The IBM Assembly and Test plant in Bromont transforms the most advanced semiconductors in the world into industry-leading microelectronic components. These components are then used in the whole IBM system portfolio, as well as in many products from our major original equipment manufacturers(OEMs) customers. The plant is one of the largest flip-chip assembly and testing facility in North America and is committed to the protection of the environment and quality of life. The highly qualified personnel at Bromont is renowned for its skills, know-how, expertise, and commitment to customer satisfaction in a competitive and very dynamic market that the plant has remained leader. In our daily lives, the use of the Internet and various applications would not be what it is today without the assembly methods developed by IBM, and IBM continue to always pushes the technology boundaries and redefining the limits for co-packaging integration. The plant is specialized in high volume, high-mix and high-complexity packaging optimized to deliver differentiation and performance; supporting semiconductor fabless, integrated device manufacturers(IDMs), as well as original equipment manufacturers(OEMs). IBM Bromont is a corporate leader founded on the quality of its employees and its technical leadership facilitating fast turnaround-time from development to production.
Press Releases/Promotional Materials