Are We On the Right Track to Bring Co-packaged Optics To Its Prime Time?

Sunday, 06 June 13:00 – 15:30

Organizer:

Xin Chen, Corning Incorporated, USA
Zhensheng Jia, CableLabs, USA
Di Liang, Hewlett Packard Enterprise, USA

Description:

It is widely anticipated that next-gen 51.2 Tb/s switch ASIC will need co-packaged optics (CPO) to tackle the looming challenges in power consumption and bandwidth density. CPO is also promising to flatten current multi-layer switching architecture through a high-radix switch, and enable a large-volume application of fiber to the server (FTTS). This workshop is to stimulate extensive discussions on necessity and challenges to partially/completely replace pluggable solution, and to explore current CPO technology readiness and its future development direction in datacenters and beyond. The workshop will be debating and answering the following three topics:

Topic 1) Is CPO a nice-to-have or must-have solution within 3 years? Data center operators and system vendors will discuss their most concerned issues, and the potential applications (e.g., FTTS) CPO can enable or enhance?

Topic 2) What are the most recent technology breakthroughs in chip-level building blocks, e.g., SEDES, lasers, VCSEL vs. SiPh, parallel/WDM, DD/coherent, and PICs?

Topic 3) What are the progresses in system integration, including packaging, thermal management, optical connectivity, system-level testing and diagnosis, redundancy and serviceability, scalability, signal and power distribution co-design of optical integration with switch/DSP/logic ASIC, and relevant standard development?

Speakers:

Topic One

Andreas Bechtolsheim, Arista Networks, USA
Challenges and Opportunities with Co-packaged Optics

Mark Filer, Microsoft, USA
Opportunities for Co-packaging in Future Microsoft Datacenters

Manish Mehta, Broadcom, USA
Co-packaged Optics for Ultra-high Bandwidth Compute and Switching Applications

 

Topic Two

Joris Van Campenhout, IMEC, Belgium
Silicon Photonics Building Blocks for Co-Packaged Optics at 1Tbps/mm and Beyond

Mark Wade, Ayar Labs, USA
Optical I/O Solutions for Next-Generation Communications Fabrics

Vipul Bhatt, II-VI Incorporated, USA
Transceiver Implementation Perspective on Co-packaged Optics

Aaron Zikie, Rockley Photonics, USA
High Density Silicon Photonics for Co-packaged Optics

Gordon Keeler, DARPA, USA
The DARPA PIPES and LUMOS Programs

 

Topic Three

Darrell Childers, USConec, USA
Optical Connector Technology Tradeoffs for Co-Packaged Optics

Lars Brusberg, Corning Incorporated, USA
Optical Connectivity for Co-packaged Optics

Long Chen, Cisco, USA
Status of Optoelectronics Multi-chip Modules in Acacia

Peter De Dobbelaere, Cisco, USA
Silicon Photonics, the Ideal Technology Platform for Co-packaged Optics Applications

David Hui, Intel, USA
Co-Packaged Optical Switch Integration Learnings