Which Device Technologies Will Get Us Beyond 400G?

Sunday, 06 June 17:00 – 19:30


Theodor Kupfer, Cisco Systems, USA
Hai-Feng Liu, HG Genuine, China
Reza Motaghian, Amazon, USA


The exponential growth of data center traffic continues to push for higher interconnection data rates to reduce the cost/bit and energy/bit.  Today, 400GBASE-DR4/FR4 and 400-ZR pluggable optical modules have already begun their deployment in intra and inter data center networks. As the next development target, 800 GbE and 1.6 TbE are under serious consideration, for which a number of optical technologies have been investigated as the potential candidates. 

This workshop will discuss different optical device technologies that can be the potential candidates for 200Gbps/lane in parallel and WDM short reach 800G IMDD systems and single carrier 600-800G coherent systems, which include, but not limited to, high speed EML and DML/DMT, high speed modulators based on SiPh, InP, thin film LiNbO3, and plasmonic, etc.  In addition, it will also look into the pros and cons of co-packaged optics using different architectures and optical technologies in comparison with pluggable optics and debate co-packaged optics deployment timelines and volume as well as potential platform interoperability challenges.

The workshop aims to provide a forum for speakers and audience to discuss and compare the achievable performance by different device technologies and technical challenges ahead as the potential solutions for both post 400G IMDD and coherent systems in terms of cost/form factor/power consumption/thermal stability/interoperability relative to current 400G products.

This workshop is organized into two sessions. After each session, there will be ten minutes of interactive, audience Q&A and discussion. 


Session One Speakers

Andy Bechtolsheim, Arista Networks, USA
Perspectives on 800G Systems

Hong Liu, Google, USA
200G Per Lane For 800G And Beyond

Dave Plant, McGill University, Canada
Silicon Photonic Modulators for High Speed Data Center Interconnects

Yasuhiro Matsui, II-VI, USA
Isolator-Free Low-Chirp DML for > 200Gb Applications

Xinlun Cai, Univ. Sun Yat-sen, China
200G PAM4 Based on Thin Film Lithium Niobate Modulators

Shigehisa Tanaka, Lumentum, Japan
EA-DFB and DML Technologies For Post 400gbe Applications

Ken Jackson, Sumitomo, USA
Lasers and Detectors For 100Gbd IM-DD Optical Interconnect Applications


Session Two Speakers

Ashkan Seyedi, Nvidia, USA
Co-packaged silicon photonics links for 1Tbps per fiber and beyond

Georg Roell, Ranovus, Canada
51.2T/100T Switch/Co-Packed Optics and SIP Solution Beyond 400G

Yoshihiro Ogiso, NTT, Japan
InP MZ/IQ Modulator Beyond 130Gbaud

Winston Way, NeoPhotonics, USA
800G Coherent Solutions

Shogo Yamanaka, NTT, Japan
SiPh Coherent Optical Subassembly Beyond 100 Gbaud

Michael Hockberg, Elenion/Nokia, USA
Silicon Photonics Beyond 400G for Intra-datacenter to Intercontinental Reaches

Radha Nagarajan, Inphi, USA
800G Options for Inter and Intra Data Center Applications