The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Electro-optical Integration in a Package. What Technologies and Business Models can Make it Happen?

Sunday, March 11, 2018
4:00 PM - 6:30 PM

Event type: Workshop

Room number: 6D

Organizer:

Chris Cole, Finisar Corp., USA; Marco Fiorentino, Hewlett Packard Labs, USA; Bert Offrein, IBM Research GmbH, Switzerland; Samuel Palermo, Texas A&M Univ., USA



Description:
Integration of optics with switch silicon in a package has been identified as an architectural solution to the problem of rising SerDes power to drive PCB copper channel to pluggable or on-board optics. The integration also promises to reduce packaging assembly overhead and cost. However a multitude of technical and business challenges have kept package level integration from widespread commercial use. 

Some of the technical challenges are:
  • ASIC I/O architecture
  • Electrical and optical modulation type and rate
  • Laser type and location
  • Parallel and WDM optics partitioning
  • Optics material systems
  • Package and substrate material systems
  • Thermal management
  • Fiber assembly and routing
  • Assembly yield and FIT
 Some of the business challenges are:
  • Who does the design
  • Who does the manufacture and assembly
  • Role of traditional transceiver companies
  • Liability for and servicing of the final assembly
  • Scalability with deployment
  • Design and modelling tools
The workshop will be divided into two panels with broad range of speakers presenting their views on the challenges and solutions. Each presentation will be followed by audience Q&A.
 

Speakers:

Systems and Integration Panelists:
Alan Benner, IBM
Ashok Krishnamoorthy, Axalume
Nick Kucharewski, Rockley Photonics
Brian Taylor, Facebook
 
Devices and Technology Panelists:
Ramakanath Alapati, Amkor
Ted Letavic, GlobalFoundries
Mike Li, Intel
Yu Tanaka, Fujitsu, PETRA
 



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