• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

AIM Photonics Presents PICs, Heterogeneous Integration, and Packaging for Next-Generation Silicon Ph

Thursday, 28 March, 12:45 – 13:45

Theater II

Session Description
Our experts will provide insight into the future of silicon photonics and demonstrate how AIM Photonics technology offerings across the product development cycle enables prototype development from design through fabrication, assembly, and test.

Organized by: 

 

Panelists

Vignesh Gopal, Dept. of Electrical Engineering, Columbia University, United States

Energy Efficiency Multi Terabit/s Integrated Photonic IO

John Bowers, Co-Director, AIM Photonics; Director of the Institute for Energy Efficiency, University of California, Santa Barbara, United States

Trends in PIC Technology and Perspective on the Future of Silicon Photonics and Electronics

David Harame, Chief Operating Officer, AIM Photonics, United States

PIC Prototype Development Using AIM Photonics Multi-Project Wafer (MPW) and Test, Assembly, and Packaging Capabilities

Michael Zylstra, Director of Photonic Components, Analog Photonics, United States

Design Enablement Using AIM Photonics™ Process Design Kit (PDK) to Create High-Performance Photonic Integrated Circuits