3D-sensing Uses in Consumer and Automotive Markets

Thursday, 10 June 13:30 – 14:30

Session Description:

3-D sensing has many applications in consumer markets (gesture and facial recognition, gaming, AR/VR to note a few) and in automotive markets, specifically for LIDAR and other advanced driver-assistance systems. Recent years have seen initial volume deployments in several of these segments, concurrently driving significant unit volumes for optical components and related hardware. This panel will discuss how these new applications are shaping the optics industry. Is there an ability for technical differentiation or is it mostly about execution and investment capital. Will 3-D sensing provide cost benefits to the core optics business?

Moderator:

Robert Blum, Intel, USA

Robert Blum is General Manager of New Business and Sr. Director of Marketing for Intel’s Silicon Photonics Product Division. Prior to joining Intel, Robert was Director of Strategic Marketing at Oclaro Inc., and held various Director of Product Management and Marketing roles for Oclaro’s telecommunications products and consumer laser portfolio. Before joining Oclaro, Robert was Product Line Manager for optical transmission components at JDS Uniphase Corporation and held various engineering and marketing management roles at Gemfire Corporation, all in California. Robert worked at Deutsche Telekom’s research labs in Darmstadt, Germany, while completing his master’s thesis and holds a doctorate degree in Physics from the University of Technology in Hamburg. He has also studied and done research at Ecole Polytechnique Fédérale in Lausanne, Switzerland, and at Stanford University, California.

Presenters:

Zine Bouhamri, Yole Development, France
Presentation Title: Did 2020 Change the Expectations for 3D Sensing Markets? A 2021 Status Check for Tomorrow’s World

Simon Verghese, Waymo, USA
Presentation Title: To be determined

Ralf Muenster, SiLC Technologies, USA
Presentation Title: Advancing Machine Vision with Industry’s First Fully Integrated FMCW Imaging Chip

Sanjai Parthasarathi, II-VI Incorporated, USA
Presentation Title: Photonics Innovations Enabling High Volume Applications of 3D Sensing in Consumer Electronics and Automotive Markets

Jay Skidmore, Lumentum, USA
Presentation Title: To be determined

Biographies:

Zine Bouhamri, Yole Development, France
Presentation Title: Did 2020 Change the Expectations for 3D Sensing Markets? A 2021 Status Check for Tomorrow’s World

Zine is managing the expansion of the technical expertise and the market know-how of the company in imaging and display activities. In addition, he actively assists and supports the development of dedicated imaging and display collection of market & technology reports and monitors as well as custom consulting projects. Prior to Yole, Zine oversaw numerous R&D programs at Aledia. During more than three years, he developed strong technical expertise as well as a detailed understanding of the display industry. He is author and co-author of several papers and patents. Zine Bouhamri holds an Electronics Engineering Degree from the National Polytechnic Institute of Grenoble (FR), one from the Politecnico di Torino (IT), and a Ph.D. in RF & Optoelectronics from Grenoble University (FR).
 

Ralf Muenster, SiLC Technologies, USA
Presentation Title: Advancing Machine Vision with Industry’s First Fully Integrated FMCW Imaging Chip

Ralf J. Muenster is SiLC’s vice president of business development and marketing. He has over two decades of experience commercializing and growing differentiated high-tech businesses and expanding customer and partnership engagements. Prior to SiLC, Muenster was the director of Texas Instruments’ CTO office where he was responsible for identifying and developing impactful new growth vectors and strategic technology partnerships for the company. Muenster has held various executive roles in the semiconductor industry, including serving as an intrapreneur and business executive at National Semiconductor, Micrel and AMD, where he was head of the automotive market segment. Muenster founded a successful computer start-up company in Germany and was a scientist at the University of California at Berkeley performing research in the photonics field. He holds a master’s degree in physics from the Technical University in Munich. Muenster has authored a long list of publications and is frequently invited to speak at leading industry forums. Muenster is a multiple U.S. patent holder.
 

Sanjai Parthasarathi, II-VI Incorporated, USA
Presentation Title: Photonics Innovations Enabling High Volume Applications of 3D Sensing in Consumer Electronics and Automotive Markets

Sanjai Parthasarathi joined II-VI in 2013 and has been the Chief Marketing Officer since 2019. Previously, Dr. Parthasarathi was Vice President, Product Marketing and Strategy, for II-VI Photonics since 2015. Prior to II-VI, he served as Senior Director, Product Line Management, at Oclaro. With over 28 years of broad management and technical experience, Dr. Parthasarathi has held a variety of progressive roles in R&D, manufacturing, product line management, and marketing, including senior business and technical management positions at Avanex Corporation, Oplink Communications, TeraStor, Western Digital, and Concurrent Technologies Corporation. Dr. Parthasarathi graduated from the Indian Institute of Technology, Madras, with a B.S. degree in Mechanical Engineering, and holds an M.S. in Mechanical and Aerospace Engineering from the University of Virginia and a Ph.D. in Engineering Science from the Pennsylvania State University.
 

Jay Skidmore, Lumentum, USA
​Presentation Title: To be determined

Jay Skidmore is VP of 3D Sensing R&D team at Lumentum.  He received his PhD in Electrical Engineering at UCSB under Dr. Larry Coldren, fabricating GaAs/AlGaAs semiconductor lasers.  Afterwards, he worked at Lawrence Livermore National Laboratory developing high-power diode arrays for various solid-state crystal hosts.  In 2000, he joined SDL (acquired by JDSU/Lumentum) where he developed uncooled 980nm pumps. He has held several positions, managing world-wide teams in both R&D and reliability. His team produced leading-edge 980nm and Raman fiber-coupled pumps for Telecom (Terrestrial and Submarine deployment) and industrial high-brightness spatial-multiplexed fiber-coupled packages for pumping kW-class fiber lasers.  Several years ago, he established VCSEL array and Edge Emitter (e.g., DFB) illuminators for the 3D sensing consumer marketplace.  He holds ~ 25 patents and contributed many book and journal publications in the field of high-power semiconductor lasers and packaging.
 

Simon Verghese, Waymo, USA
Presentation Title: To be determined

Biography to come.