product management, focusing on the strategic technology development for hyperscale data centers ranging from the large-scale cabling and hardware deployments down to the small-scale connectivity for co-packaged optics. Since joining Broadcom, she helps lead the product vision for the silicon photonics technology development as well as contributes as a principal engineer in the connectivity solution.