Madeleine Glick, Columbia University, USA; Trey Greer, NVIDIA, USA; Hai-Feng Liu, HG Genuine, China
There are many emerging technologies addressing femtojoule per bit optical components (lasers, modulators, receivers, …) and low power electronic links (serdes, 2.5D integration, ...). It is now time to look at the landscape to determine how to integrate these advances into practical link applications for intra data center interconnects for near term deployment. This integration will involve examining architectures and will include choices on optical and electrical components, cooling, and optical and electrical connectorization.
This symposium will address the above trade-offs, including but not limited to the following topics:
- How do we / can we combine femtojoule per pit technologies into sub pJ/bit links ?
- Is water cooling required? Do the benefits outweigh the added complexity and risks?
- How do we achieve the necessary bandwidth density to support 100 Tb/s switches?
- Does meeting these power and density goals require 2.5 D integration (interposers/ silicon bridges)?
- What is the optimum data rate / channel to achieve these power and density goals?
- What is the appropriate light source technology to achieve the required wavelength count and spacing for a near term solution?
Bill Dally, NVIDIA, USA
Keren Bergman, Columbia University, USA
Ashish Raniwala, Microsoft, USA
Mark Wade, Ayar Labs, USA
Lars Brusberg, Corning, USA
Gordon Keeler, DARPA, USA
Sylvie Menezo, SCINTIL Photonics, France
Peter O'Brien, Tyndall National Inst., Ireland