SC450 - Design, Manufacturing, and Packaging of Opto-Electronic Modules
Sunday, 11 March
13:30 - 17:30
Short Course Level: Advanced Beginner
Instructor: Sylwester Latkowski 1, Arne Leinse2, Twan Korthorst3, Peter O'Brien4; 1Eindhoven University of Technology, Netherlands; 3LioniX International, Netherlands, Netherlands, 3PhoeniX Software, Netherlands, 4Tyndall National Institute
Short Course Description:
Integrated optical modules combine advanced semiconductor technologies, optical and electronic chips, motherboards, micro-optics and heat-management to meet demanding sub-systems specifications. The assembly, packaging and testing of such modules requires increasingly sophisticated methods to ensure product meets specification. This short course will provide an insight into the packaging and testing specific to such integrated optical modules.
Integrated circuits will be considered for a range of platform technologies by using the building block approach for open access generic foundries. A particular focus will be placed on scalability, addressing optical, electrical, mechanical, and thermal module connections. In an optimized design, these aspects become intricately interdependent, impacting chip layout, assembly methods and test protocols.
Packaging methods include the attachment of fiber- and micro-optics, mechanical positioning, wire and die bonding, assembly to motherboards, the insertion into housings, encapsulation and sealing. Techniques from hand-crafted assembly through to increasingly automated process flows will be reviewed. The course will provide an insight into the methods and interdependencies.
Test methods are instrumental in both qualifying modules and centering processes to enhance yield and performance. Methods for both custom product development and also generic foundries methodologies will be compared and contrasted. A structured separation of wafer validation, assembly and product qualification will be presented, ensuring relevance to a broad range of application specific PIC-enabled products.
Short Course Benefits:
This course will enable you to:
Identify the distinctive features of packaging and testing for optical integrated modules when compared with discrete optical products and integrated electrical systems.
Identify the different stages of testing, including the building block methodology used in open-access foundry services.
Determine the origin of impairments using common measurement methods and describe how test methods can be used to push the yield-performance envelope
Recognize common assembly techniques and their impact on chip and multi-chip-module layout and test requirements.
Determine the motivations for using package and assembly techniques from gold box to glob-top, hermetic to non-hermetic, cooled to uncooled.
Short Course Audience:
Course participants will likely already be engaged in either optoelectronic product development, optical systems engineering or photonics research. The course should be of relevance to both systems integrators who are considering the deployment of integrated optical modules and technologists developing integrated optical circuits who are keen to improve their understanding of product specification and evaluation.
A Bachelor or Master level physics or engineering education would provide a solid basis for course participation and a background in semiconductor electronics, optoelectronics and optics will be advantageous. This is the first edition of this highly interdisciplinary course.
Sylwester Latkowski obtained M.Sc. and Eng. degrees in optoelectronics and technical physics from West Pomeranian University of Technology in Szczecin, Poland. His research in the Centre for High Speed Devices and Systems in the RINCE Institute, Dublin City University, Ireland concerned with mode-locked semiconductor lasers and led to the award of a Ph.D. degree. He followed up his interests in Photonic Integration group at Eindhoven University of Technology (TU/e), the Netherlands with a main focus on development of photonic integration technologies and on-chip laser systems for sensing applications. Currently he is with Photonic Integration Technology Center at TU/e with responsibilities covering standardization and automation of test and packaging of photonic integrated circuits.
Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer.
Twan Korthorst is since more than 20 years active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies. During the final stage of his studies in Electrical Engineering at the University of Twente in the Netherlands, he co-founded the Microflown Team, developing world's first particle velocity microphone. In 1996 he started as Product Engineer at Twente Microproducts (TMP). After the acquisition of TMP by Kymata, a Scottish-based communications solutions provider using integrated photonics in 2000, he occupied the post of Director Operations at Kymata Netherlands (later Alcatel Optronics Netherlands). Having been a Manager of Operations at DEMCON Advanced Mechatronics, Twan joined PhoeniX Software in August 2007. As CEO of the leading supplier of Photonic IC design solutions, he is instrumental in advocating about photonic integration technologies and bringing parties together to accelerate the development of design flows and manufacturing supply chains.
Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre.