Sunday, 30 March,
16:00
–
18:30
Rooms 203-204 (Level 2)
This workshop focuses on the critical obstacles the industry must overcome to transition Co-Packaged Optics (CPO) from emerging technology to scalable, volume manufacturing. Attendees will engage in in-depth discussions on how to address key bottlenecks and mitigate risks along the CPO supply chain, from foundries to field deployment.
Topics include designing for manufacturability and Assembly Design Kits (ADKs), advanced semiconductor packaging challenges such as increasing fiber count at increasingly smaller pitches, interposers and through-silicon vias (TSVs), and effective thermal management at both the package and system levels.
We will also explore the reliability and safety of high-power external lasers, operational risks associated with embedded lasers, and the importance of well-defined interfaces and roles among ASIC manufacturers, OSATs, and contract manufacturers, to create a future manufacturable ecosystem for CPO.
Organizers
Yoojin Ban (Lead), IMEC, Belgium
Juthika Basak, Advanced Micro Devices, United States
Takako Hirokawa, GlobalFoundries, United States
Sudip Shekhar, Univ. of British Columbia, Canada
Antonio Tartaglia, Ericsson, Italy
Speakers
Giorgio Cazzaniga, JABIL, Italy
Tom Gray, NVIDIA, United States
Robert Lee, Corning, United States
Hiroyuki Mieno, AGC, Japan
Akihiro Noriki, AIST, Japan
Bardia Pezeshki, AVICENA, United States
Nicholas Psaila, INTEL, United Kingdom
Anand Ramaswamy, Broadcom, United States
Sander Roosendaal, SYNOPSYS, Netherlands
Pooya Tadayon, Ayar Labs, United States
Matt Traverso, Marvell, United States