MRSI Systems

About Us

MRSI Systems, Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer complete solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective assembly solutions for all packaging applications including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit


Product Showcase

MRSI-705 Die Bonder
MRSI-H Series Die Bonder
MRSI-M3 Die Bonder
MRSI-S-HVM Die Bonder




Mailing Address
554 Clark Rd
Tewksbury, Massachusetts 01876-1631, USA

Limin Zhou
Senior Director, Strategic Marketing

Rajiv Pandey
Senior Product Manager
(978) 495-9415