Sunday, 24 March,
16:00
–
18:30
Room 2
Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption. It fosters the creation of new optical products that serve new applications with more demanding performance requirements. In this session, we explore how well (and when) the various approaches to heterogeneous integration will meet these challenging needs., and the status and challenges for the service providers (e.g., type of integration platforms, process/tools maturity, and how to handle non-traditional Si materials).
Organizers
Lukas Chrostowski, University of British Columbia, Canada
Patrick Lo, Advanced Micro Foundry, Singapore
Dan Pitt, Palo Alto Innovation Advisors, United States
Mengjie Yu, University of Southern California, United States
Speakers
Wim Bogaerts, Ghent University, Belgium
Alex Chikhaoui, X-Celeprint, Ireland
Ivan Huang, Avicena Tech, United States
Michael Lebby, Lightwave Logic, United States
Sylvie Menezo, Scintil, France
Edward Preisler, Tower Semiconductor, United States
Mian Zhang, Hyperlight, United States