• Technical Conference:  05 – 09 March 2023
  • Exhibition: 07 – 09 March 2023
  • San Diego Convention Center, San Diego, California, USA

Is Paradigm Shift from Pluggable Optics to Co-packaged Optics Inevitable in the Next Generation of Datacenters?

Sunday, 06 March 13:00 – 15:30


Andreas Matiss, Corning Inc., USA
Reza Motaghian, Amazon Web Services, USA
Hideyuki Nasu, Furukawa Electric, Japan
Hanxing Shi, Juniper Networks, USA
Mike Tan, Hewlett Packard Enterprise, USA


Co-packaged optics (CPO) has been introduced as a promising technology to fulfill power consumption and bandwidth density requirements in the next generation of datacenters ecosystem. However, there is a need for an industry wide strategic roadmap to identify key limitations and challenges of both CPO and pluggable optics technologies and potentially define transition point and adoption rate from pluggable optics to CPO. In addition, different requirements need to be met to deliver a reliable, cost effective, and competitive solution for different platforms including HPCs and AI Clusters over a particular time horizon.

This workshop debates several controversial ideas to visualize the future directions by focusing on the key topics including a) coexistence of both technologies vs ultimate life time of pluggable optics, b) CPO realization difficulties vs innovative ultra-high speed pluggable optics challenges, c) industry readiness, concerns, applications, and adoption rate through this paradigm shift, d) cost trajectories, e) optical technologies (IMDD/coherent, parallel fiber/WDM, etc.), f) advanced light source development and integration, g) BW requirements for different future topologies/architectures relying on disaggregated compute and storage, and h) standardization. Different aspects of both solutions including high speed electrical interfaces, packaging, signal integrity, system integration, form factors, thermal managements, reliability, redundancy/serviceability, test/diagnosis, scalability are also discussed as important factors in this workshop.


Brad Booth, Microsoft, USA
Transition Drivers for Photonic Integration

Loi Nguyen, Marvell, USA
2.5D/3D Silicon Photonics Enables High Density Pluggable and Co-packaged Optics

Jiashu Chen, II-VI Incorporated, USA
The Synergy Between CPO and Pluggable: A Development Perspective

Matt Traverso, Cisco, USA
Perspectives on Co-packaged Optics

Ted Schmidt, Lumentum, USA
Disaggregating Lasers - Why, Where and When?

Rebecca Schaevitz, Broadcom, USA
Scaling into the Next Decade: Highly Integrated Silicon as the Building Block of the Future

Scott Schube, Intel, USA
Silicon Photonics for Co-packaged Optics and High Speed Optical I/O

Hamid Arabzadeh, Ranovus, Canada
Connecting the End Points: CPO vs. Pluggable

Erik Norberg, Juniper, USA
Silicon Photonics with Integrated Laser -  Enabling the Paradigm Shift from Pluggable Optics to CPO in Datacenters

Henning Lysdal, Nvidia, Denmark
CPO is Inevitable - But Not Like You Might Think