The Optical Networking and Communication
Conference & Exhibition

A Virtual Conference - Pacific Daylight Time (UTC-07:00)

Which Device Technologies Will Get Us Beyond 400G?

Sunday, June 6, 2021
5:00 PM - 7:30 PM


Theodor Kupfer, Cisco Systems, USA
Hai-Feng Liu, HG Genuine, China
Reza Motaghian, Amazon, USA


The exponential growth of data center traffic continues to push for higher interconnection data rates to reduce the cost/bit and energy/bit.  Today, 400GBASE-DR4/FR4 and 400-ZR pluggable optical modules have already begun their deployment in intra and inter data center networks. As the next development target, 800 GbE and 1.6 TbE are under serious consideration, for which a number of optical technologies have been investigated as the potential candidates. 

This workshop will discuss different optical device technologies that can be the potential candidates for 200Gbps/lane in parallel and WDM short reach 800G IMDD systems and single carrier 600-800G coherent systems, which include, but not limited to, high speed EML and DML/DMT, high speed modulators based on SiPh, InP, thin film LiNbO3, and plasmonic, etc.  In addition, it will also look into the pros and cons of co-packaged optics using different architectures and optical technologies in comparison with pluggable optics and debate co-packaged optics deployment timelines and volume as well as potential platform interoperability challenges.

The workshop aims to provide a forum for speakers and audience to discuss and compare the achievable performance by different device technologies and technical challenges ahead as the potential solutions for both post 400G IMDD and coherent systems in terms of cost/form factor/power consumption/thermal stability/interoperability relative to current 400G products.


Andy Bechtolsheim, Arista Networks, USA
Talk Title: Perspectives on 800G Systems

Xinlun Cai, Univ. Sun Yat-sen, China
Talk Title: 200G PAM4 Based on Thin Film Lithium Niobate Modulators

Michael Hockberg, Elenion/Nokia, USA
Talk Title: Silicon Photonics Beyond 400G for Intra-datacenter to Intercontinental Reaches

Hong Liu, Google, USA
Talk Title: 200G Per Lane For 800G And Beyond

Ken Jackson, Sumitomo, USA
Talk Title: Lasers and Detectors For 100Gbd IM-DD Optical Interconnect Applications

Yasuhiro Matsui, II-VI, USA
Talk Title: Isolator-Free Low-Chirp DML for > 200Gb Applications

Radha Nagarajan, Inphi, USA
Talk Title: 800G Options for Inter and Intra Data Center Applications

Yoshihiro Ogiso, NTT, Japan
Talk Title: InP MZ/IQ Modulator Beyond 130Gbaud

Dave Plant, Uni. McGill, Canada
Talk Title: Silicon Photonic Modulators for High Speed Data Center Interconnects

Georg Roell, Ranovus, Canada
Talk Title: 51.2T/100T Switch/Co-Packed Optics and SIP Solution Beyond 400G

Ashkan Seyedi, HPE, USA
Talk Title: 800G For Pluggable and 1.2T and 3.2T Co-Packaged Silicon Photonics

Shigehisa Tanaka, Lumentum, Japan
Talk Title: EA-DFB and DML Technologies For Post 400gbe Applications

Winston Way, NeoPhotonics, USA
Talk Title: A Cost-Effective Intra-Data Center 800G Coherent Transceiver Solution

Shogo Yamanaka, NTT, Japan
Talk Title: SiPh Coherent Optical Subassembly Beyond 100 Gbaud

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