The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Which One Will Succeed in Data Center Applications, Multi-chip or Monolithic Integrated Optoelectronic Chip?

Sunday, March 3, 2019
4:00 PM - 6:30 PM

Room number: 6E


Dominic Goodwill, Huawei Technologies R&D, Canada; Yasuhiro Matsui, Finisar Corp., USA; James (Zhou) Zhiping, Peking University, China


Coherent DSP chips will soon be able to process 100-Gbaud signals. Switch ASICs capacity is scaling to tens of Terabit with a channel rate >100 Gb/s. Proximity integration of DSP/ASIC chips and optical chips are highly demanded in these high-speed and high-capacity applications. On-board optics and optics in packaging with ICs are expected to address this challenge. Silicon photonic technology allows monolithic integration of analog/digital ICs with photonic circuits. However, 2.5D and 3D integration approach based on multiple chips or separate IC and PICs is another feasible technique. This workshop will emphasize on how to integrate photonic chips with electronic ICs for very high baud rate and large capacity. Pros and cons for monolithic or multi-chip integration approaches will be discussed. Advanced packaging techniques such as optics in packaging and on-board optics will be also focused.


Peter De Dobbelaere, Luxtera, USA
Chris Doerr, Acacia Communications, USA
Frank Flens, Finisar, USA
Kazuhiko Kurata, AIO Core Co. Ltd., Japan
Karl Muth, Rockley Photonics, USA
Vladimir Stojanovic, University of California Berkeley, USA
Lars Zimmermann, IHP, Germany

Sponsored by: